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1. 发明公开

US20230337407A1 CONDUCTIVE POLYMERIC LAYERS FOR CHARGE DISSIPATION 审中-公开
公开(公告)号：US20230337407A1
公开(公告)日：2023-10-19
申请号：US18131208
申请日：2023-04-05
申请人： ENTEGRIS, INC.
发明人： Yuxuan Liu , Zhifeng Li , Carlo Waldfried , Yan Liu , Chandra Venkatraman , Pushkara Rao Varanasi
IPC分类号： H05K9/00 , H01L21/683
CPC分类号： H05K9/0079 , H01L21/6833
摘要： A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

2. 发明申请

US20230097687A1 ADDITIVE MANUFACTURED ARTICLES HAVING COATED SURFACES AND RELATED METHODS 有权
公开(公告)号：US20230097687A1
公开(公告)日：2023-03-30
申请号：US17950941
申请日：2022-09-22
申请人： ENTEGRIS, INC.
发明人： Carlo Waldfried
IPC分类号： B29C64/30 , C23C16/455 , C23C16/40
摘要： Some embodiments relate to additive manufactured articles having coated surfaces and related methods. The methods may comprise forming a three-dimensional (3D) article by additive manufacturing to obtain an additive manufactured 3D article having a monolithic structure that is not capable of construction by machining, and exposing the additive manufactured 3D article to one or more precursor gases to form a coating layer on a surface of the additive manufactured 3D article. The additive manufactured articles may comprise an additive manufactured three-dimensional (3D) body. The additive manufactured 3D body may have a monolithic structure that is not capable of construction by machining. The additive manufactured 3D body may have a coating layer on a surface of the additive manufactured 3D body.

3. 发明申请

US20220316056A1 CHEMICAL RESISTANT MULTI-LAYER COATINGS APPLIED BY ATOMIC LAYER DEPOSITION 有权
公开(公告)号：US20220316056A1
公开(公告)日：2022-10-06
申请号：US17840367
申请日：2022-06-14
申请人： ENTEGRIS, INC.
发明人： I-Kuan Lin , Carlo Waldfried , Chandra Venkatraman
IPC分类号： C23C16/40 , C23C16/455 , C23C16/44
摘要： Described are multi-layer coatings, substrates (i.e., articles) coated with a multi-layer coating, and methods of preparing a multi-layer coating by atomic layer deposition, wherein the coating includes layers alumina and yttria.

4. 发明申请

US20220298639A1 SUBSTRATE WITH FLUORINATED YTTRIUM COATINGS, AND METHODS OF PREPARING AND USING THE SUBSTRATES 有权
公开(公告)号：US20220298639A1
公开(公告)日：2022-09-22
申请号：US17696101
申请日：2022-03-16
申请人： ENTEGRIS, INC.
发明人： Nilesh Gunda , Jayasri Narayanamoorthy , Carlo Waldfried
IPC分类号： C23C16/455 , C23C16/40 , C23C14/08 , H01L21/02 , C23C16/56
摘要： Described are substrates that include high aspect ratio surfaces and non-high aspect ratio surfaces, at least two coatings, one coating at high aspect ratio surfaces and a second coating at non-high aspect ratio surfaces, and having fluorinated outer surfaces; methods of preparing these coatings; and substrates, surfaces, equipment, and components of equipment that include the coatings.

5. 发明申请

US20160336210A1 Electrostatic Chuck and Method of Making Same 审中-公开
标题翻译：静电卡盘及其制作方法
公开(公告)号：US20160336210A1
公开(公告)日：2016-11-17
申请号：US15111591
申请日：2015-02-06
申请人： ENTEGRIS, INC.
发明人： Richard A. Cooke , Wolfram Neff , Carlo Waldfried , Jakub Rybczynski , Michael Hanagan , Wade Krull
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/6833 , H01L21/67248 , H01L21/6831
摘要： An electrostatic chuck includes a ceramic structural element, at least one electrode disposed on the ceramic structural element, and a surface dielectric layer disposed over the at least one electrode, the surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface dielectric layer comprises: (i) an insulator layer of amorphous alumina, of a thickness of less than about 5 microns, disposed over the at least one electrode; and (ii) a stack of dielectric layers disposed over the insulator layer. The stack of dielectric layers includes: (a) at least one dielectric layer including aluminum oxynitride; and (b) at least one dielectric layer including at least one of silicon oxide and silicon oxynitride.
摘要翻译：静电卡盘包括陶瓷结构元件，设置在陶瓷结构元件上的至少一个电极和设置在至少一个电极上的表面电介质层，该表面层由电极中的电压激活以形成静电电荷将基板夹紧到静电卡盘。所述表面介电层包括：（i）厚度小于约5微米的无定形氧化铝绝缘体层，设置在所述至少一个电极上; 和（ii）设置在绝缘体层之上的一叠电介质层。电介质层的叠层包括：（a）至少一个介电层，包括氮氧化铝; 和（b）至少一个包括氧化硅和氮氧化硅中的至少一种的电介质层。

6. 发明授权

US12031212B2 Yttrium fluoride films and methods of preparing and using yttrium fluoride films 有权
公开(公告)号：US12031212B2
公开(公告)日：2024-07-09
申请号：US17230742
申请日：2021-04-14
申请人： ENTEGRIS, INC.
发明人： Carlo Waldfried , Stephen Longo , Parul Tyagi
IPC分类号： C23C16/56 , C23C16/02 , C23C16/40 , C23C16/44 , C23C16/455 , H01L21/02
CPC分类号： C23C16/56 , C23C16/0272 , C23C16/405 , C23C16/4404 , C23C16/45525 , H01L21/02 , Y10T428/265 , Y10T428/31678
摘要： Described are yttrium fluoride compositions, including deposited films, e.g., coatings, that contain yttrium fluoride; methods of preparing yttrium fluoride compositions and deposited film coatings that contain yttrium fluoride; as well as substrates that have a deposited film coating that contains yttrium fluoride at a surface and methods and equipment that include the substrates.

7. 发明授权

US10882774B2 Coatings for glass-shaping molds and molds comprising the same 有权
公开(公告)号：US10882774B2
公开(公告)日：2021-01-05
申请号：US16137730
申请日：2018-09-21
申请人： Entegris, Inc.
发明人： Troy Scoggins , Rex Gerald Sheppard , Carlo Waldfried
IPC分类号： C03B11/08 , C23C16/455 , C23C16/40 , C23C28/04 , C23C28/00 , C03B40/00
摘要： Described are glass-forming molds made of a graphite mold body and a coating formed by atomic layer deposition, with the coating being made of alumina or a combination of alumina and yttria.

8. 发明授权

US10770330B2 Wafer contact surface protrusion profile with improved particle performance 有权
公开(公告)号：US10770330B2
公开(公告)日：2020-09-08
申请号：US16073648
申请日：2017-02-02
申请人： ENTEGRIS, Inc.
发明人： John Michael Glasko , I-Kuan Lin , Carlo Waldfried
IPC分类号： H01L21/683
摘要： An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.

9. 发明授权

US10497598B2 Electrostatic chuck and method of making same 有权
公开(公告)号：US10497598B2
公开(公告)日：2019-12-03
申请号：US15111591
申请日：2015-02-06
申请人： Entegris, Inc.
发明人： Richard A. Cooke , Wolfram Neff , Carlo Waldfried , Jakub Rybczynski , Michael Hanagan , Wade Krull
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/6833 , H01L21/67248 , H01L21/6831
摘要： An electrostatic chuck includes a ceramic structural element, at least one electrode disposed on the ceramic structural element, and a surface dielectric layer disposed over the at least one electrode, the surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface dielectric layer comprises: (i) an insulator layer of amorphous alumina, of a thickness of less than about 5 microns, disposed over the at least one electrode; and (ii) a stack of dielectric layers disposed over the insulator layer. The stack of dielectric layers includes: (a) at least one dielectric layer including aluminum oxynitride; and (b) at least one dielectric layer including at least one of silicon oxide and silicon oxynitride.

10. 发明申请

US20190084862A1 COATINGS FOR GLASS-SHAPING MOLDS AND MOLDS COMPRISING THE SAME 审中-公开
公开(公告)号：US20190084862A1
公开(公告)日：2019-03-21
申请号：US16137730
申请日：2018-09-21
申请人： Entegris, Inc.
发明人： Troy SCOGGINS , Rex Gerald Sheppard , Carlo Waldfried
IPC分类号： C03B11/08 , C23C16/455 , C23C16/40
摘要： Described are glass-forming molds made of a graphite mold body and a coating formed by atomic layer deposition, with the coating being made of alumina or a combination of alumina and yttria.

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