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    • 1. 发明授权
    • Apparatus and methods for hyperspectral imaging with on-chip digital time delay and integration
    • 具有片上数字时间延迟和集成的高光谱成像的装置和方法
    • US09426397B2
    • 2016-08-23
    • US14539983
    • 2014-11-12
    • EO Vista, LLC
    • Steven J. Wein
    • H04N5/33H04N5/372H04N5/217H04N5/378G01J3/28
    • H04N5/37206G01J3/2803G01J3/2823G01J2003/2826H04N5/217H04N5/332H04N5/378
    • An apparatus and corresponding method for line-scan imaging can include a 2D array of light-sensitive detector elements that detect light from a target scene. The 2D array can be divided into a plurality of sub-arrays and supported by an analog amplification and signal conditioning module portion of a read-out integrated circuit (ROIC), the analog module having one or more replicated amplification and signal conditioning circuits in communication with the 2D array detector elements. An analog-to-digital (A/D) conversion electrical circuit module and one or more digital time-delay and integration (TDI) modules can be situated in a portion of the ROIC not supporting the 2D array. The TDI modules can perform TDI of the detector sub-arrays. Embodiments enable hyperspectral images to be obtained with greater imaging range and higher signal-to-noise ratios.
    • 用于线扫描成像的装置和相应方法可以包括检测来自目标场景的光的光敏检测器元件的2D阵列。 2D阵列可以被划分成多个子阵列并由读出集成电路(ROIC)的模拟放大和信号调节模块部分支持,该模拟模块具有一个或多个复制放大和信号调理电路,在通信中 与2D阵列检测器元件。 模数(A / D)转换电路模块和一个或多个数字时延和积分(TDI)模块可以位于ROIC的不支持2D阵列的部分中。 TDI模块可以执行检测器子阵列的TDI。 实施例可以获得具有更大成像范围和更高信噪比的高光谱图像。
    • 2. 发明申请
    • Apparatus and Methods for Hyperspectral Imaging with On-Chip Digital Time Delay and Integration
    • 用于具有片上数字时间延迟和集成的高光谱成像的装置和方法
    • US20150136955A1
    • 2015-05-21
    • US14539983
    • 2014-11-12
    • EO Vista, LLC
    • Steven J. Wein
    • H04N5/372
    • H04N5/37206G01J3/2803G01J3/2823G01J2003/2826H04N5/217H04N5/332H04N5/378
    • An apparatus and corresponding method for line-scan imaging can include a 2D array of light-sensitive detector elements that detect light from a target scene. The 2D array can be divided into a plurality of sub-arrays and supported by an analog amplification and signal conditioning module portion of a read-out integrated circuit (ROIC), the analog module having one or more replicated amplification and signal conditioning circuits in communication with the 2D array detector elements. An analog-to-digital (A/D) conversion electrical circuit module and one or more digital time-delay and integration (TDI) modules can be situated in a portion of the ROIC not supporting the 2D array. The TDI modules can perform TDI of the detector sub-arrays. Embodiments enable hyperspectral images to be obtained with greater imaging range and higher signal-to-noise ratios.
    • 用于线扫描成像的装置和相应方法可以包括检测来自目标场景的光的光敏检测器元件的2D阵列。 2D阵列可以被划分成多个子阵列并且由读出集成电路(ROIC)的模拟放大和信号调节模块部分支持,该模拟模块具有一个或多个复制放大和信号调理电路的通信 与2D阵列检测器元件。 模数(A / D)转换电路模块和一个或多个数字时延和积分(TDI)模块可以位于ROIC的不支持2D阵列的部分中。 TDI模块可以执行检测器子阵列的TDI。 实施例可以获得具有更大成像范围和更高信噪比的高光谱图像。