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1. 发明授权

US11495901B2 Electric connection socket connecting a circuit board and an integrated circuit package 有权
公开(公告)号：US11495901B2
公开(公告)日：2022-11-08
申请号：US16761254
申请日：2018-06-29
申请人： Enplas Corporation
发明人： Keiichi Narumi
IPC分类号： H01R12/71 , G01R1/067 , G01R1/073 , H01R12/57 , H01R13/193 , H01R13/6473 , H01R13/6594 , H01R12/58 , H01R12/55 , H01R24/40 , H01R12/73
摘要： An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.

2. 发明授权

US11171434B2 Electric connection socket 有权
公开(公告)号：US11171434B2
公开(公告)日：2021-11-09
申请号：US16761253
申请日：2018-06-29
申请人： Enplas Corporation
发明人： Keiichi Narumi
IPC分类号： H01R12/70 , H01R12/71 , G01R1/067 , G01R1/073 , H01R12/57 , H01R13/193
摘要： An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. The metal housing is arranged on the circuit substrate such that an air gap is formed between the bottom surface of the metal housing and the top surface of the circuit substrate.

3. 发明授权

US11189945B2 Method of manufacturing electrical connection socket, and electrical connection socket 有权
公开(公告)号：US11189945B2
公开(公告)日：2021-11-30
申请号：US16768039
申请日：2018-06-29
申请人： ENPLAS CORPORATION
发明人： Kazutaka Koshiishi , Keiichi Narumi
IPC分类号： H01R12/70 , H01R12/71 , G01R31/28 , G01R1/04 , G01R1/067 , H01R12/57 , H01R13/193
摘要： This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a metallic casing which has a communication hole for communication between the upper surface and lower surface of the metallic casing, to the lower surface side of which the first electrical component is attached, and to the upper surface of which the second electrical component is attached; a signal pin which is disposed in the communication hole so as to be separated from the inner wall surface of the communication hole, one end of which is electrically connected to a terminal of the first electrical component, and the other end of which is electrically connected to a terminal of the second electrical component; an annular first holding member which is, in the upper region of the communication hole, press-fitted in the communication hole; and an annular second holding member which is, in the lower region of the communication hole, press-fitted to the outer circumferential surface of the signal pin, wherein the signal pin is fixed in the communication hole so as to be held by the metallic casing from above and from below via the first and second holding members.

4. 发明授权

US11329411B2 Electrical connection socket 有权
公开(公告)号：US11329411B2
公开(公告)日：2022-05-10
申请号：US16768044
申请日：2018-06-29
申请人： ENPLAS CORPORATION
发明人： Kazutaka Koshiishi , Keiichi Narumi
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R31/28 , H01R12/71 , H01R12/57 , H01R13/193
摘要： This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a signal pin which is inserted in a communication hole of a metallic casing so as to form a coaxial line path between the inner wall surface of the communication hole and the outer circumferential surface of the signal pin so that one end of the signal pin is electrically connected to a terminal of the first electrical component while the other end is electrically connected to a terminal of the second electrical component; and a holding member which holds the signal pin in the communication hole such that the outer circumferential surface of the signal pin is separated from the inner wall surface of the communication hole, wherein the characteristic impedance of a signal path formed by the signal pin in a first region where the signal pin is held by the holding member is smaller than a predetermined characteristic impedance which is a reference, and the characteristic impedance in a second region adjacent to the first region is larger than the predetermined characteristic impedance.

5. 发明授权

US09853380B2 Electronic component socket 有权
公开(公告)号：US09853380B2
公开(公告)日：2017-12-26
申请号：US15108282
申请日：2014-12-24
申请人： ENPLAS CORPORATION
发明人： Keiichi Narumi
IPC分类号： H01R12/71 , H01R12/70 , H05K7/20 , G01R1/04
CPC分类号： H01R12/714 , G01R1/0466 , H01R12/7058 , H01R2201/20 , H05K7/20418
摘要： An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate.

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