专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09504140B2 PCB having offset differential signal routing 有权
公开(公告)号：US09504140B2
公开(公告)日：2016-11-22
申请号：US14164320
申请日：2014-01-27
申请人： FCI Americas Technology LLC
发明人： Steven E. Minich
IPC分类号： H05K1/02 , H05K1/11 , G09B23/18 , H05K3/42
摘要： In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first direction, a first electrical signal trace extending along the first direction and spaced from the first linear array along a second direction that is perpendicular to the first direction, a group of ground isolation vias containing at least one electrically conductive ground via arranged along a line extending parallel to the first direction and spaced from the first electrical signal trace along the second direction, and a second linear array containing at least a second anti-pad extending along the first direction spaced from the group of ground isolation vias along the second direction.

2. 外观设计

USD767505S1 Vertical electrical connector housing 有权
公开(公告)号：USD767505S1
公开(公告)日：2016-09-27
申请号：US29551176
申请日：2016-01-11
申请人： FCI Americas Technology LLC
设计人： Jonathan E. Buck , Stuart C. Stoner , Steven E. Minich , Douglas M. Johnescu , Stephen B. Smith

3. 外观设计

USD817892S1 Right-angle electrical connector 有权
公开(公告)号：USD817892S1
公开(公告)日：2018-05-15
申请号：US29553377
申请日：2016-02-01
申请人： FCI Americas Technology LLC
设计人： Jonathan E. Buck , Stuart C. Stoner , Steven E. Minich , Douglas M. Johnescu , Stephen B. Smith

4. 发明授权

US09545004B2 Printed circuit board having orthogonal signal routing 有权
标题翻译：具有正交信号路由的印刷电路板
公开(公告)号：US09545004B2
公开(公告)日：2017-01-10
申请号：US14164338
申请日：2014-01-27
申请人： FCI Americas Technology LLC
发明人： Steven E. Minich , Mark R. Gray
IPC分类号： H05K1/11 , H05K1/14 , H05K1/02
CPC分类号： H05K1/141 , H01R12/724 , H01R12/735 , H01R13/6587 , H05K1/0245 , H05K1/0298 , H05K1/116 , H05K1/14 , H05K3/306 , H05K2201/044 , H05K2201/09227 , H05K2201/09409 , H05K2201/09709 , H05K2201/09718 , H05K2201/10189 , H05K2201/10295 , Y10T29/49165
摘要： In accordance with the various embodiments disclosed herein, electrical connector footprints, such as printed circuit boards, is described comprising one or more of signal traces that each include a first section that extends parallel to the linear array direction and a second section extends in a direction that is different than the linear array direction.
摘要翻译：根据本文公开的各种实施例，描述了诸如印刷电路板的电连接器覆盖区，其包括一个或多个信号迹线，每个信号迹线包括平行于线性阵列方向延伸的第一部分，第二部分沿着方向这与线性阵列方向不同。

5. 发明授权

US09544992B2 PCB having offset differential signal routing 有权
标题翻译： PCB具有偏移差分信号路由
公开(公告)号：US09544992B2
公开(公告)日：2017-01-10
申请号：US14164320
申请日：2014-01-27
申请人： FCI Americas Technology LLC
发明人： Steven E. Minich
IPC分类号： H05K1/02 , H05K1/11 , G09B23/18 , H05K3/42
CPC分类号： H05K1/0245 , G09B23/183 , H01R13/6471 , H05K1/0216 , H05K1/0218 , H05K1/0222 , H05K1/0228 , H05K1/115 , H05K1/116 , H05K3/42 , H05K2201/09618 , Y10T29/49165
摘要： In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first direction, a first electrical signal trace extending along the first direction and spaced from the first linear array along a second direction that is perpendicular to the first direction, a group of ground isolation vias containing at least one electrically conductive ground via arranged along a line extending parallel to the first direction and spaced from the first electrical signal trace along the second direction, and a second linear array containing at least a second anti-pad extending along the first direction spaced from the group of ground isolation vias along the second direction.
摘要翻译：根据本文公开的各种实施例，描述了改进的电连接器封面，例如印刷电路板（印刷电路板），其包括例如第一线性阵列中的一个或多个，其包含至少第一防焊垫延伸沿着第一方向沿着第一方向延伸并沿着垂直于第一方向的第二方向与第一线性阵列间隔开的第一电信号迹线，一组接地隔离通孔，其包含沿着第一方向布置的至少一个导电接地通孔沿着第二方向平行于第一方向并与第一电信号迹线间隔开的线，以及第二线性阵列，其包含至少沿第一方向延伸的第二反焊盘，所述第二反焊盘沿着沿着第二方向与所述第一电信号迹线组隔开，方向。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式