专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08884517B1 Illumination sources with thermally-isolated electronics 有权
标题翻译：带隔离电子元件的照明源
公开(公告)号：US08884517B1
公开(公告)日：2014-11-11
申请号：US13274489
申请日：2011-10-17
申请人： Frank Tin Chung Shum , Frank M. Steranka , Michael R. Krames
发明人： Frank Tin Chung Shum , Frank M. Steranka , Michael R. Krames
IPC分类号： H01K1/62 , H01J9/24
CPC分类号： F21V29/15 , F21K9/23 , F21K9/90 , F21V29/70 , F21V29/74 , F21V29/83 , F21Y2105/10 , F21Y2115/10
摘要： An lighting source includes a driver for outputting electrical power in response to external electrical power, wherein the driver generates heat in response thereto, a lamp coupled to the driver, for outputting light in response to the electrical power, wherein the lamp generates heat in response thereto, a first heat sink physically coupled to the driver for receiving and dissipating heat there from, a second heat sink physically coupled to the light for receiving heat and dissipating heat there from, and an insulating portion disposed between the first heat sink and the second heat sink, wherein the insulating portion is configured to inhibit heat from the lamp from being transferred to the driver.
摘要翻译：照明源包括用于响应于外部电力输出电力的驱动器，其中驱动器响应于此而产生热量，连接到驱动器的灯，用于响应于电功率而输出光，其中灯发出响应的热量物理耦合到驱动器的第一散热器，用于从其接收和散发热量，物理耦合到光的第二散热器，用于接收热量并从中散发热量;以及绝缘部分，设置在第一散热器和第二散热器之间散热器，其中所述绝缘部分被配置为抑制来自所述灯的热量被传送到所述驱动器。

2. 发明授权

US08541951B1 High temperature LED system using an AC power source 有权
标题翻译：高温LED系统采用交流电源
公开(公告)号：US08541951B1
公开(公告)日：2013-09-24
申请号：US13298905
申请日：2011-11-17
申请人： Frank Tin Chung Shum , Frank M. Steranka , Cliff Jue
发明人： Frank Tin Chung Shum , Frank M. Steranka , Cliff Jue
IPC分类号： H05B37/02
CPC分类号： H05B33/0824
摘要： Power management and thermal management for high intensity LED lamps are disclosed.
摘要翻译：公开了高强度LED灯的电源管理和热管理。

3. 发明授权

US08803452B2 High intensity light source 有权
标题翻译：高强度光源
公开(公告)号：US08803452B2
公开(公告)日：2014-08-12
申请号：US13269193
申请日：2011-10-07
申请人： Frank Tin Chung Shum , Clifford Jue
发明人： Frank Tin Chung Shum , Clifford Jue
IPC分类号： H05K3/30 , F21V17/00
CPC分类号： F21V23/005 , F21K9/233 , F21V29/74 , F21V29/77 , F21V29/773 , H05K1/021 , H05K1/189 , H05K2201/10106 , Y10T29/49002 , Y10T29/4913 , Y10T29/49826
摘要： A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.
摘要翻译：光源包括具有安装区域的散热器和散热翅片，具有内腔并耦合到散热器的基座壳体，以及集成照明模块，包括：印刷电路板; 在印刷电路板的第一横向区域内耦合到印刷电路板的衬底上的LED以及用于向印刷电路板的第二横向区域内的LED供电并耦合到印刷电路板的电子驱动电路，其中所述基板的底表面热耦合到所述散热器的安装区域，并且其中所述集成照明模块的所述第二横向区域位于所述基座外壳的内腔内。

4. 发明授权

US08525396B2 Illumination source with direct die placement 有权
标题翻译：具有直接裸片放置的照明源
公开(公告)号：US08525396B2
公开(公告)日：2013-09-03
申请号：US13025791
申请日：2011-02-11
申请人： Frank Tin Chung Shum , Clifford Jue
发明人： Frank Tin Chung Shum , Clifford Jue
IPC分类号： H01J61/52
CPC分类号： F21V17/164 , F21K9/23 , F21V5/04 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/773 , F21V29/87 , F21V29/89 , F21Y2115/10 , Y10T29/49002
摘要： An illumination source includes a heat sink with a planar inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is affixed to the planar substrate and an adhesive layer between the planar substrate and the planar inner core region conducts heat from the LED assembly to the inner core region.
摘要翻译：照明源包括具有平面内芯区域的散热器和具有从内芯区域散发热量的结构的外芯区域。 LED组件固定到平面基板上，并且平面基板和平面内芯区域之间的粘合剂层将热量从LED组件传导到内芯区域。

5. 发明授权

US08324835B2 Modular LED lamp and manufacturing methods 有权
标题翻译：模块化LED灯和制造方法
公开(公告)号：US08324835B2
公开(公告)日：2012-12-04
申请号：US13025860
申请日：2011-02-11
申请人： Frank Tin Chung Shum , Clifford Jue
发明人： Frank Tin Chung Shum , Clifford Jue
IPC分类号： G05F1/00 , F21S4/00
CPC分类号： H05K1/189 , F21K9/23 , F21K9/238 , F21V23/006 , F21V23/007 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/773 , F21V29/87 , F21V29/89 , F21Y2115/10 , H05K1/0203 , H05K1/147 , H05K2201/10106 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913
摘要： A method for forming a light source includes receiving an LED light module having a plurality of LEDs on a silicon substrate coupled to a flexible printed circuit and bonding the LED light module directly to a heat-sink with a thermal adhesive A base module with LED driver circuits is inserted into an interior channel of the heat sink and contacts of the LED driver circuits are connected to the LED light module.
摘要翻译：一种用于形成光源的方法包括：接收在耦合到柔性印刷电路的硅衬底上具有多个LED的LED灯模块，并将LED灯模块直接连接到具有热粘合剂的散热器。电路插入到散热器的内部通道中，LED驱动电路的触点连接到LED灯模块。

6. 发明申请

US20120187830A1 High Intensity Light Source 有权
标题翻译：高强度光源
公开(公告)号：US20120187830A1
公开(公告)日：2012-07-26
申请号：US13269193
申请日：2011-10-07
申请人： Frank Tin Chung Shum , Clifford Jue
发明人： Frank Tin Chung Shum , Clifford Jue
IPC分类号： F21V23/00 , H05K3/30 , B32B37/12 , F21V17/00
CPC分类号： F21V23/005 , F21K9/233 , F21V29/74 , F21V29/77 , F21V29/773 , H05K1/021 , H05K1/189 , H05K2201/10106 , Y10T29/49002 , Y10T29/4913 , Y10T29/49826
摘要： A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.
摘要翻译：光源包括具有安装区域的散热器和散热翅片，具有内腔并耦合到散热器的基座壳体，以及集成照明模块，包括：印刷电路板; 在印刷电路板的第一横向区域内耦合到印刷电路板的衬底上的LED以及用于向印刷电路板的第二横向区域内的LED供电并耦合到印刷电路板的电子驱动电路，其中所述基板的底表面热耦合到所述散热器的安装区域，并且其中所述集成照明模块的所述第二横向区域位于所述基座外壳的内腔内。

7. 发明授权

US08674395B2 System and method for LED packaging 有权
标题翻译： LED封装的系统和方法
公开(公告)号：US08674395B2
公开(公告)日：2014-03-18
申请号：US13482956
申请日：2012-05-29
申请人： Frank Tin Chung Shum
发明人： Frank Tin Chung Shum
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/46 , H01L33/486 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： System and method for LED packaging. The present invention is directed to optical devices. More specifically, embodiments of the presentation provide LED packaging having one or more reflector surfaces. In certain embodiments, the present invention provides LED packages that include thermal pad structures for dissipating heat generated by LED devices. In particular, thermal pad structures with large surface areas are used to allow heat to transfer. In certain embodiments, thick thermally conductive material is used to improve overall thermal conductivity of an LED package, thereby allowing heat generated by LED devices to dissipate quickly. Depending on the application, thermal pad structure, thick thermal conductive layer, and reflective surface may be individually adapted in LED packages or used in combinations. There are other embodiments as well.
摘要翻译： LED封装的系统和方法。本发明涉及光学器件。更具体地，演示的实施例提供具有一个或多个反射器表面的LED封装。在某些实施例中，本发明提供了包括散热由LED器件产生的热量的散热垫结构的LED封装。特别地，使用具有大表面积的散热垫结构来允许热量传递。在某些实施例中，使用厚导热材料来改善LED封装的整体导热性，从而允许由LED器件产生的热量快速消散。根据应用，热垫结构，厚导热层和反射表面可以单独地适用于LED封装或组合使用。还有其它实施例。

8. 发明授权

US08207554B2 System and method for LED packaging 有权
标题翻译： LED封装的系统和方法
公开(公告)号：US08207554B2
公开(公告)日：2012-06-26
申请号：US12879784
申请日：2010-09-10
申请人： Frank Tin Chung Shum
发明人： Frank Tin Chung Shum
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/46 , H01L33/486 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： System and method for LED packaging. The present invention is directed to optical devices. More specifically, embodiments of the presentation provide LED packaging having one or more reflector surfaces. In certain embodiments, the present invention provides LED packages that include thermal pad structures for dissipating heat generated by LED devices. In particular, thermal pad structures with large surface areas are used to allow heat to transfer. In certain embodiments, thick thermally conductive material is used to improve overall thermal conductivity of an LED package, thereby allowing heat generated by LED devices to dissipate quickly. Depending on the application, thermal pad structure, thick thermal conductive layer, and reflective surface may be individually adapted in LED packages or used in combinations. There are other embodiments as well.
摘要翻译： LED封装的系统和方法。本发明涉及光学器件。更具体地，演示的实施例提供具有一个或多个反射器表面的LED封装。在某些实施例中，本发明提供了包括散热由LED器件产生的热量的散热垫结构的LED封装。特别地，使用具有大表面积的散热垫结构来允许热量传递。在某些实施例中，使用厚导热材料来改善LED封装的整体导热性，从而允许由LED器件产生的热量快速消散。根据应用，热垫结构，厚导热层和反射表面可以单独地适用于LED封装或组合使用。还有其它实施例。

9. 发明申请

US20110186874A1 White Light Apparatus and Method 审中-公开
标题翻译：白光装置及方法
公开(公告)号：US20110186874A1
公开(公告)日：2011-08-04
申请号：US13019897
申请日：2011-02-02
申请人： Frank Tin Chung Shum
发明人： Frank Tin Chung Shum
IPC分类号： H01L33/52 , H01L33/60
CPC分类号： H01L25/0753 , F21K9/00 , F21K9/232 , F21Y2115/10 , H01L33/60 , H01L2224/48091 , H01L2924/09701 , H01L2924/00014
摘要： A method of manufacturing LED devices using substrate scale processing includes providing a substrate member having a surface region. A reflective layer is disposed on the surface region, the reflective surface having a reflectivity of at least 85%, An array of conductive regions is spatially disposed on the reflective surface. LED devices are affixed to each of the array regions.
摘要翻译：使用基板标尺处理制造LED器件的方法包括提供具有表面区域的基板部件。反射层设置在表面区域上，反射表面具有至少85％的反射率。导电区域的阵列被空间地设置在反射表面上。 LED器件固定到每个阵列区域。

10. 发明授权

US08643257B2 Illumination source with reduced inner core size 有权
标题翻译：内芯尺寸减小的照明源
公开(公告)号：US08643257B2
公开(公告)日：2014-02-04
申请号：US13025833
申请日：2011-02-11
申请人： Frank Tin Chung Shum , Clifford Jue
发明人： Frank Tin Chung Shum , Clifford Jue
IPC分类号： H01J1/02
CPC分类号： F21V29/89 , F21K9/23 , F21V29/70 , F21V29/74 , F21V29/75 , F21V29/773 , F21Y2115/10 , Y10T29/49826
摘要： A illumination source includes a LED assembly and an MR-16 form factor heat sink coupled to the LED assembly. The MR-16 form factor heat sink has an inner core region and an outer core region with the LED assembly disposed upon the inner core region, and the outer core region providing a heat sink.
摘要翻译：照明源包括耦合到LED组件的LED组件和MR-16形状因子散热器。 MR-16形状因子散热器具有内芯区域和外芯区域，其中LED组件设置在内芯区域上，而外芯区域提供散热器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式