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1. 发明申请

US20180288880A1 Methods and Apparatus for a Substrate Core Layer 审中-公开
公开(公告)号：US20180288880A1
公开(公告)日：2018-10-04
申请号：US16001416
申请日：2018-06-06
申请人： Futurewei Technologies, Inc.
发明人： Fei Yu , Anwar A. Mohammed , Rui Niu
IPC分类号： H05K1/18 , H01L23/00 , H01L23/498 , H01L23/538 , H01L23/31 , H01L21/56 , H05K1/03 , H05K3/34 , H05K3/40
CPC分类号： H05K1/186 , H01L21/568 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K1/036 , H05K3/3436 , H05K3/4007 , H05K2201/09118 , Y10T29/49124 , H01L2924/00
摘要： A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.

2. 发明授权

US09112091B2 Apparatus and method for an optical package structure using aluminum nitride 有权
标题翻译：使用氮化铝的光学封装结构的装置和方法
公开(公告)号：US09112091B2
公开(公告)日：2015-08-18
申请号：US13646486
申请日：2012-10-05
申请人： FutureWei Technologies, Inc.
发明人： Anwar A. Mohammed , Fei Yu , Qi Deng
IPC分类号： H01L31/12
CPC分类号： H01L31/12 , Y10T29/49139
摘要： An apparatus and method are disclosed for providing monolithic optical packages. An embodiment optical package includes a base made of aluminum-nitride (AlN) that is configured to support an optical component, a plurality of sidewalls made of AlN that are coupled to the base, the sidewalls are configured to surround the optical component, and a feed-through made of AlN that is coupled to one of the sidewalls, wherein the feed-through is configured to feed a plurality of leads through the one sidewall to provide an electrical connection to the optical component, wherein the base, the sidewalls, and the feed-through have a same coefficient of thermal expansion (CTE) for AlN. An embodiment method includes punching and printing AlN tapes to build a base, a plurality of sidewalls joined to the base, and a feed-through coupled to the sidewalls, and attaching a plurality of electrical leads into the feed-through.
摘要翻译：公开了一种用于提供单片光学封装的装置和方法。一种实施方式的光学封装包括由氮化铝（AlN）构成的基座，其被配置为支撑光学部件，由AlN制成的多个侧壁，所述多个侧壁与所述基座耦合，所述侧壁被配置为围绕所述光学部件，并且馈通由耦合到所述侧壁中的一个的AlN制成，其中所述馈通被配置为将多个引线通过所述一个侧壁以提供到所述光学部件的电连接，其中所述基部，所述侧壁和馈通对于AlN具有相同的热膨胀系数（CTE）。一种实施方式包括冲压和印刷AlN带以构成基底，连接到基底的多个侧壁和连接到侧壁的馈通，以及将多个电引线附接到馈通中。

3. 发明授权

US10212818B2 Methods and apparatus for a substrate core layer 有权
公开(公告)号：US10212818B2
公开(公告)日：2019-02-19
申请号：US16001416
申请日：2018-06-06
申请人： Futurewei Technologies, Inc.
发明人： Fei Yu , Anwar A. Mohammed , Rui Niu
IPC分类号： H05K1/03 , H05K1/18 , H05K3/34 , H05K3/40 , H01L23/00 , H01L23/498 , H01L23/538 , H01L21/56 , H01L23/31
摘要： A structure for a core layer of a substrate and a method for fabricating a core layer of a substrate are disclosed. The core layer comprises a molding compound encapsulating a die or a plurality of dies, a dielectric layer on the surfaces of the molding compound, and a conductive layer on top of the dielectric layer. A through hole is formed through the dielectric layer and the molding compound, which may be filled with a metal plate. A laser via is formed similarly. Build-up layers may be assembled next to the core layer to form the substrate, which can be used to package dies.

4. 发明申请

US20140027157A1 Device and Method for Printed Circuit Board with Embedded Cable 审中-公开
标题翻译：具有嵌入式电缆的印刷电路板的装置和方法
公开(公告)号：US20140027157A1
公开(公告)日：2014-01-30
申请号：US13907344
申请日：2013-05-31
申请人： FutureWei Technologies, Inc.
发明人： Fei Yu , Hang Yan , Feng Gao
IPC分类号： H05K1/11
CPC分类号： H05K1/11 , H05K1/0245 , H05K3/103 , H05K3/4644 , H05K2201/10356
摘要： A printed circuit board (PCB) includes a first dielectric layer and a differential cable structure embedded in the dielectric layer. The differential cable structure includes a first inner conductor, a second inner conductor, a dielectric surrounding portions of the first inner conductor and portions of the second inner conductor, and a ground shield surrounding the dielectric.
摘要翻译：印刷电路板（PCB）包括嵌入电介质层中的第一电介质层和差分电缆结构。差分电缆结构包括第一内部导体，第二内部导体，围绕第一内部导体的部分和第二内部导体的部分的电介质以及围绕电介质的接地屏蔽。

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