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1. 发明授权

US09525933B2 Ultrathin speaker module 有权
标题翻译：超薄扬声器模块
公开(公告)号：US09525933B2
公开(公告)日：2016-12-20
申请号：US14761920
申请日：2013-12-17
申请人： GOERTEK INC.
发明人： Gang Chen , Shuangshuang Fan , Dan Han , Yun Yang
IPC分类号： H04R1/28 , H04R1/02 , H04R9/02
CPC分类号： H04R1/2842 , H04R1/02 , H04R9/025 , H04R2499/11
摘要： An ultrathin speaker module, comprising: a casing provided with a sound hole thereon; a speaker unit comprising a diaphragm; a first separating wall provided with a diaphragm accommodating hole, wherein the diaphragm is fixed in the diaphragm accommodating hole, and the first separating wall and the diaphragm separate the internal space of the casing into an upper space and a lower space; and a second separating wall, which separates the upper space into one first upper cavity and at least one second upper cavity, wherein the first upper cavity comprises the diaphragm and forms a front acoustic cavity, and the front acoustic cavity is in communication with the outside through the sound hole on the casing; and the at least one second upper cavity is in communication with the lower space through a through hole on the first separating wall, and forms a rear acoustic cavity.
摘要翻译：一种超薄扬声器模块，包括：在其上设置有声孔的壳体; 扬声器单元，包括隔膜; 设置有隔膜容纳孔的第一分隔壁，其中所述隔膜固定在所述隔膜容纳孔中，并且所述第一隔离壁和所述隔膜将所述壳体的内部空间分隔成上部空间和下部空间; 以及第二分隔壁，其将上部空间分离成一个第一上部空腔和至少一个第二上部空腔，其中第一上部空腔包括隔膜并形成前部声腔，并且前部声腔与外部连通通过外壳上的声孔; 并且所述至少一个第二上腔通过所述第一分隔壁上的通孔与所述下部空间连通，并形成后声腔。

2. 发明授权

US10362376B2 Speaker and rear cover therefor 有权
公开(公告)号：US10362376B2
公开(公告)日：2019-07-23
申请号：US15781081
申请日：2016-05-09
申请人： Goertek Inc.
发明人： Qingyi Zhang , Gang Chen , Shuangshuang Fan
IPC分类号： H04R1/00 , H04R1/02 , H04M1/02 , H04R1/22 , H04R31/00
摘要： The present invention discloses a speaker and a rear cover therefor. The rear cover comprises a rear cover body whose one side is provided with a first connection portion; and a connection assembly provided with a first surface and a second surface which are connected with each other. A contact is formed by extending and bending the first surface, and is provided with a conductor. A connection hole is further formed in the first surface. A limiting device and a second connection portion are arranged on the second surface; and the cross section of the limiting device is C-shaped. The connection assembly is connected to the first connection portion of the rear cover body through the second connection portion. The contact is configured to conduct the speaker with the outside. The connection hole is configured to fix the speaker or conduct the speaker with other components.

3. 发明授权

US10194223B2 Loudspeaker module 有权
公开(公告)号：US10194223B2
公开(公告)日：2019-01-29
申请号：US15568404
申请日：2015-11-16
申请人： GOERTEK INC.
发明人： Shuangshuang Fan , Gang Chen
IPC分类号： H04R1/02 , H04R31/00
摘要： Disclosed is a loudspeaker module, comprising a housing and a loudspeaker unit accommodated in the housing. A sound hole is provided on the housing, and a protective net is provided at a position of the housing corresponding to the sound hole, wherein the protective net has a non-planar structure. In the loudspeaker module of the present invention, the protective net has a non-planar structure, and cancels, via deformation thereof, stress of the housing such that the stress does not act on the protective net to cause tearing or deformation of the net holes, thus improving reliability of the protective net, preventing external foreign matter from entering the interior of the loudspeaker module, and improving reliability of the loudspeaker module.

4. 发明授权

US09872099B2 Shutter covered on sound hole of loudspeaker module and assembling method thereof, loudspeaker module 有权
公开(公告)号：US09872099B2
公开(公告)日：2018-01-16
申请号：US14890224
申请日：2013-12-13
申请人： GOERTEK INC.
发明人： Shuangshuang Fan , Gang Chen , Dan Han , Yun Yang , Hongwei Du
IPC分类号： H04R1/02 , H04R1/28 , B29B11/04 , B29B11/08 , B29B11/14 , B29C45/14 , B29C45/16 , B29K101/00 , B29K105/00 , B29L31/34
CPC分类号： H04R1/2803 , B29B11/04 , B29B11/08 , B29B11/14 , B29C45/14 , B29C45/14008 , B29C45/1671 , B29K2101/00 , B29K2105/256 , B29L2031/3437 , B29L2031/3481 , H04R1/02 , H04R1/023 , H04R2499/11
摘要： A blocking piece covering the sound hole of a loudspeaker module may be arranged at a position where the sound hole is located on the case of the loudspeaker module and covers the sound hole. The blocking piece may be made of a nonmetallic flexible net. The nonmetallic net-shaped blocking piece and the case may be formed integrally by injection molding. The loudspeaker module and the blocking piece covering the sound hole thereof in the present invention may provide good acoustic performance, high reliability, high space utilization rate and/or high production efficiency. The assembling method for the blocking piece covering the sound hole of the loudspeaker module further makes the assembling of the blocking piece convenient for operation, and improves the assembling efficiency and assembling quality.

5. 发明授权

US10757493B2 Speaker module 有权
公开(公告)号：US10757493B2
公开(公告)日：2020-08-25
申请号：US16310097
申请日：2016-12-29
申请人： GOERTEK INC.
发明人： Shuangshuang Fan , Gang Chen
IPC分类号： H04R9/06 , H04R1/02 , H04R1/44
摘要： The present invention provides a speaker module comprising a module housing, and a speaker unit accommodated in the module housing, and the speaker unit separates a cavity formed by the module housing into a front acoustic cavity and a rear acoustic cavity; sound absorbing particles are filled into the rear acoustic cavity, and the sidewall of the module housing is provided with an isolation mesh cloth for isolating the sound absorbing particles and the speaker unit; the isolating mesh cloth is fixed to a first fixing frame by injection molding, and the first fixing frame is fixed in the corresponding module housing by injection molding. According to the present invention, it can prevent the problems such as leakage, deviation or breakage of the mesh during the process of fixing the isolating mesh cloth.

6. 发明授权

US10015599B2 Micro speaker 有权
公开(公告)号：US10015599B2
公开(公告)日：2018-07-03
申请号：US15537317
申请日：2015-11-04
申请人： GOERTEK INC.
发明人： Shuangshuang Fan , Gang Chen , Yun Yang , Xinxiang Huo , Dan Han
IPC分类号： H04R9/06 , H04R9/02 , H04R7/18 , H04R7/12 , H04R9/04
CPC分类号： H04R9/06 , H04R1/021 , H04R7/127 , H04R7/18 , H04R7/20 , H04R9/025 , H04R9/046
摘要： Disclosed is a micro speaker, comprising a vibration system, a magnetic circuit system and a support system; the vibration system comprises a vibrating diaphragm; a dodging groove is provided on a dome portion of the vibrating diaphragm opposite to a groove structure of an upper housing; the depth of the dodging groove is not less than that of the groove structure; an orthographic projection area of the dodging groove covers that of the groove structure; a dodging structure is provided on a washer of the magnetic circuit system opposite to the dodging groove; the depth of the dodging structure is not less than that of the dodging groove; and the orthographic projection area of the dodging structure covers that of the dodging groove. This structure ensures the normal operation of a product and acoustic performance of a micro speaker while preventing collision of components.

7. 发明授权

US09241207B2 Speaker module 有权
标题翻译：扬声器模块
公开(公告)号：US09241207B2
公开(公告)日：2016-01-19
申请号：US14422632
申请日：2013-08-23
申请人： GOERTEK INC.
发明人： Jianjian Wang , Zhibing Zhang , Shuangshuang Fan , Minghui Shao , Zongjun Mou , Chao Xu , Gang Chen
IPC分类号： H04R1/02 , H04R1/28 , H04R1/34
CPC分类号： H04R1/02 , H04R1/2811 , H04R1/2819 , H04R1/2842 , H04R1/347 , H04R1/403 , H04R5/02 , H04R2205/022 , H04R2205/024
摘要： The present invention provides a speaker module comprising a peripheral frame and speaker units housed in the peripheral frame, and the peripheral frame is provided with sound holes in communication with the outside, a front acoustic cavity in communication with the sound holes is defined between one side of the speaker units and the peripheral frame, and a rear acoustic cavity is defined between the peripheral frame and another side of the speaker units away from the front acoustic cavity; in which the speaker units are provided in plurality, and the rear acoustic cavity is divided into the same number of rear sub-cavities as that of the speaker units, and each of the speaker units corresponds to one of the rear sub-cavities and is in communication with its corresponding rear sub-cavity. The above structure makes it easier to adjust the acoustic performance and improves the stereo effect of the product.
摘要翻译：本发明提供了一种扬声器模块，包括外围框架和容纳在外围框架中的扬声器单元，并且外围框架设置有与外部连通的声孔，与声孔连通的前声腔定义在一侧的扬声器单元和外围框架，并且在外围框架和扬声器单元的远离前声腔的另一侧之间限定后声腔; 其中扬声器单元设置在多个中，并且后声腔被分成与扬声器单元相同数量的后子腔，并且每个扬声器单元对应于后子腔中的一个，并且是与其相应的后子腔连通。上述结构使得更容易调节声学性能并改善产品的立体效果。

8. 发明授权

US10667060B2 Sound generation device and preparation method of metal plastic part 有权
公开(公告)号：US10667060B2
公开(公告)日：2020-05-26
申请号：US16097423
申请日：2016-12-28
申请人： GOERTEK INC.
发明人： Qingyi Zhang , Gang Chen , Zhenjun Li , Shuangshuang Fan
IPC分类号： H04R1/00 , H04R9/06 , C25D11/02 , B29C45/14 , B29K705/02 , B29K705/12 , B29L31/38 , C25D11/04 , C25D11/34 , H04R9/02 , H04R31/00
摘要： The present invention provides a sound generation device and a preparation method of a metal plastic part. The sound generation device comprises a metal plastic part. The metal plastic part comprises a plastic part and a metal insert that is combined with the plastic part. An oxidation film that is obtained through metal nanocrystallization and a nanopore that is formed in a surface of the oxidation film and has a pore diameter of 20-1,000 nm are arranged on a surface of the metal insert. The nanopore is filled with a resin composition from which the plastic part is made. As the nanopore is filled with the resin composition from which the plastic part is made, the metal insert and the plastic part are in close fit with each other, which greatly enhances the gluing capability of the metal insert and prevents the metal insert and the plastic part which are formed through injection molding from being separated. A length of a portion embedded into the plastic part of the metal insert is greatly reduced, such that transfer of ultrasonic energy is smooth. The metal plastic part is effectively prevented from ultrasonic unmelting. Thus, the waterproofness and the sealing property of the metal plastic part are improved. Accordingly, the performance of the sound generation device is improved.

9. 发明授权

US10237662B2 Speaker module with improved heat dissipation 有权
公开(公告)号：US10237662B2
公开(公告)日：2019-03-19
申请号：US15762588
申请日：2015-12-08
申请人： Goertek Inc.
发明人： Qingyi Zhang , Gang Chen , Shuangshuang Fan
IPC分类号： H04R9/06 , H04R1/02 , H04R9/02
摘要： A speaker module comprising: a housing, the housing comprising an upper housing and a lower housing, the housing defining an inner cavity structure, at least one of the upper housing and the lower housing being provided with a group of micropores arranged in an array; and a speaker unit, comprising a magnetic circuit assembly and a vibrating assembly, the vibrating assembly dividing the inner cavity structure into a front cavity and a rear cavity, the magnetic circuit assembly being provided with a magnetic gap having a predetermined pattern, the magnetic circuit assembly being disposed close to the lower housing. A technical problem to be solved by the present invention is the heat dissipation of the speaker module.

10. 发明申请

US20180262841A1 SPEAKER MODULE 审中-公开
公开(公告)号：US20180262841A1
公开(公告)日：2018-09-13
申请号：US15762588
申请日：2015-12-08
申请人： Goertek Inc.
发明人： Qingyi Zhang , Gang Chen , Shuangshuang Fan
IPC分类号： H04R9/06 , H04R1/02 , H04R9/02
CPC分类号： H04R9/06 , H04R1/025 , H04R9/025
摘要： A speaker module comprising: a housing, the housing comprising an upper housing and a lower housing, the housing defining an inner cavity structure, at least one of the upper housing and the lower housing being provided with a group of micropores arranged in an array; and a speaker unit, comprising a magnetic circuit assembly and a vibrating assembly, the vibrating assembly dividing the inner cavity structure into a front cavity and a rear cavity, the magnetic circuit assembly being provided with a magnetic gap having a predetermined pattern, the magnetic circuit assembly being disposed close to the lower housing. A technical problem to be solved by the present invention is the heat dissipation of the speaker module.

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