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    • 2. 发明授权
    • MRI safe actuator for implantable floating mass transducer
    • 用于可植入浮动质量传感器的MRI安全致动器
    • US09264825B2
    • 2016-02-16
    • US13598759
    • 2012-08-30
    • Geoffrey BallPeter LampacherWolfgang AmrheinGunther Weidenholzer
    • Geoffrey BallPeter LampacherWolfgang AmrheinGunther Weidenholzer
    • H04R25/00
    • H04R25/606H04R2225/67H04R2460/13
    • An implantable hearing prosthesis for a recipient patient is described. An implantable signal transducer includes one or more electromagnetic drive coils for receiving an electrical stimulation signal and a cylindrical transducer magnet arrangement including an inner disk magnet having a first magnetic field direction, and an outer annular magnet surrounding the inner rod magnet and having a second magnetic field direction opposite to the first magnetic field direction. Current flow through the one or more electromagnetic drive coils from the electrical stimulation signal creates a coil magnetic field that interacts with the magnetic fields of the transducer magnet arrangement to create vibration in the transducer magnet which is developed by the signal transducer as a mechanical stimulation signal for audio perception by the patient.
    • 描述了用于接受者患者的可植入听力假体。 可植入信号传感器包括用于接收电刺激信号的一个或多个电磁驱动线圈和包括具有第一磁场方向的内圆盘磁体的圆柱形换能器磁体装置和围绕内棒磁体的外环形磁体,并具有第二磁 场方向与第一磁场方向相反。 从电刺激信号流过一个或多个电磁驱动线圈的电流产生与换能器磁体布置的磁场相互作用的线圈磁场,以在由信号传感器开发的换能器磁体中产生振动,作为机械刺激信号 用于患者的音频感知。
    • 7. 发明授权
    • Series-connected two-terminal semiconductor devices and their fabrication
    • 串联的两端子半导体器件及其制造
    • US4339870A
    • 1982-07-20
    • US206680
    • 1980-11-13
    • Geoffrey BallHarry A. DeadmanJohn G. SmithJohn C. Vokes
    • Geoffrey BallHarry A. DeadmanJohn G. SmithJohn C. Vokes
    • H01L21/68H01L21/78H01L23/373H01L25/07H01L29/864H01L47/02H01L21/265H01L21/283H01L21/308
    • H01L21/6835H01L21/78H01L23/3732H01L25/072H01L2221/68359H01L2221/68363H01L2924/0002H01L2924/30105H01L2924/3011Y10S257/926Y10S438/977
    • A method of fabricating a series-connected combination of two-terminal semiconductor devices on a common substrate comprising: forming a layer of high quality semiconductor material, 4, on the surface of a temporary substrate, 2 and 3, to provide active areas for the devices, forming first contact pattern conductors, 6, 9, 10, on the free surface of the high quality semiconductor layer to provide a separate first contact to this layer for each of the devices, bonding an insulating support substrate, 12, to the first contact pattern, removing the temporary substrate, forming second contact pattern conductors, 17, 18, 19, on the other surface of the high quality layer to provide a separate second contact to this layer for each of the devices, removing regions, 8, of the high quality layer separating the conductors of a pattern at any stage after beginning formation of the first contact pattern in order to define the device active areas so that parts of the first contact pattern are exposed when both the temporary substrate and the regions of the high quality layer have been removed, and providing interconnections between the exposed parts, 10, of the first contact pattern and parts of the second contact pattern, whereby to connect the devices in series.Also any series-connected combination of two-terminal semiconductor devices fabricated according to the inventive method.
    • 一种在公共衬底上制造两端子半导体器件的串联组合的方法,包括:在临时衬底2和3的表面上形成高质量半导体材料层4,以提供有效区域 器件,在高质量半导体层的自由表面上形成第一接触图案导体6,9,10,以为每个器件提供与该层的单独的第一接触,将绝缘支撑衬底12接合到第一接触图案导体 接触图案,去除临时衬底,在高质量层的另一表面上形成第二接触图案导体17,18,19,以为每个器件提供与该层的单独的第二接触,去除区域8 高质量层在开始形成第一接触图案之后的任何阶段分离图案的导体,以便限定器件有源区域,使得第一接触图案的部分被曝光 当临时衬底和高质量层的区域都被去除时,并且在第一接触图案的暴露部分10和第二接触图案的部分之间提供互连,从而串联连接器件。 还有根据本发明方法制造的任何串联连接的两端半导体器件。
    • 8. 发明授权
    • Electromagnetic wave receiver front end
    • 电磁波接收机前端
    • US06895224B1
    • 2005-05-17
    • US09936561
    • 2000-03-15
    • Paul D. MundayAndrew R. BarnesGeoffrey BallMark T. MooreAlexander L. Brown
    • Paul D. MundayAndrew R. BarnesGeoffrey BallMark T. MooreAlexander L. Brown
    • H04B1/26H03D9/06H04B1/18H04B1/38
    • H03D9/0633
    • A receiver front end is provided capable of receiving electromagnetic wave signals having frequencies in the range of substantially 35 GHz to substantially 40 GHz, and having a gain of substantially 24 dB or above and a noise figure of substantially 4 dB or below, and comprising one or more multifunction monolithic microwave integrated circuits (MMICs). The receiver front end preferably has a noise figure of substantially 4 dB or below over an output signal frequency range of substantially 1 to 10 GHz, and a size in the region of 30 mm2 or less. The reveiver front end may comprise a receiver MMIC, and a doubler/buffer amplifier MMIC. The receiver MMIC may comprise a low noise amplifier (3), a mixer (5), a filter (4) and an intermediate frequency amplifier (6).
    • 提供的接收器前端能够接收具有基本上35GHz至基本上40GHz范围内的频率的电磁波信号,并且具有基本上24dB或更大的增益和基本上为4dB或更低的噪声系数,并且包括一个 或更多的多功能单片微波集成电路(MMIC)。 接收机前端优选地在基本上为1至10GHz的输出信号频率范围内具有基本上为4dB或更小的噪声系数,并且在30mm 2以下的范围内的尺寸。 接收机前端可以包括接收机MMIC和倍频器/缓冲放大器MMIC。 接收机MMIC可以包括低噪声放大器(3),混频器(5),滤波器(4)和中频放大器(6)。