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1. 发明申请

US20220007113A1 REINFORCING PART FOR DIAPHRAGM OF SPEAKER, AND THE DIAPHRAGM 有权
公开(公告)号：US20220007113A1
公开(公告)日：2022-01-06
申请号：US17292551
申请日：2018-12-20
申请人： Goertek Inc.
发明人： Yong Li , Cuili Zhang
IPC分类号： H04R7/04 , H04R9/06 , H04R9/02
摘要： Disclosed are a reinforcing part for a speaker diaphragm, and the diaphragm. The reinforcing part is an overlapped multilayer structure, and includes a support layer and at least one heat dissipation layer fixed and bonded to a surface of at least one side of the support layer. The support layer includes through holes penetrating surfaces of two sides of the support layer. The reinforcing part further includes fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layer.

2. 发明授权

US11632629B2 Reinforcing part for diaphragm of speaker, the diaphragm and the speaker 有权
公开(公告)号：US11632629B2
公开(公告)日：2023-04-18
申请号：US17292501
申请日：2018-12-20
申请人： Goertek Inc.
发明人： Yong Li , Cuili Zhang
IPC分类号： H04R7/06 , H04R9/02 , H04R9/06
摘要： The present disclosure provides a reinforcing part for a speaker diaphragm, a diaphragm and a speaker. The reinforcing part is an overlapped three-layer structure and comprises a support layer as well as a first heat dissipation layer and a second heat dissipation layer that are fixed and bonded on surfaces of two sides of the support layer respectively, the support layer comprises through holes penetrating surfaces of two sides thereof, and the reinforcing part further comprises fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.

3. 发明授权

US11575993B2 Speaker and speaker module 有权
公开(公告)号：US11575993B2
公开(公告)日：2023-02-07
申请号：US17256704
申请日：2018-12-21
申请人： Goertek Inc.
发明人： Changlong Li , Jianxin Wang , Cuili Zhang , Yong Li , Zhixin Sang
IPC分类号： H04R9/06 , H04R9/02 , H04R7/02
摘要： An embodiment relates to a speaker and a speaker module. The speaker comprises a vibration system and a magnetic circuit system; the vibration system comprises a diaphragm and a voice coil coupled to the diaphragm; a space between a front side of the diaphragm and a front sound cavity cover forms a front sound cavity, and a space between a back side of the diaphragm and a rear sound cavity cover forms a rear sound cavity; wherein the speaker further comprises a plurality of injection molding inserts disposed along a vibration direction of the diaphragm, and the injection molding insert comprises a first end and a second end; the first end is joined with a surface of the front sound cavity cover close to the diaphragm, and the second end is joined with a surface of the rear sound cavity cover close to the diaphragm. One technical problem to be solved by the embodiment of the present invention is to ensure, by using the injection molding inserts, the stability of relative distance and parallelism of the diaphragm connection surface of the housing with respect to both the front sound cavity support surface and the rear sound cavity support surface, so as to ensure stability of the acoustic performance of the speaker.

4. 发明申请

US20220021981A1 REINFORCING PART FOR DIAPHRAGM OF SPEAKER, THE DIAPHRAGM AND THE SPEAKER 有权
公开(公告)号：US20220021981A1
公开(公告)日：2022-01-20
申请号：US17292501
申请日：2018-12-20
申请人： Goertek Inc.
发明人： Yong Li , Cuili Zhang
IPC分类号： H04R7/06 , H04R9/02 , H04R9/06
摘要： The present disclosure provides a reinforcing part for a speaker diaphragm, a diaphragm and a speaker. The reinforcing part is an overlapped three-layer structure and comprises a support layer as well as a first heat dissipation layer and a second heat dissipation layer that are fixed and bonded on surfaces of two sides of the support layer respectively, the support layer comprises through holes penetrating surfaces of two sides thereof, and the reinforcing part further comprises fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.

5. 发明申请

US20210266674A1 SPEAKER AND SPEAKER MODULE 有权
公开(公告)号：US20210266674A1
公开(公告)日：2021-08-26
申请号：US17256704
申请日：2018-12-21
申请人： Goertek Inc.
发明人： Changlong Li , Jianxin Wang , Cuili Zhang , Yong Li , Zhixin Sang
IPC分类号： H04R9/06 , H04R9/02
摘要： An embodiment relates to a speaker and a speaker module. The speaker comprises a vibration system and a magnetic circuit system; the vibration system comprises a diaphragm and a voice coil coupled to the diaphragm; a space between a front side of the diaphragm and a front sound cavity cover forms a front sound cavity, and a space between a back side of the diaphragm and a rear sound cavity cover forms a rear sound cavity; wherein the speaker further comprises a plurality of injection molding inserts disposed along a vibration direction of the diaphragm, and the injection molding insert comprises a first end and a second end; the first end is joined with a surface of the front sound cavity cover close to the diaphragm, and the second end is joined with a surface of the rear sound cavity cover close to the diaphragm. One technical problem to be solved by the embodiment of the present invention is to ensure, by using the injection molding inserts, the stability of relative distance and parallelism of the diaphragm connection surface of the housing with respect to both the front sound cavity support surface and the rear sound cavity support surface, so as to ensure stability of the acoustic performance of the speaker. (FIG. 1)

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