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1. 发明授权

US10349187B2 Acoustic sensor integrated MEMS microphone structure and fabrication method thereof 有权
公开(公告)号：US10349187B2
公开(公告)日：2019-07-09
申请号：US15781364
申请日：2015-12-14
申请人： Goertek Inc.
发明人： Junkai Zhan , Mengjin Cai , Guanxun Qiu , Zonglin Zhou , Qinglin Song
IPC分类号： H04R19/00 , H04R19/04 , H04R31/00 , B81B7/00 , B81C1/00 , B81B7/02
摘要： An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.

2. 发明授权

US10233075B2 Method for forming filter net on MEMS sensor and MEMS sensor 有权
公开(公告)号：US10233075B2
公开(公告)日：2019-03-19
申请号：US15739913
申请日：2017-03-03
申请人： Goertek Inc.
发明人： Junkai Zhan , Zonglin Zhou , Guanxun Qiu , Mengjin Cai
IPC分类号： B81B7/00 , B81C1/00 , B81C3/00
摘要： A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

3. 发明授权

US10750292B2 MEMS microphone chip and MEMS microphone 有权
公开(公告)号：US10750292B2
公开(公告)日：2020-08-18
申请号：US16465756
申请日：2017-03-03
申请人： GOERTEK, INC.
发明人： Junkai Zhan , Jianglong Li , Mengjin Cai
IPC分类号： H04R19/04 , B81B7/00 , H04R1/04 , H04R19/00
摘要： Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.

4. 发明授权

US11381917B2 Vibration diaphragm in MEMS microphone and MEMS microphone 有权
公开(公告)号：US11381917B2
公开(公告)日：2022-07-05
申请号：US16329193
申请日：2017-03-03
申请人： Goertek Inc.
发明人： Junkai Zhan , Mengjin Cai
IPC分类号： H04R7/00 , H04R19/00 , H04R7/16 , H04R7/04
摘要： The present invention discloses a vibration diaphragm in an MEMS microphone, and an MEMS microphone. The vibration diaphragm comprises a vibration diaphragm body and at least one pressure relief device defined by gaps in the vibration diaphragm body, wherein the gaps comprise at least two sections of circular arc-shaped gaps sequentially connected together. The two adjacent sections of circular arc-shaped gaps are in an S shape as a whole and centrosymmetrical with respect to a connected position thereof. The pressure relief device comprises at least two valve clacks formed by at least two sections of adjacent circular arc-shaped gaps and neck portions connected to the valve clacks and the vibration diaphragm body and of a constraint shape.

5. 发明授权

US10382870B2 Piezoelectric microphone 有权
公开(公告)号：US10382870B2
公开(公告)日：2019-08-13
申请号：US15739935
申请日：2017-08-29
申请人： Goertek Inc.
发明人： Junkai Zhan , Zonglin Zhou , Mengjin Cai
IPC分类号： H04R17/02 , H04R19/04 , H01L41/083
摘要： The present invention discloses a piezoelectric microphone. The piezoelectric microphone comprises a substrate having a cavity-backed, and a piezoelectric film connected to the upper side of the substrate via an insulating layer. A position on the piezoelectric film, which is located at the inner side of a junction of the piezoelectric film and the substrate, is provided with a plurality of hollowed-out holes. The hollowed-out holes in the piezoelectric film are at least partly overlapped with the substrate. A gap is provided between the substrate and the position, where the hollowed-out holes are located, on the piezoelectric film. The gap and the hollowed-out holes a together form a channel. Compared with the traditional hollowed-out structure, the gap of the present invention can hinder the sound from directly spreading via the hollowed-out holes, thereby greatly reducing the amount of leakage of low-and-intermediate frequency signals of the piezoelectric microphone and improving the performance of the piezoelectric microphone. In addition, the gap can also effectively prevent a chip from being damaged by the invasion of dust, particles and water.

6. 发明授权

US10349186B2 MEMS microphone 有权
公开(公告)号：US10349186B2
公开(公告)日：2019-07-09
申请号：US15743509
申请日：2017-05-25
申请人： Goertek Inc.
发明人： Junkai Zhan , Mengjin Cai , Zonglin Zhou
IPC分类号： H04R19/04 , H04R7/18 , B06B1/02 , H04R19/00 , G10K9/12 , H04R7/04 , H04R1/28 , H04R31/00
摘要： An MEMS microphone is disclosed, which comprises a substrate and a vibrating diaphragm and a back electrode which are located above the substrate, a plurality of comb tooth parts are formed in edge positions of the vibrating diaphragm, and the plurality of comb tooth parts are distributed in a peripheral direction of the vibrating diaphragm at intervals, wherein a position between every two adjacent comb tooth parts on the vibrating diaphragm is connected to the substrate via an insulating layer; and the comb tooth parts on the vibrating diaphragm are at least partially overlapped with the substrate, and a clearance exists between the comb tooth parts and the substrate and is configured as an airflow circulation channel. The microphone of the present invention has better impact resistance and can avoid intrusion of dust.

7. 发明授权

US10932064B2 Condenser microphone and electronic device 有权
公开(公告)号：US10932064B2
公开(公告)日：2021-02-23
申请号：US16475328
申请日：2017-10-25
申请人： GOERTEK INC.
发明人： Mengjin Cai , Junkai Zhan
IPC分类号： H04R19/04 , H04R7/04 , H04R7/16
摘要： The present invention provides a condenser microphone, comprising a substrate, and a back plate and a vibrating diaphragm which are arranged on the substrate; the back plate is arranged on the upper side and/or the lower side of the vibrating diaphragm; and the vibrating diaphragm is provided with a protruding layer or a corrugated membrane structure layer. With the above invention, the area of the vibrating diaphragm and the capacitance at the lateral side of the condenser microphone can be increased, so as to achieve the effect of improving the sensitivity of the condenser microphone.

8. 发明申请

US20190230439A1 VIBRATION DIAPHRAGM IN MEMS MICROPHONE AND MEMS MICROPHONE 审中-公开
公开(公告)号：US20190230439A1
公开(公告)日：2019-07-25
申请号：US16329193
申请日：2017-03-03
申请人： Goertek Inc.
发明人： Junkai Zhan , Mengjin Cai
IPC分类号： H04R7/00
摘要： The present invention discloses a vibration diaphragm in an MEMS microphone, and an MEMS microphone. The vibration diaphragm comprises a vibration diaphragm body (1) and at least one pressure relief device (2) defined by gaps (a) in the vibration diaphragm body (1), wherein the gaps (a) comprise at least two sections of circular arc-shaped gaps sequentially connected together. The two adjacent sections of circular arc-shaped gaps are in an S shape as a whole and centrosymmetrical with respect to a connected position thereof. The pressure relief device (2) comprises at least two valve clacks formed by at least two sections of adjacent circular arc-shaped gaps and neck portions connected to the valve clacks and the vibration diaphragm body (1) and of a constraint shape. When subjected to a relatively high sound pressure caused by, for example, mechanical shock, blowing or falling, the at least two valve clacks symmetrical in structure can warp upwards or downwards by taking respective neck portions as pivots. Therefore, an effective pressure relief path is formed, and the aim of pressure relief is achieved.

9. 发明申请

US20190052974A1 PIEZOELECTRIC MICROPHONE 审中-公开
公开(公告)号：US20190052974A1
公开(公告)日：2019-02-14
申请号：US15739935
申请日：2017-08-29
申请人： Goertek, Inc.
发明人： Junkai Zhan , Zonglin Zhou , Mengjin Cai
IPC分类号： H04R17/02 , H04R19/04
CPC分类号： H04R17/02 , H01L41/083 , H04R19/04 , H04R2201/003
摘要： The present invention discloses a piezoelectric microphone. The piezoelectric microphone comprises a substrate having a cavity-backed, and a piezoelectric film connected to the upper side of the substrate via an insulating layer. A position on the piezoelectric film, which is located at the inner side of a junction of the piezoelectric film and the substrate, is provided with a plurality of hollowed-out holes. The hollowed-out holes in the piezoelectric film are at least partly overlapped with the substrate. A gap is provided between the substrate and the position, where the hollowed-out holes are located, on the piezoelectric film. The gap and the hollowed-out holes a together form a channel. Compared with the traditional hollowed-out structure, the gap of the present invention can hinder the sound from directly spreading via the hollowed-out holes, thereby greatly reducing the amount of leakage of low-and-intermediate frequency signals of the piezoelectric microphone and improving the performance of the piezoelectric microphone. In addition, the gap can also effectively prevent a chip from being damaged by the invasion of dust, particles and water.

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