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1. 发明授权

US09113551B2 Rigid flex circuit board 有权
标题翻译：刚性柔性电路板
公开(公告)号：US09113551B2
公开(公告)日：2015-08-18
申请号：US13661585
申请日：2012-10-26
申请人： Google Inc.
发明人： Iain Richard Tyrone McClatchie , Ian Muldoon
IPC分类号： H05K1/03 , H05K7/02 , H05K1/02 , H05K1/14
CPC分类号： H05K7/02 , H05K1/14 , H05K1/147 , H05K1/148 , H05K3/4691 , H05K2201/10121 , H05K2201/10151 , Y10T428/24273 , Y10T428/24752
摘要： Systems, methods and articles of manufacture for rigid flex circuit boards are described herein. Embodiments of the present disclosure relate to equipping a rigid flex circuit board with a first rigid substrate, a second rigid substrate that includes an asymmetric region where the first rigid substrate is not extended over the asymmetric region of the second rigid substrate. The rigid flex circuit board also includes a flexible substrate between the first rigid substrate and the second rigid substrate. A second portion of the flexible substrate protrudes from the non-overlap region where the second portion of the flexible substrate is not adhered to the second rigid substrate in the non-overlap region. The second portion of the flexible substrate is configured to be accessible from the asymmetric region of the rigid flex circuit board.
摘要翻译：本文描述了用于刚性柔性电路板的系统，方法和制品。本公开的实施例涉及将刚性柔性电路板装配有第一刚性基板，第二刚性基板包括不对称区域，其中第一刚性基板未在第二刚性基板的不对称区域上延伸。刚性柔性电路板还包括在第一刚性基板和第二刚性基板之间的柔性基板。柔性基板的第二部分从非重叠区域突出，其中柔性基板的第二部分在非重叠区域中不粘附到第二刚性基板。柔性基板的第二部分构造成可从刚性柔性电路板的不对称区域接近。

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