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1. 发明授权

US09687662B2 Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device 有权
公开(公告)号：US09687662B2
公开(公告)日：2017-06-27
申请号：US14797123
申请日：2015-07-11
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
IPC分类号： B01J20/34 , A61N1/375 , A61N1/05 , H01G4/35 , H01G2/10 , H01R43/00 , A61N1/372 , C22C29/12
摘要： A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

2. 发明申请

US20170000502A1 GRAPHENE-ENHANCED ORTHOPEDIC CUTTING INSTRUMENTS 审中-公开
标题翻译：石墨增强型正切切割仪器
公开(公告)号：US20170000502A1
公开(公告)日：2017-01-05
申请号：US15201835
申请日：2016-07-05
申请人： Greatbatch Ltd.
发明人： Matthew L. Mroczkowski , Lasantha Viyannalage , Steven W. Winn
IPC分类号： A61B17/16
CPC分类号： A61B17/1666
摘要： An orthopedic reamer cutting tool is disclosed that incorporates a second material such as graphene having an increased coefficient of thermal conductivity to remove heat generated at the tissue cutting surface during use. The reamer is constructed having a hemispherical cutting shell that extends from an equatorial base to an apex at a distal end. A plurality of cutting teeth, each having a tissue cutting surface, extend from the exterior of the cutting shell. A reamer driver interface may be positioned spanning the diameter of the reamer base. The second material, having increased thermal conductivity, may be applied to the interior and/or exterior shell surfaces. In addition, the second material may be incorporated within the shell or the driver interface.
摘要翻译：公开了一种矫形刀铰刀切割工具，其包括具有增加的导热系数的第二材料，例如石墨烯，以去除在使用期间在组织切割表面产生的热量。铰刀被构造成具有从赤道基部延伸到远端的顶点的半球形切割壳体。每个具有组织切割表面的多个切割齿从切割壳的外部延伸。铰刀驱动器接口可以定位跨越铰刀基座的直径。具有增加的导热性的第二材料可以施加到内部和/或外部外壳表面。此外，第二材料可以结合在壳体或驱动器界面内。

3. 发明授权

US09492659B2 Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device 有权
标题翻译：与氧化铝基底和铂填充通孔用于有源可植入医疗器械的共烧密封馈通
公开(公告)号：US09492659B2
公开(公告)日：2016-11-15
申请号：US14182569
申请日：2014-02-18
申请人： Greatbatch Ltd.
发明人： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
IPC分类号： H01R43/00 , A61N1/08 , A61N1/05 , H01G4/35 , H01G2/10 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , A61N1/372 , A61N1/375 , C22C29/12
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
摘要翻译：共同燃烧的密封馈通可附接到主动植入式医疗装置。馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。通孔穿过氧化铝电介质基板从体液侧设置到器件侧。在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

4. 发明申请

US20160008595A1 EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：电磁干扰过滤共同连接的传播途径，有源可插拔医疗设备的有用电容器和引线组件
公开(公告)号：US20160008595A1
公开(公告)日：2016-01-14
申请号：US14864959
申请日：2015-09-25
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Thomas Marzano , Keith W. Seitz , Steven W. Winn , Christine A. Frysz , Richard L. Brendel , Jason Woods , Dominick J. Frustaci , Xiaohong Tang , William C. Thiebolt
IPC分类号： A61N1/08 , H02G3/22 , H01G4/40 , H01G4/005 , H01G4/12 , H01G4/35
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
摘要翻译：一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地电极板电耦合到外部金属化。导电引线设置在未填充的电容器通孔内。电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

5. 发明授权

US08938309B2 Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device 有权
标题翻译：适用于在有源可植入医疗装置的体液侧的电导体侧面附接的高密封气动穿通绝缘体
公开(公告)号：US08938309B2
公开(公告)日：2015-01-20
申请号：US13742781
申请日：2013-01-16
申请人： Greatbatch Ltd.
发明人： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Buehl E. Truex , Donald Hickel, Jr.
IPC分类号： A61N1/00 , H01R43/00 , A61N1/05 , A61N1/375 , H01G4/35 , H01G2/10 , A61N1/372 , C22C29/12
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
摘要翻译：升高的馈通可附接到有源可植入医疗装置的顶部或侧面。馈通包括导电套圈和电介质基片。电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。电介质基片包括通常在导电套圈上方升高的体液侧提升部分。至少一个通孔穿过电介质基底从体液侧设置到器件侧。导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。

6. 发明申请

US20130184796A1 Elevated Hermetic Feedthrough Insulator Adapted for Side Attachment of Electrical Conductors on the Body Fluid Side of an Active Implantable Medical Device 有权
标题翻译：适用于有源植入式医疗器械体液侧电导体侧面贴装的高密封绝缘体
公开(公告)号：US20130184796A1
公开(公告)日：2013-07-18
申请号：US13742781
申请日：2013-01-16
申请人： Greatbatch Ltd.
发明人： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Buehl E. Truex , Donald Hickel, Jr.
IPC分类号： A61N1/05
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
摘要翻译：升高的馈通可附接到有源可植入医疗装置的顶部或侧面。馈通包括导电套圈和电介质基片。电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。电介质基片包括通常在导电套圈上方升高的体液侧提升部分。至少一个通孔穿过电介质基底从体液侧设置到器件侧。导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。

7. 发明授权

US10143480B2 Disposable cutter acetabular reamer 有权
公开(公告)号：US10143480B2
公开(公告)日：2018-12-04
申请号：US14746386
申请日：2015-06-22
申请人： Greatbatch Ltd.
发明人： Gary C. Victor , Sean P. Curry , Steven W. Winn
IPC分类号： A61B17/16
摘要： An orthopedic bone cutter for cutting bone and tissue is described. The cutting device comprises a support frame having a plurality of radially extending struts to which a cutting shell is removably connected thereto. The frame serves as a universal support structure that provides added mechanical support and stability to which various embodiments of cutting shells may be connected thereto. The bone cutter of the present invention is designed such that the cutting shell may comprise a variety of embodiments that enable the removal of bone and tissue. Embodiments of the cutting shell may comprise at least a partially hemispherical shape in which a plurality of cutting surfaces may extend. In addition, the cutting shell may comprise a plurality of removal cutting blade inserts that are received within slots that extend through the shell thickness.

8. 发明授权

US09511220B2 Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device 有权
公开(公告)号：US09511220B2
公开(公告)日：2016-12-06
申请号：US14600401
申请日：2015-01-20
申请人： Greatbatch Ltd.
发明人： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Bruehl E. Truex , Donald H. Hickel, Jr.
IPC分类号： A61N1/00 , A61N1/08 , A61N1/05 , H01G4/35 , H01G2/10 , H01R43/00 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , A61N1/372 , A61N1/375 , C22C29/12
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

9. 发明申请

US20150134039A1 ELEVATED HERMETIC FEEDTHROUGH INSULATOR ADAPTED FOR SIDE ATTACHMENT OF ELECTRICAL CONDUCTORS ON THE BODY FLUID SIDE OF AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：适用于活动可植入医疗器械身体流体侧的电导体侧面连接的高效绝缘绝缘子
公开(公告)号：US20150134039A1
公开(公告)日：2015-05-14
申请号：US14600401
申请日：2015-01-20
申请人： Greatbatch Ltd.
发明人： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Bruehl E. Truex , Donald H. Hickel, JR.
IPC分类号： A61N1/375 , H01G2/10
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
摘要翻译：升高的馈通可附接到有源可植入医疗装置的顶部或侧面。馈通包括导电套圈和电介质基片。电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。电介质基片包括通常在导电套圈上方升高的体液侧提升部分。至少一个通孔穿过电介质基底从体液侧设置到器件侧。导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。

10. 发明授权

US08792987B2 Satellite therapy delivery system for brain neuromodulation 有权
标题翻译：用于脑神经调节的卫星治疗递送系统
公开(公告)号：US08792987B2
公开(公告)日：2014-07-29
申请号：US13858268
申请日：2013-04-08
申请人： Greatbatch Ltd.
发明人： Robert A. Stevenson , Christine A. Frysz , Barry C. Muffoletto , Robert W. Siegler , Steven W. Winn , Thomas A. Skwara , Dominick J. Frustaci
IPC分类号： A61N1/36 , A61N1/372
CPC分类号： A61N1/36135 , A61N1/36082 , A61N1/37282 , A61N1/37288
摘要： Deep brain electrodes are remotely sensed and activated by means of a remote active implantable medical device (AIMD). In a preferred form, a pulse generator is implanted in the pectoral region and includes a hermetic seal through which protrudes a conductive leadwire which provides an external antenna for transmission and reception of radio frequency (RF) pulses. One or more deep brain electrode modules are constructed and placed which can transmit and receive RF energy from the pulse generator. An RF telemetry link is established between the implanted pulse generator and the deep brain electrode assemblies. The satellite modules are configured for generating pacing pulses for a variety of disease conditions, including epileptic seizures, Turrets Syndrome, Parkinson's Tremor, and a variety of other neurological or brain disorders.
摘要翻译：通过远程有源可植入医疗设备（AIMD）远程感测和激活深脑电极。在优选形式中，脉冲发生器被植入胸部区域并且包括气密密封，通过该气密密封件突出提供用于射频（RF）脉冲的发射和接收的外部天线的导电引线。一个或多个深脑电极模块被构造和放置，其可以从脉冲发生器发射和接收RF能量。在植入的脉冲发生器和深脑电极组件之间建立RF遥测链路。卫星模块被配置用于产生用于各种疾病状况的起搏脉冲，包括癫痫发作，炮塔综合征，帕金森氏颤颤和各种其他神经或脑部疾病。

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