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1. 发明授权

US10785893B1 Heat dissipation module and electronic device 有权
公开(公告)号：US10785893B1
公开(公告)日：2020-09-22
申请号：US16403616
申请日：2019-05-06
申请人： HTC Corporation
发明人： Chih-Yao Kuo , Chin-Kai Sun , Chun-Lung Chu , Wei-Cheng Liu
IPC分类号： H05K7/20 , H05K7/14 , H05K1/18 , H05K5/03
摘要： A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.

2. 发明授权

US09568255B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US09568255B2
公开(公告)日：2017-02-14
申请号：US14257002
申请日：2014-04-21
申请人： HTC Corporation
发明人： Tzu-Chia Tan , Chin-Kai Sun , Jen-Cheng Lai , Chih-Lin Chang
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02 , F28D15/04 , H01L23/427
CPC分类号： F28D15/0275 , F28D15/0233 , F28D15/04 , G06F1/203 , H01L23/427
摘要： An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing.
摘要翻译：提供电子设备和散热板。电子设备包括框架或壳体，至少一个发热单元和热管，其中散热板包括框架和热管。热管设置在框架或壳体上。热管在框架或壳体上的正交投影部分地与发热装置在框架上或壳体上的正交投影重叠。

3. 发明授权

US10234915B2 Graphite thermal conductor, electronic device and method for manufacturing graphite thermal conductor 有权
公开(公告)号：US10234915B2
公开(公告)日：2019-03-19
申请号：US14848333
申请日：2015-09-09
申请人： HTC Corporation
发明人： Chin-Kai Sun , Jen-Cheng Lai , Jia-Yuan Hsu , Yi-Chang Huang , Chieh-Pei Chou
IPC分类号： G06F1/20 , B32B37/14 , B32B38/00 , B32B37/18 , H01L23/36 , H05K1/02 , H01L23/373
摘要： A graphite thermal conductor includes graphite bands laminated in the thickness direction. The thermal conductivity coefficient of each graphite band in the extending path is greater than the thermal conductivity coefficient thereof in the thickness direction. The extending path of each graphite band has at least one first bend in a plane which is perpendicular to the thickness direction. An electronic device applying the above graphite thermal conductor and a method for manufacturing graphite thermal conductor are also provided.

4. 发明授权

US10070552B2 Electronic device and component module 有权
公开(公告)号：US10070552B2
公开(公告)日：2018-09-04
申请号：US14856567
申请日：2015-09-17
申请人： HTC Corporation
发明人： Sheng-Ming Liu , Chin-Kai Sun
IPC分类号： H05K1/00 , H05K7/14 , H04M1/02 , H05K1/02 , H05K1/18
摘要： An electronic device and a component module thereof are provided, wherein the electronic device includes a housing, a component and a flexible substrate. The housing has a mounting region, and the component is disposed in the mounting region. The flexible substrate includes a bonding portion and an extending portion, wherein the bonding portion is disposed between the component and a carrying surface of the mounting region. The mounting portion has a first surface and a second surface opposite to the first surface, wherein the first surface is bonded to the component, and the second surface is bonded to the carrying surface. The extending portion is connected to the bonding portion and extended to the outside of the mounting region.

5. 发明申请

US20150249776A1 ELECTRONIC ELEMENT SUPPORTING BASE AND ELECTRONIC DEVICE 有权
标题翻译：电子元件支持基座和电子设备
公开(公告)号：US20150249776A1
公开(公告)日：2015-09-03
申请号：US14324082
申请日：2014-07-04
申请人： HTC Corporation
发明人： I-Te Chen , Wei-Cheng Liu , Chun Tseng , Jia-Yuan Hsu , Jen-Cheng Lai , Cheng-Chieh Chuang , Chin-Kai Sun
IPC分类号： H04N5/225
CPC分类号： H04N5/2257 , H04M1/0264 , H04M1/185 , H04N5/2251 , H04N5/2252
摘要： An electronic element supporting base and an electronic device applying the same are provided. The electronic element supporting base comprises a fixing portion and a carrying part. The fixing portion is suitable for being fixed to a frame of the electronic device as a fulcrum for the electronic element supporting base. The carrying part is suitable for carrying a plurality of electronic elements, wherein a gap exists between the carrying part and the frame, and a gap exists between the carrying part and the circuit board. When the electronic device receives an impact, the suspended design of the electronic element supporting base allows the carrying part to oscillate through the gaps, and the electronic element supporting base will not be squeezed, which prevents the electronic elements on the electronic element supporting base from being shifted.
摘要翻译：提供电子元件支撑基座和应用该电子元件支撑基座的电子设备。电子元件支撑基座包括固定部和承载部。固定部分适合固定在电子装置的框架上作为电子元件支撑底座的支点。携带部分适用于承载多个电子元件，其中在承载部分和框架之间存在间隙，并且在承载部分和电路板之间存在间隙。当电子设备接收到冲击时，电子元件支撑底座的悬挂设计允许承载部件通过间隙振荡，并且电子元件支撑基座不会被挤压，这防止电子元件支撑基座上的电子元件正在转移

6. 发明申请

US20220120284A1 FAN BLADE AND FABRICATING METHOD THEREOF 有权
公开(公告)号：US20220120284A1
公开(公告)日：2022-04-21
申请号：US17073418
申请日：2020-10-19
申请人： HTC Corporation
发明人： Chih-Yao Kuo , Chin-Kai Sun , Chung-Chiao Tan
IPC分类号： F04D29/28 , B05D1/12 , B05D3/00
摘要： A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 μm to 130 μm.

7. 发明授权

US11249514B2 Head-mounted display device 有权
公开(公告)号：US11249514B2
公开(公告)日：2022-02-15
申请号：US16921943
申请日：2020-07-07
申请人： HTC Corporation
发明人： Chih-Yao Kuo , Chin-Kai Sun , Chung-Chiao Tan
IPC分类号： H05K7/20 , G06F1/16
摘要： A head-mounted display device includes a casing, a control circuit board and a fan. The casing has a heat dissipation hole, and a face side and an external side opposite each other. The control circuit board is disposed in the casing. The fan is disposed in the casing and located between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole.

8. 发明申请

US20210265718A1 ELECTRONIC DEVICE 有权
公开(公告)号：US20210265718A1
公开(公告)日：2021-08-26
申请号：US17013878
申请日：2020-09-08
申请人： HTC Corporation
发明人： Chih-Yao Kuo , Chin-Kai Sun , Chung-Chiao Tan , Wei-Cheng Liu
IPC分类号： H01Q1/02 , H05K7/20 , H01Q1/22
摘要： An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.

9. 发明授权

US10667428B1 Heat dissipation module manufacturing method, heat dissipation module and electronic device 有权
公开(公告)号：US10667428B1
公开(公告)日：2020-05-26
申请号：US16419015
申请日：2019-05-22
申请人： HTC Corporation
发明人： Chih-Yao Kuo , Chin-Kai Sun , Chun-Lung Chu , Wei-Cheng Liu
IPC分类号： H05K7/20
摘要： A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

10. 发明申请

US20150300750A1 ELECTRONIC DEVICE AND HEAT DISSIPATION PLATE 有权
标题翻译：电子设备和散热板
公开(公告)号：US20150300750A1
公开(公告)日：2015-10-22
申请号：US14257002
申请日：2014-04-21
申请人： HTC Corporation
发明人： Tzu-Chia Tan , Chin-Kai Sun , Jen-Cheng Lai , Chih-Lin Chang
IPC分类号： F28D15/02 , G06F1/20 , F28D15/04
CPC分类号： F28D15/0275 , F28D15/0233 , F28D15/04 , G06F1/203 , H01L23/427
摘要： An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing.
摘要翻译：提供电子设备和散热板。电子设备包括框架或壳体，至少一个发热单元和热管，其中散热板包括框架和热管。热管设置在框架或壳体上。热管在框架或壳体上的正交投影部分地与发热装置在框架上或壳体上的正交投影重叠。

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