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1. 发明申请

US20120184086A1 PUNCH SINGULATION SYSTEM AND METHOD 审中-公开
标题翻译： PUNCH SINGULATION系统和方法
公开(公告)号：US20120184086A1
公开(公告)日：2012-07-19
申请号：US13498577
申请日：2010-09-24
申请人： Hae Choon Yang , Xue Fang Shen , Deok Chun Jang , Chong Chen Lim , Siok Chun Lim , Yun Suk Shin
发明人： Hae Choon Yang , Xue Fang Shen , Deok Chun Jang , Chong Chen Lim , Siok Chun Lim , Yun Suk Shin
IPC分类号： H01L21/78 , B26D7/06 , B26D5/20
CPC分类号： H01L21/67092 , H01L21/67132 , Y10T83/647 , Y10T83/6572
摘要： A punching system for singulating IC units comprising: a punching assembly arranged to receive a substrate and singulate said substrate into the IC units; a rotary carrier rotatable from a first position to a second position said rotary carrier arranged to receive said units at the first position and carry said units to the second position through rotation; wherein said rotary carrier includes recesses for receiving at least a portion of the units. A punching assembly comprising a die block having recesses for receiving selectively replaceable inserts wherein said inserts correspond to a punch pattern specific to a predetermined IC package arrangement.
摘要翻译：一种用于分离IC单元的冲压系统，包括：冲压组件，布置成接收衬底并将所述衬底分离成IC单元; 旋转载体，可从第一位置旋转到第二位置，所述旋转载体布置成在第一位置处接收所述单元，并通过旋转将所述单元运送到第二位置; 其中所述旋转载体包括用于容纳所述单元的至少一部分的凹部。一种冲压组件，其包括具有用于接收可选择性地替换的插入件的凹部的模具块，其中所述插入件对应于特定于预定IC封装布置的冲压模式。

2. 发明授权

US07939374B2 Supply mechanism for the chuck of an integrated circuit dicing device 有权
标题翻译：集成电路切割装置卡盘的供电机构
公开(公告)号：US07939374B2
公开(公告)日：2011-05-10
申请号：US12895342
申请日：2010-09-30
申请人： Hae Choon Yang
发明人： Hae Choon Yang
IPC分类号： H01L21/00
CPC分类号： H01L21/67144 , B28D5/0082 , B28D5/0094 , H01L21/67092 , H01L21/78
摘要： A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).
摘要翻译：用于切割基板以对其内的集成电路单元进行切割的系统包括与卡盘台（4）一起操作的切割机（Z）。提升组件（Ax，Ay）基本上同时从基板（4）移除先前分离的单元的同时将衬底分离到卡盘台（4）上。

3. 发明申请

US20130209205A1 SYSTEM AND METHOD FOR OFFLOADING IC UNITS 审中-公开
标题翻译：用于卸载IC单元的系统和方法
公开(公告)号：US20130209205A1
公开(公告)日：2013-08-15
申请号：US13879323
申请日：2011-07-26
申请人： Hae Choon Yang , Deok Chun Jang
发明人： Hae Choon Yang , Deok Chun Jang
IPC分类号： H01L21/677
CPC分类号： H01L21/67766 , H01L21/67333 , H01L21/67721 , H01L21/67778
摘要： A shuttle table assembly comprising a shuttle table for receiving a plurality of IC units at a first position and for offloading said units at a second position, said shuttle table movable from said first to second position; a cover assembly mounted to said shuttle table, the cover assembly having at least one cover movable from an open position to a closed position, said closed position covering said units on the shuttle table; wherein the cover assembly is coupled to a guide for closing the cover as the shuttle table moves from the first to the second position.
摘要翻译：一种梭床组件，包括用于在第一位置处接纳多个IC单元并在第二位置卸载所述单元的梭床，所述梭台可从所述第一位置移动到第二位置; 安装到所述梭台的盖组件，所述盖组件具有至少一个可从打开位置移动到关闭位置的盖，所述关闭位置覆盖所述穿梭台上的所述单元; 其中当所述梭台从所述第一位置移动到所述第二位置时，所述盖组件联接到导向件以关闭所述盖。

4. 发明申请

US20080118997A1 Vacuum Holder For Integrated Circuit Units 有权
标题翻译：集成电路单元真空支架
公开(公告)号：US20080118997A1
公开(公告)日：2008-05-22
申请号：US11662283
申请日：2005-07-19
申请人： Hae Choon Yang
发明人： Hae Choon Yang
IPC分类号： H01L21/00
CPC分类号： H01L21/67333 , B25B11/005 , H01L21/67336 , Y10T279/11
摘要： A support device for supporting a set of integrated circuit units (65), the device comprising: a support member having a metal surface, said surface having an array of recesses (27); a soft material layer, overlaying the recesses of the metal surface so as to protect the units (65) from damage caused by contact with the metal surface, and; a vacuum means (35) in communication with said recesses (27), such that the vacuum means supports each unit within a respective recess, wherein the soft material layer is formed of a plurality of independent inserts (40), each insert engageable with at least one recess using engagement means (50, 55) for engaging each insert (40) with the at least one recess (27).
摘要翻译：一种用于支撑一组集成电路单元（65）的支撑装置，该装置包括：具有金属表面的支撑构件，所述表面具有凹槽阵列（27）; 软材料层，覆盖金属表面的凹部，以保护单元（65）免受与金属表面接触所造成的损害; 与所述凹部（27）连通的真空装置（35），使得所述真空装置支撑相应凹部内的每个单元，其中所述软材料层由多个独立的插入件（40）形成，每个插入件可接合于至少一个凹槽，其使用用于使每个插入件（40）与所述至少一个凹部（27）接合的接合装置（50,55）。

5. 发明授权

US08997592B2 Assembly and method for IC unit engagement 有权
标题翻译：集成电路单元接合的装配和方法
公开(公告)号：US08997592B2
公开(公告)日：2015-04-07
申请号：US13518973
申请日：2010-12-23
申请人： Hae Choon Yang , Jong Jae Jung , Deok Chun Jang , Chong Chen Gary Lim
发明人： Hae Choon Yang , Jong Jae Jung , Deok Chun Jang , Chong Chen Gary Lim
IPC分类号： H01L21/677 , B65H29/00 , H05K13/04
CPC分类号： H05K13/0408 , H05K13/0409 , H05K13/041 , H05K13/0413 , H05K13/0478 , Y10T74/18296 , Y10T74/19051
摘要： A picker assembly includes a plurality of pickers in selective variable spaced relation, a shaft having a plurality of cam plates, the cam plates co-axial with said shaft and having a variable thickness. The cam plates are in engagement with the pickers and positioned in interstitial spaces between the pickers. The selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.
摘要翻译：选择器组件包括多个选择性可变间隔关系的拾取器，具有多个凸轮板的轴，所述凸轮板与所述轴同轴并且具有可变的厚度。凸轮板与拾取器接合并定位在拾取器之间的间隙空间中。通过轴的旋转来提供间隔的选择性变化，使得凸轮板的厚度变化沿着平行于轴的轴线移动各个拾取器。

6. 发明授权

US07829383B2 Supply mechanism for the chuck of an integrated circuit dicing device 有权
标题翻译：集成电路切割装置卡盘的供电机构
公开(公告)号：US07829383B2
公开(公告)日：2010-11-09
申请号：US11660940
申请日：2005-08-23
申请人： Hae Choon Yang
发明人： Hae Choon Yang
IPC分类号： H01L21/00
CPC分类号： H01L21/67144 , B28D5/0082 , B28D5/0094 , H01L21/67092 , H01L21/78
摘要： A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).
摘要翻译：用于切割基板以对其内的集成电路单元进行切割的系统包括与卡盘台（4）一起操作的切割机（Z）。提升组件（Ax，Ay）基本上同时从基板（4）移除先前分离的单元的同时将衬底分离到卡盘台（4）上。

7. 发明授权

US07540503B2 Vacuum holder for integrated circuit units 有权
标题翻译：集成电路单元的真空支架
公开(公告)号：US07540503B2
公开(公告)日：2009-06-02
申请号：US11662283
申请日：2005-07-19
申请人： Hae Choon Yang
发明人： Hae Choon Yang
IPC分类号： B23B31/30
CPC分类号： H01L21/67333 , B25B11/005 , H01L21/67336 , Y10T279/11
摘要： A support device for supporting a set of integrated circuit units (65), the device comprising: a support member having a metal surface, said surface having an array of recesses (27); a soft material layer, overlaying the recesses of the metal surface so as to protect the units (65) from damage caused by contact with the metal surface, and; a vacuum means (35) in communication with said recesses (27), such that the vacuum means supports each unit within a respective recess, wherein the soft material layer is formed of a plurality of independent inserts (40), each insert engageable with at least one recess using engagement means (50, 55) for engaging each insert (40) with the at least one recess (27).
摘要翻译：一种用于支撑一组集成电路单元（65）的支撑装置，该装置包括：具有金属表面的支撑构件，所述表面具有凹槽阵列（27）; 软材料层，覆盖金属表面的凹部，以保护单元（65）免受与金属表面接触所造成的损害; 与所述凹部（27）连通的真空装置（35），使得所述真空装置支撑相应凹部内的每个单元，其中所述软材料层由多个独立的插入件（40）形成，每个插入件可接合于至少一个凹槽，其使用用于使每个插入件（40）与所述至少一个凹部（27）接合的接合装置（50,55）。

8. 发明授权

US08890018B2 Method and apparatus for improved sorting of diced substrates 有权
标题翻译：用于改进切割底物分选的方法和装置
公开(公告)号：US08890018B2
公开(公告)日：2014-11-18
申请号：US13513540
申请日：2010-11-30
申请人： Jong Jae Jung , Yun Suk Shin , Hae Choon Yang , Deok Chun Jang
发明人： Jong Jae Jung , Yun Suk Shin , Hae Choon Yang , Deok Chun Jang
IPC分类号： B07C5/344 , H01L21/66
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.
摘要翻译：一种用于检查和分类多个IC单元的方法，包括以下步骤：将包含所述IC单元的帧传送到单元拾取站; 在交付步骤期间对所述单元进行第一次检查并记录随后的结果; 从所述框架中移除所述单元，并将所述单元从所述单元采集站移动到翻转站; 在移动步骤期间对所述单元进行第二次检查并记录随后的结果; 翻转所述单位暴露对面的所述单位; 对所述相对面进行第三次检查并记录随后的结果; 基于来自第一，第二和第三检查步骤的记录结果将所述单元分类成类别。

9. 发明申请

US20130008836A1 METHOD AND APPARATUS FOR IMPROVED SORTING OF DICED SUBSTRATES 有权
标题翻译：改进定位基板的方法和装置
公开(公告)号：US20130008836A1
公开(公告)日：2013-01-10
申请号：US13513540
申请日：2010-11-30
申请人： Jong Jae Jung , Yun Suk Shin , Hae Choon Yang , Deok Chun Jang
发明人： Jong Jae Jung , Yun Suk Shin , Hae Choon Yang , Deok Chun Jang
IPC分类号： B07C5/00 , H01L21/66
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.
摘要翻译：一种用于检查和分类多个IC单元的方法，包括以下步骤：将包含所述IC单元的帧传送到单元拾取站; 在交付步骤期间对所述单元进行第一次检查并记录随后的结果; 从所述框架中移除所述单元，并将所述单元从所述单元采集站移动到翻转站; 在移动步骤期间对所述单元进行第二次检查并记录随后的结果; 翻转所述单位暴露对面的所述单位; 对所述相对面进行第三次检查并记录随后的结果; 基于来自第一，第二和第三检查步骤的记录结果将所述单元分类成类别。

10. 发明申请

US20120260752A1 ASSEMBLY AND METHOD FOR IC UNIT ENGAGEMENT 有权
标题翻译： IC单元接合的组装和方法
公开(公告)号：US20120260752A1
公开(公告)日：2012-10-18
申请号：US13518973
申请日：2010-12-23
申请人： Hae Choon Yang , Jong Jae Jung , Deck Chun Jang , Chong Chen Gary Lim
发明人： Hae Choon Yang , Jong Jae Jung , Deck Chun Jang , Chong Chen Gary Lim
IPC分类号： F16H25/14 , F16H37/06
CPC分类号： H05K13/0408 , H05K13/0409 , H05K13/041 , H05K13/0413 , H05K13/0478 , Y10T74/18296 , Y10T74/19051
摘要： A picker assembly includes a plurality of pickers in selective variable spaced relation, a shaft having a plurality of cam plates, the cam plates co-axial with said shaft and having a variable thickness. The cam plates are in engagement with the pickers and positioned in interstitial spaces between the pickers. The selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.
摘要翻译：选择器组件包括多个选择性可变间隔关系的拾取器，具有多个凸轮板的轴，所述凸轮板与所述轴同轴并且具有可变的厚度。凸轮板与拾取器接合并定位在拾取器之间的间隙空间中。通过轴的旋转来提供间隔的选择性变化，使得凸轮板的厚度变化沿着平行于轴的轴线移动各个拾取器。

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