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1. 发明授权

US07759745B2 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US07759745B2
公开(公告)日：2010-07-20
申请号：US11656437
申请日：2007-01-23
申请人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
发明人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119 , H01L27/10 , H01L29/739
CPC分类号： H01L27/11521 , H01L21/823425 , H01L21/823468 , H01L27/115 , H01L27/11568 , Y10S257/90
摘要： A drain (7) includes a lightly-doped shallow impurity region (7a) aligned with a control gate (5), and a heavily-doped deep impurity region (7b) aligned with a sidewall film (8) and doped with impurities at a concentration higher than that of the lightly-doped shallow impurity region (7a). The lightly-doped shallow impurity region (7a) leads to improvement of the short-channel effect and programming efficiency. A drain contact hole forming portion (70) is provided to the heavily-doped impurity region (7b) to reduce the contact resistance at the drain (7).
摘要翻译：漏极（7）包括与控制栅极（5）对准的轻掺杂浅杂质区域（7a）和与侧壁膜（8）对准并在其上掺杂有杂质的重掺杂深杂质区域（7b）浓度高于轻掺杂浅杂质区（7a）的浓度。轻掺杂的浅杂质区（7a）导致短沟道效应和编程效率的改善。漏极接触孔形成部分（70）设置到重掺杂杂质区域（7b）以降低漏极（7）处的接触电阻。

2. 发明授权

US07683440B2 Semiconductor memory device 有权
公开(公告)号：US07683440B2
公开(公告)日：2010-03-23
申请号：US11656437
申请日：2007-01-23
申请人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
发明人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119 , H01L27/10 , H01L29/739
摘要： A drain (7) includes a lightly-doped shallow impurity region (7a) aligned with a control gate (5), and a heavily-doped deep impurity region (7b) aligned with a sidewall film (8) and doped with impurities at a concentration higher than that of the lightly-doped shallow impurity region (7a). The lightly-doped shallow impurity region (7a) leads to improvement of the short-channel effect and programming efficiency. A drain contact hole forming portion (70) is provided to the heavily-doped impurity region (7b) to reduce the contact resistance at the drain (7).

3. 发明授权

US07482226B2 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US07482226B2
公开(公告)日：2009-01-27
申请号：US11656438
申请日：2007-01-23
申请人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
发明人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
IPC分类号： H01L21/336
CPC分类号： H01L27/11521 , H01L21/823425 , H01L21/823468 , H01L27/115 , H01L27/11568 , Y10S257/90
摘要： A drain (7) includes a lightly-doped shallow impurity region (7a) aligned with a control gate (5), and a heavily-doped deep impurity region (7b) aligned with a sidewall film (8) and doped with impurities at a concentration higher than that of the lightly-doped shallow impurity region (7a). The lightly-doped shallow impurity region (7a) leads to improvement of the short-channel effect and programming efficiency. A drain contact hole forming portion (70) is provided to the heavily-doped impurity region (7b) to reduce the contact resistance at the drain (7).
摘要翻译：漏极（7）包括与控制栅极（5）对准的轻掺杂浅杂质区域（7a）和与侧壁膜（8）对准并在其上掺杂有杂质的重掺杂深杂质区域（7b）浓度高于轻掺杂浅杂质区（7a）的浓度。轻掺杂的浅杂质区（7a）导致短沟道效应和编程效率的改善。漏极接触孔形成部分（70）设置到重掺杂杂质区域（7b）以降低漏极（7）处的接触电阻。

4. 发明授权

US07202540B2 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US07202540B2
公开(公告)日：2007-04-10
申请号：US11066567
申请日：2005-02-28
申请人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
发明人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L27/11521 , H01L21/823425 , H01L21/823468 , H01L27/115 , H01L27/11568 , Y10S257/90
摘要： A drain (7) includes a lightly-doped shallow impurity region (7a) aligned with a control gate (5), and a heavily-doped deep impurity region (7b) aligned with a sidewall film (8) and doped with impurities at a concentration higher than that of the lightly-doped shallow impurity region (7a). The lightly-doped shallow impurity region (7a) leads to improvement of the short-channel effect and programming efficiency. A drain contact hole forming portion (70) is provided to the heavily-doped impurity region (7b) to reduce the contact resistance at the drain (7).
摘要翻译：漏极（7）包括与控制栅极（5）对准的轻掺杂浅杂质区域（7a）和与侧壁膜（8）对准并掺杂杂质的重掺杂深杂质区域（7b）其浓度高于轻掺杂浅杂质区（7a）的浓度。轻掺杂的浅杂质区域（7a）导致短沟道效应和编程效率的改善。漏极接触孔形成部分（70）设置到重掺杂杂质区域（7b）以降低漏极（7）处的接触电阻。

5. 发明申请

US20070114617A1 Semiconductor memory device 有权
公开(公告)号：US20070114617A1
公开(公告)日：2007-05-24
申请号：US11656437
申请日：2007-01-23
申请人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
发明人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
IPC分类号： H01L29/76 , H01L29/94 , H01L31/00
CPC分类号： H01L27/11521 , H01L21/823425 , H01L21/823468 , H01L27/115 , H01L27/11568 , Y10S257/90
摘要： A drain (7) includes a lightly-doped shallow impurity region (7a) aligned with a control gate (5), and a heavily-doped deep impurity region (7b) aligned with a sidewall film (8) and doped with impurities at a concentration higher than that of the lightly-doped shallow impurity region (7a). The lightly-doped shallow impurity region (7a) leads to improvement of the short-channel effect and programming efficiency. A drain contact hole forming portion (70) is provided to the heavily-doped impurity region (7b) to reduce the contact resistance at the drain (7).

6. 发明申请

US20050230714A1 Semiconductor memory device and manufacturing method thereof 有权
标题翻译：半导体存储器件及其制造方法
公开(公告)号：US20050230714A1
公开(公告)日：2005-10-20
申请号：US11066567
申请日：2005-02-28
申请人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
发明人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
IPC分类号： H01L21/8234 , H01L21/8247 , H01L27/115 , H01L29/788 , H01L29/792 , H01L21/336 , H01L29/80 , H01L31/112
CPC分类号： H01L27/11521 , H01L21/823425 , H01L21/823468 , H01L27/115 , H01L27/11568 , Y10S257/90
摘要： A drain (7) comprises a lightly-doped shallow impurity region (7a) aligned with a control gate (5), and a heavily-doped deep impurity region (7b) aligned with a sidewall film (8) and doped with impurities at a concentration higher than that of the lightly-doped shallow impurity region (7a). The lightly-doped shallow impurity region (7a) leads to improvement of the short-channel effect and programming efficiency. A drain contact hole forming portion (70) is provided to the heavily-doped impurity region (7b) to reduce the contact resistance at the drain (7).
摘要翻译：漏极（7）包括与控制栅极（5）对准的轻掺杂浅杂质区域（7a）和与侧壁膜（8）对准并掺杂杂质的重掺杂深杂质区域（7b）其浓度高于轻掺杂浅杂质区（7a）的浓度。轻掺杂的浅杂质区域（7a）导致短沟道效应和编程效率的改善。漏极接触孔形成部分（70）设置到重掺杂杂质区域（7b）以降低漏极（7）处的接触电阻。

7. 发明申请

US20070117303A1 Semiconductor memory device (as amended) 有权
标题翻译：半导体存储器件（经修改）
公开(公告)号：US20070117303A1
公开(公告)日：2007-05-24
申请号：US11656438
申请日：2007-01-23
申请人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
发明人： Hideki Komori , Hisayuki Shimada , Yu Sun , Hiroyuki Kinoshita
IPC分类号： H01L21/8238
CPC分类号： H01L27/11521 , H01L21/823425 , H01L21/823468 , H01L27/115 , H01L27/11568 , Y10S257/90
摘要： A drain (7) includes a lightly-doped shallow impurity region (7a) aligned with a control gate (5), and a heavily-doped deep impurity region (7b) aligned with a sidewall film (8) and doped with impurities at a concentration higher than that of the lightly-doped shallow impurity region (7a). The lightly-doped shallow impurity region (7a) leads to improvement of the short-channel effect and programming efficiency. A drain contact hole forming portion (70) is provided to the heavily-doped impurity region (7b) to reduce the contact resistance at the drain (7).
摘要翻译：漏极（7）包括与控制栅极（5）对准的轻掺杂浅杂质区域（7a）和与侧壁膜（8）对准并掺杂杂质的重掺杂深杂质区域（7b）其浓度高于轻掺杂浅杂质区（7a）的浓度。轻掺杂的浅杂质区（7a）导致短沟道效应和编程效率的提高。漏极接触孔形成部分（70）设置到重掺杂杂质区域（7b）以降低漏极（7）处的接触电阻。

8. 发明授权

US07439141B2 Shallow trench isolation approach for improved STI corner rounding 有权
标题翻译：浅沟隔离方法可改善STI拐角四舍五入
公开(公告)号：US07439141B2
公开(公告)日：2008-10-21
申请号：US10277395
申请日：2002-10-22
申请人： Unsoon Kim , Yu Sun , Hiroyuki Kinoshita , Kuo-Tung Chang , Harpreet K. Sachar , Mark S. Chang
发明人： Unsoon Kim , Yu Sun , Hiroyuki Kinoshita , Kuo-Tung Chang , Harpreet K. Sachar , Mark S. Chang
IPC分类号： H01L21/00
CPC分类号： H01L21/76235
摘要： A method for performing shallow trench isolation during semiconductor fabrication that improves trench corner rounding is disclosed. The method includes etching trenches into a silicon substrate between active regions, and performing a double liner oxidation process on the trenches. The method further includes performing a double sacrificial oxidation process on the active regions, wherein corners of the trenches are substantially rounded by the four oxidation processes.
摘要翻译：公开了一种用于在半导体制造期间进行浅沟槽隔离的方法，其改善沟槽角圆化。该方法包括将沟槽蚀刻到有源区域之间的硅衬底中，并在沟槽上执行双衬层氧化工艺。该方法还包括对活性区域进行双重牺牲氧化处理，其中沟槽的角通过四个氧化过程基本上被圆化。

9. 发明申请

US20060223278A1 Non-critical complementary masking method for poly-1 definition in flash memory device fabrication 有权
标题翻译：闪存器件制造中poly-1定义的非关键互补掩模方法
公开(公告)号：US20060223278A1
公开(公告)日：2006-10-05
申请号：US11099339
申请日：2005-04-04
申请人： Unsoon Kim , Hiroyuki Kinoshita , Yu Sun , Krishnashree Achuthan , Christopher Raeder , Christopher Foster , Harpreet Sachar , Kashmir Sahota
发明人： Unsoon Kim , Hiroyuki Kinoshita , Yu Sun , Krishnashree Achuthan , Christopher Raeder , Christopher Foster , Harpreet Sachar , Kashmir Sahota
IPC分类号： H01L21/76
CPC分类号： H01L27/105 , H01L21/3212 , H01L21/32139 , H01L21/76229 , H01L27/1052 , H01L27/11526 , H01L27/11543 , H01L27/11568
摘要： A method is disclosed for the definition of the poly-1 layer in a semiconductor wafer. A non-critical mask is used to recess field oxides in the periphery prior to poly-1 deposition by an amount equal to the final poly-1 thickness. A complimentary non-critical mask is used to permit CMP of the core to expose the tops of core oxide mesas from the shallow isolation trenches.
摘要翻译：公开了一种用于在半导体晶片中定义多晶硅层的方法。使用非临界掩模在聚-1沉积之前将外围的场氧化物凹入等于最终聚-1厚度的量。使用互补的非关键掩模来允许芯的CMP将浅层隔离沟的核心氧化物台面的顶部暴露出来。

10. 发明授权

US06995437B1 Semiconductor device with core and periphery regions 有权
标题翻译：具有核心和外围区域的半导体器件
公开(公告)号：US06995437B1
公开(公告)日：2006-02-07
申请号：US10869774
申请日：2004-06-16
申请人： Hiroyuki Kinoshita , Yu Sun , Basab Banerjee , Christopher M. Foster , John R. Behnke , Cyrus Tabery
发明人： Hiroyuki Kinoshita , Yu Sun , Basab Banerjee , Christopher M. Foster , John R. Behnke , Cyrus Tabery
IPC分类号： H01L31/119
CPC分类号： H01L27/105 , H01L27/11568 , H01L27/11573
摘要： A method for forming a semiconductor device that includes a line and space pattern with variable pitch and critical dimensions in a layer on a substrate. The substrate includes a first region (e.g., a core region) and a second region (e.g., a periphery region). A first sub-line and space pattern in the first region comprises a space of a dimension (A) less than achievable by lithographic processes alone. Further, a second sub-line and space pattern in the second region comprises at least one line including a second critical dimension (B) achievable by lithography. The method uses two critical masking steps to form a hard mask that includes in the core region a critical dimension (A) less than achievable at a resolution limit of lithography. Further, the method uses a single etch step to transfer the pattern of the hard mask to the layer.
摘要翻译：一种用于形成半导体器件的方法，其包括在衬底上的层中具有可变节距和临界尺寸的线和间隔图案。衬底包括第一区域（例如芯区域）和第二区域（例如，周边区域）。第一区域中的第一子线和空间图案包括尺寸（A）的空间小于单独通过光刻工艺可实现的尺寸。此外，第二区域中的第二子线和空间图案包括至少一条线，其包括通过光刻可实现的第二临界尺寸（B）。该方法使用两个关键的掩模步骤来形成硬掩模，其在芯部区域中包括小于在光刻的分辨率极限下可实现的临界尺寸（A）。此外，该方法使用单个蚀刻步骤将硬掩模的图案转移到该层。

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