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    • 4. 发明授权
    • Method for manufacturing semiconductor laser device
    • 制造半导体激光器件的方法
    • US06703254B2
    • 2004-03-09
    • US10111280
    • 2002-04-22
    • Kimihiko SaitohAkira IzumiHideki Matsumura
    • Kimihiko SaitohAkira IzumiHideki Matsumura
    • H01L2100
    • H01S5/028H01S5/0202H01S5/0282
    • A semiconductor thin film including a well layer is laminated on a semiconductor substrate, the semiconductor substrate and the semiconductor thin film is cleaved, and a cleavage plane of the semiconductor substrate and the semiconductor thin film, which is obtained by the cleaving, is exposed to an atmosphere produced by decomposition of a gas containing N-atoms under the presence of a heated catalytic substance, thereby a surface layer of the cleavage plane is removed and a nitride layer is formed on the surface. Subsequently, a dielectric film is formed on the cleavage plane. According to the above technique, a natural oxide film formed on the cleavage plane can be removed and also a protective film can be formed by using a catalytic CVD apparatus.
    • 包含阱层的半导体薄膜层叠在半导体衬底上,半导体衬底和半导体薄膜被切割,并且通过劈裂获得的半导体衬底和半导体薄膜的解理面暴露于 在加热的催化物质的存在下,通过分解含有N-原子的气体产生的气氛,从而去除了解理面的表面层,并且在表面上形成氮化物层。 随后,在解理面上形成电介质膜。 根据上述技术,可以去除在解理面上形成的天然氧化物膜,并且也可以使用催化CVD装置形成保护膜。