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1. 发明申请

US20180104837A1 Chemically Sharpening Blades 审中-公开
公开(公告)号：US20180104837A1
公开(公告)日：2018-04-19
申请号：US15845351
申请日：2017-12-18
申请人： Hutchinson Technology Incorporated
发明人： Paul V. Pesavento , Peter F. Ladwig , Michael W. Davis , John A. Theget , Kurt C. Swanson , Joel B. Michaletz , Philip W. Anderson , Timothy A. McDaniel
IPC分类号： B26D1/00 , C23F1/04 , B26B9/00 , B26B9/02
CPC分类号： B26D1/0006 , B26B9/00 , B26B9/02 , B26D2001/0053 , C23F1/04
摘要： A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.

2. 发明授权

US08885297B1 Electrical contacts to motors in dual stage actuated suspensions 有权
公开(公告)号：US08885297B1
公开(公告)日：2014-11-11
申请号：US14335967
申请日：2014-07-21
申请人： Hutchinson Technology Incorporated
发明人： Jacob D. Bjorstrom , Nole D. German , Paul V. Pesavento , Zachary A. Pokornowski , Ryan N. Ruzicka , Kurt C. Swanson , Allan D. Tokuda
IPC分类号： G11B5/55
CPC分类号： G11B5/486 , G11B5/483 , G11B5/4833
摘要： Various embodiments concern a dual stage actuation flexure having a motor contact paddle for connecting to a terminal of a piezoelectric motor. The flexure comprises a paddle having a top side and a bottom side, the paddle comprising at least one void, each void extending through the paddle from the bottom side to the top side. The paddle further comprises a stainless steel base, a conductor comprising a layer of metal, and a dielectric layer having a first section and a second section, the first section positioned between the conductor and the stainless steel base to overlap the stainless steel base and the second section extending beyond the stainless steel base to not overlap the stainless steel base. The bottom side of the paddle is configured to connect to the terminal with electrically conductive adhesive.

3. 发明申请

US20220351893A1 High-Aspect Ratio Electroplated Structures And Anisotropic Electroplating Processes 有权
公开(公告)号：US20220351893A1
公开(公告)日：2022-11-03
申请号：US17862183
申请日：2022-07-11
申请人： Hutchinson Technology Incorporated
发明人： Douglas P. Riemer , Kurt C. Swanson , Peter F. Ladwig , Matthew S. Lang , Paul V. Pesavento , Joseph D. Starkey
IPC分类号： H01F27/28 , H01F5/00 , C25D7/00 , C25D5/02
摘要： A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

4. 发明授权

US11387033B2 High-aspect ratio electroplated structures and anisotropic electroplating processes 有权
公开(公告)号：US11387033B2
公开(公告)日：2022-07-12
申请号：US16693169
申请日：2019-11-22
申请人： Hutchinson Technology Incorporated
发明人： Douglas P. Riemer , Kurt C. Swanson , Peter F. Ladwig , Matthew S. Lang , Paul V. Pesavento , Joseph D. Starkey
IPC分类号： B32B3/00 , H01F27/28 , H01F5/00 , C25D7/00 , C25D5/02
摘要： A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.

5. 发明申请

US20200232112A1 HIGH ASPECT RATIO ELECTROPLATED STRUCTURES AND ANISOTROPIC ELECTROPLATING PROCESSES 审中-公开
公开(公告)号：US20200232112A1
公开(公告)日：2020-07-23
申请号：US16827583
申请日：2020-03-23
申请人： Hutchinson Technology Incorporated
发明人： Douglas P. Riemer , Kurt C. Swanson , Peter F. Ladwig
IPC分类号： C25D5/02 , H05K3/24 , C25D5/18 , H05K3/10 , C25D7/00
摘要： Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.

6. 发明授权

US09844888B2 Chemically sharpening blades 有权
公开(公告)号：US09844888B2
公开(公告)日：2017-12-19
申请号：US15057541
申请日：2016-03-01
申请人： Hutchinson Technology Incorporated
发明人： Paul V. Pesavento , Peter F. Ladwig , Michael W. Davis , John A. Theget , Kurt C. Swanson , Joel B. Michaletz , Philip W. Anderson , Timothy A. McDaniel
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00 , B26D1/00 , B26B9/00 , B26B9/02 , C23F1/04
CPC分类号： B26D1/0006 , B26B9/00 , B26B9/02 , B26D2001/0053 , C23F1/04
摘要： A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.

7. 发明申请

US20160257006A1 CHEMICALLY SHARPENED BLADES 审中-公开
标题翻译：化学脆片
公开(公告)号：US20160257006A1
公开(公告)日：2016-09-08
申请号：US15057674
申请日：2016-03-01
申请人： Hutchinson Technology Incorporated
发明人： Paul V. Pesavento , Peter F. Ladwig , Michael W. Davis , John A. Theget , Kurt C. Swanson , Joel B. Michaletz , Philip W. Anderson , Timothy A. McDaniel
IPC分类号： B26B9/02 , C23F1/00 , B26D1/00
CPC分类号： B26D1/0006 , B26B9/00 , B26B9/02 , B26D2001/0053 , C23F1/04
摘要： A chemically etched cutting tool includes a metal base having a first side and a second side, and a chemically etched blade on at least one side of the metal base, the chemically etched blade forming a cutting edge at the intersection of the first side of the chemically etched blade and the second side of the chemically etched blade. The first side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions. The second side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions.
摘要翻译：化学蚀刻的切割工具包括具有第一侧和第二侧的金属基底和在金属基底的至少一侧上的化学蚀刻刀片，化学蚀刻刀片在第一侧和第二侧的交叉处形成切割边缘化学蚀刻刀片和化学蚀刻刀片的第二侧。化学蚀刻刀片的第一面包括一个或多个凹部和一个或多个凸部，在凹部和一个或多个凸部之间具有至少一个拐点。化学蚀刻刀片的第二面包括一个或多个凹部和一个或多个凸部，在凹部和一个或多个凸部之间具有至少一个拐点。

8. 发明授权

US10570525B2 Gold electroplating solution and method 有权
公开(公告)号：US10570525B2
公开(公告)日：2020-02-25
申请号：US14996412
申请日：2016-01-15
申请人： Hutchinson Technology Incorporated
发明人： Kurt C. Swanson , Douglas P. Riemer , Steven A. Fank
IPC分类号： C25D3/48 , C25D5/36 , C25D7/00
摘要： A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.

9. 发明申请

US20200023534A1 Chemically Sharpening Blades 审中-公开
公开(公告)号：US20200023534A1
公开(公告)日：2020-01-23
申请号：US16586791
申请日：2019-09-27
申请人： Hutchinson Technology Incorporated
发明人： Paul V. Pesavento , Peter F. Ladwig , Michael W. Davis , John A. Theget , Kurt C. Swanson , Joel B. Michaletz , Philip W. Anderson , Timothy A. McDaniel , Patrick R. LaLonde
IPC分类号： B26D1/00 , B26B9/02 , C23F1/04 , B26B9/00
摘要： A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.

10. 发明申请

US20160208401A1 GOLD ELECTROPLATING SOLUTION AND METHOD 审中-公开
标题翻译：金电镀解决方案和方法
公开(公告)号：US20160208401A1
公开(公告)日：2016-07-21
申请号：US14996412
申请日：2016-01-15
申请人： Hutchinson Technology Incorporated
发明人： Kurt C. Swanson , Douglas P. Riemer , Steven A. Fank
IPC分类号： C25D3/48 , C25D5/36 , C25D7/00
摘要： A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.
摘要翻译：金电解液包括氰化金（III）化合物，氯化物化合物和盐酸。氰化金（III）是氰化钾金（III），氰化铵金（III）或氰化钠金（III）。氯化物是氯化钾，氯化铵或氯化钠。可以使用具有金层的金电镀溶液使用光刻工艺在不锈钢（SST）层上直接沉积的各种结构。这种结构包括具有不连续图案的金图案，在电介质层的相对侧上具有一个或多个迹线的接合焊盘区域，具有金键焊盘的万向节和具有包含金层的电接口的接合接头。

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