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1. 发明授权

US09296188B1 Partial curing of a microactuator mounting adhesive in a disk drive suspension 有权
标题翻译：微型致动器安装粘合剂在磁盘驱动器悬架中的部分固化
公开(公告)号：US09296188B1
公开(公告)日：2016-03-29
申请号：US14623774
申请日：2015-02-17
申请人： Hutchinson Technology Incorporated
发明人： Scott J. Cray , John L. Schumann , Trent A. Johnson , Luke E. Rose
IPC分类号： H01L41/22 , B32B37/12 , G11B5/48
CPC分类号： G11B5/4826 , B32B37/1207 , G11B5/48 , G11B5/483
摘要： Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.
摘要翻译：各种实施例涉及将微致动器附接到挠曲件的方法，在挠曲件上沉积湿质结构粘合剂，将微致动器安装在湿质结构粘合剂上，通过第一次施加固化能部分地固化结构粘合剂块，以及在所述挠曲件上沉积大量导电粘合剂。导电粘合剂的质量沉积成与结构粘合剂块接触。结构粘合剂的部分固化的状态防止导电粘合剂在微致动器的挠曲部分和下侧之间的芯吸和移动结构粘合剂，否则可能导致短路到不锈钢层的挠曲。该方法还包括通过第二次施加固化能来完全固化结构粘合剂和导电粘合剂的质量。

2. 发明授权

US09824704B2 Partial curing of a microactuator mounting adhesive in a disk drive suspension 有权
公开(公告)号：US09824704B2
公开(公告)日：2017-11-21
申请号：US15053631
申请日：2016-02-25
申请人： Hutchinson Technology Incorporated
发明人： Scott J. Cray , John L. Schumann , Trent A. Johnson , Luke E. Rose
IPC分类号： G11B5/48 , B32B37/12
CPC分类号： G11B5/4826 , B32B37/1207 , G11B5/48 , G11B5/483
摘要： Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.

3. 发明申请

US20160240218A1 PARTIAL CURING OF A MICROACTUATOR MOUNTING ADHESIVE IN A DISK DRIVE SUSPENSION 有权
标题翻译：微型机械安装在盘式驱动器悬架中的部分固化
公开(公告)号：US20160240218A1
公开(公告)日：2016-08-18
申请号：US15053631
申请日：2016-02-25
申请人： Hutchinson Technology Incorporated
发明人： Scott J. Cray , John L. Schumann , Trent A. Johnson , Luke E. Rose
IPC分类号： G11B5/48
CPC分类号： G11B5/4826 , B32B37/1207 , G11B5/48 , G11B5/483
摘要： Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.
摘要翻译：各种实施例涉及将微致动器附接到挠曲件，在挠曲件上沉积湿质结构粘合剂的方法，将微致动器安装在湿质结构粘合剂上，通过第一次施加固化能部分地固化该结构粘合剂的质量，以及在所述挠曲件上沉积大量导电粘合剂。导电粘合剂的质量沉积成与结构粘合剂块接触。结构粘合剂的部分固化的状态防止导电粘合剂在微致动器的挠曲部分和下侧之间的芯吸和移动结构粘合剂，否则可能导致短路到不锈钢层的挠曲。该方法还包括通过第二次施加固化能来完全固化结构粘合剂和导电粘合剂的质量。

4. 发明授权

US10147449B2 Partial curing of a microactuator mounting adhesive in a disk drive suspension 有权
公开(公告)号：US10147449B2
公开(公告)日：2018-12-04
申请号：US15818529
申请日：2017-11-20
申请人： Hutchinson Technology Incorporated
发明人： Scott J. Cray , John L. Schumann , Trent A. Johnson , Luke E. Rose
IPC分类号： G11B5/48 , B32B37/12
摘要： Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.

5. 发明申请

US20180075870A1 Partial Curing Of A Microactuator Mounting Adhesive In A Disk Drive Suspension 审中-公开
公开(公告)号：US20180075870A1
公开(公告)日：2018-03-15
申请号：US15818529
申请日：2017-11-20
申请人： Hutchinson Technology Incorporated
发明人： Scott J. Cray , John L. Schumann , Trent A. Johnson , Luke E. Rose
IPC分类号： G11B5/48 , B32B37/12
CPC分类号： G11B5/4826 , B32B37/1207 , G11B5/48 , G11B5/483
摘要： Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.

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