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1. 发明授权

US09169425B2 Adhesive film and electronic device including the same 有权
标题翻译：粘合膜和包括其的电子装置
公开(公告)号：US09169425B2
公开(公告)日：2015-10-27
申请号：US13713679
申请日：2012-12-13
申请人： Hye Jin Kim , Jae Won Choi , Ji Ho Kim , Jin Man Kim , Gyu Seok Song
发明人： Hye Jin Kim , Jae Won Choi , Ji Ho Kim , Jin Man Kim , Gyu Seok Song
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , C09J163/00 , H01L23/00 , C08G59/50 , C08G59/56 , C08G59/62
CPC分类号： C09J163/00 , C08G59/504 , C08G59/56 , C08G59/621 , H01L24/29 , H01L24/32 , H01L24/50 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/29391 , H01L2224/29393 , H01L2224/32225 , H01L2224/83101 , H01L2924/12043 , H01L2924/181 , H01L2924/00
摘要： An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.
摘要翻译：粘合剂膜包括胺固化剂和酚类固化剂，并且在固化后在170℃下在80℃以上固化后的储能模量与在40℃下的储能模量之比在约1.5的范围内至约3.0。

2. 发明授权

US08609515B2 Dicing die bonding film, semiconductor wafer, and semiconductor device 有权
标题翻译：切割芯片接合膜，半导体晶片和半导体器件
公开(公告)号：US08609515B2
公开(公告)日：2013-12-17
申请号：US13287367
申请日：2011-11-02
申请人： Min Kyu Hwang , Ji Ho Kim , Ki Tae Song
发明人： Min Kyu Hwang , Ji Ho Kim , Ki Tae Song
IPC分类号： H01L21/78
CPC分类号： H01L24/27 , C09J7/22 , C09J7/38 , C09J133/04 , C09J2203/326 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27001 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01025 , H01L2924/01033 , H01L2924/01072 , H01L2924/01073 , H01L2924/01077 , H01L2924/01082 , H01L2924/0665 , H01L2924/15788 , Y10T428/28 , Y10T428/2817 , Y10T428/2826 , Y10T428/287 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A dicing die bonding film including a bonding layer; and a pressure-sensitive adhesive layer adjoining the bonding layer, the pressure-sensitive adhesive layer having a storage modulus of about 400 to about 600 kPa at 25° C. and a peel strength of about 200 to about 350 mN/25 mm with respect to the bonding layer as measured according to KS-A-01107 standard.
摘要翻译：一种包含接合层的切割芯片接合薄膜; 和粘合层相邻的压敏粘合剂层，该压敏粘合剂层在25℃下的储能模量为约400至约600kPa，剥离强度为约200至约350mN / 25mm，相对于到根据KS-A-01107标准测量的粘合层。

3. 发明授权

US09133367B2 Optically clear adhesive for dicing die bonding film 有权
标题翻译：光学透明粘合剂用于切割模片接合薄膜
公开(公告)号：US09133367B2
公开(公告)日：2015-09-15
申请号：US13279564
申请日：2011-10-24
申请人： Kyoung Jin Ha , Baek Soung Park , Ji Ho Kim , Min Kyu Hwang , Kil Sung Lee
发明人： Kyoung Jin Ha , Baek Soung Park , Ji Ho Kim , Min Kyu Hwang , Kil Sung Lee
IPC分类号： C09J7/02 , C09J143/02 , C09J133/10 , C09J133/08 , C09J143/04 , H01L21/683 , C08F8/30 , C09J133/14
CPC分类号： C09J7/02 , C08F8/30 , C09J7/20 , C09J133/08 , C09J133/10 , C09J133/14 , C09J143/02 , C09J143/04 , C09J2201/36 , C09J2201/606 , C09J2201/61 , C09J2203/326 , C09J2433/00 , H01L21/6836 , H01L2221/68336 , H01L2224/8085 , H01L2224/80855 , H01L2224/8385 , H01L2224/83855 , Y10T428/2848 , Y10T428/31786 , C08F2220/1858 , C08F220/20 , C08F220/32 , C08F2220/325 , C08F230/02 , C08F220/06
摘要： An optically clear adhesive, a dicing die bonding film, and a semiconductor device, the optically clear adhesive including a curing agent; and an acrylic copolymer, the acrylic copolymer including an alkyl group, a hydroxyl group, and at least one of a phosphate group and a silane group.
摘要翻译：光学透明粘合剂，切割芯片接合膜和半导体器件，光学透明粘合剂包括固化剂; 和丙烯酸共聚物，所述丙烯酸共聚物包括烷基，羟基和磷酸酯基和硅烷基中的至少一个。

4. 发明申请

US20110159223A1 DIE-ATTACH FILM AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译： DIE-ATTACH膜及其制造方法
公开(公告)号：US20110159223A1
公开(公告)日：2011-06-30
申请号：US12977664
申请日：2010-12-23
申请人： Baek Soung Park , Min Kyu Hwang , Ji Ho Kim
发明人： Baek Soung Park , Min Kyu Hwang , Ji Ho Kim
IPC分类号： B32B7/12 , B44C1/17 , B32B37/06
CPC分类号： H01L24/29 , H01L21/6836 , H01L24/27 , H01L2224/274 , H01L2224/27436 , H01L2224/2919 , H01L2224/83191 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/181 , H01L2924/3025 , Y10T156/1092 , Y10T428/14 , Y10T428/1462 , Y10T428/2809 , H01L2924/00
摘要： A die-attach film and a method of manufacturing the same, the method including providing a dicing film layer with the attach layer thereon, the dicing film layer being prepared from a photocurable adhesive composition and including an attach layer region overlapping the attach layer such that the attach layer blocks inflow of oxygen into the attach layer region, and a ring frame region, the ring frame region having an upper surface that is adjacent to the attach layer and is exposed to air or an oxygen atmosphere such that oxygen flows into the ring frame region; and irradiating UV light to a back side of the dicing film layer to induce photocuring of the attach layer region, the oxygen in the ring frame region acting as a radical scavenger and suppressing photocuring of the ring frame region.
摘要翻译：芯片附着膜及其制造方法，该方法包括在其上提供具有附着层的切割膜层，所述切割膜层由光固化粘合剂组合物制备并且包括与附着层重叠的附着层区域，使得附着层阻止氧进入附着层区域的流入，以及环形框架区域，环形框架区域具有与附着层相邻的上表面并暴露于空气或氧气氛，使得氧气流入环框架区域并将UV光照射到切割膜层的背面，引起附着层区域的光固化，作为自由基清除剂的环状区域中的氧，抑制环形框架区域的光固化。

5. 外观设计

USD627937S1 Dishwasher 有权
公开(公告)号：USD627937S1
公开(公告)日：2010-11-23
申请号：US29357773
申请日：2010-03-17
申请人： Ji Ho Kim
设计人： Ji Ho Kim

6. 发明申请

US20090301530A1 Washing machine having UV generator 有权
标题翻译：具有UV发生器的洗衣机
公开(公告)号：US20090301530A1
公开(公告)日：2009-12-10
申请号：US12089632
申请日：2006-10-10
申请人： Dong Hoon Shin , Mi Son Ahn , Ji Ho Kim , Chang Woo Song , Kyung Ah Cho
发明人： Dong Hoon Shin , Mi Son Ahn , Ji Ho Kim , Chang Woo Song , Kyung Ah Cho
IPC分类号： A47L15/42
CPC分类号： A47L15/4242
摘要： The present invention relates to dishwashing machines, and more particularly, to a dish washer (1a) having a UV generator (110) for sterilizing dishes and an inside of dish washer (1 a), including a tub (2) for holding dishes to be washed, a sump (3) for holding washing water, a spray nozzle (8a, 8b) for spraying the washing water into the dish washer (1a), and at least one UV generator (110) for directing a UV beam into the dish washer (1 a).
摘要翻译：本发明涉及洗碗机，更具体地说，涉及一种具有用于对餐具进行灭菌的UV发生器（110）和洗碗机（1a）内部的洗碗机（1a），所述洗碗机包括用于容纳碗碟的桶（2）洗涤，用于保持洗涤水的贮槽（3），用于将洗涤水喷射到洗碗机（1a）中的喷嘴（8a，8b）和至少一个UV发生器（110），用于将UV束引导到洗碗机（1 a）。

7. 发明授权

US5959698A Poly phase filter for dot sequential color difference signal conversion 失效
标题翻译：多相滤波器用于点连续色差信号转换
公开(公告)号：US5959698A
公开(公告)日：1999-09-28
申请号：US735063
申请日：1996-10-18
申请人： Ji Ho Kim
发明人： Ji Ho Kim
IPC分类号： H04N9/78 , G06T3/00 , H04N9/64 , H04N11/20 , G06F17/10
CPC分类号： G06T3/40 , H04N9/64 , H04N11/20
摘要： A poly phase filter for converting a sampling frequency of a digital video signal to perform a dot sequential color difference signal conversion operation, the digital video signal including a luminance signal and a color difference signal, the color difference signal including two color difference signal components. The poly phase filter is adapted to generate a plurality of poly phase filter coefficients to be used to process the luminance signal and to process the color difference signal. The poly phase filter is also adapted to process the generated poly phase filter coefficients in units of two to process the color difference signal. Therefore, the present invention has the effect of reducing the hardware size and the associated cost.
摘要翻译：一种多相滤波器，用于转换数字视频信号的采样频率以进行点连续色差信号转换操作，所述数字视频信号包括亮度信号和色差信号，所述色差信号包括两个色差信号分量。多相滤波器适于产生多个多相滤波器系数，以用于处理亮度信号并处理色差信号。多相滤波器还适于以两个单位处理所生成的多相滤波器系数以处理色差信号。因此，本发明具有降低硬件尺寸和相关成本的效果。

8. 外观设计

USD627939S1 Dishwasher 有权
标题翻译：洗碗机
公开(公告)号：USD627939S1
公开(公告)日：2010-11-23
申请号：US29358261
申请日：2010-03-24
申请人： Ji Ho Kim
设计人： Ji Ho Kim

9. 外观设计

USD627938S1 Dishwasher 有权
公开(公告)号：USD627938S1
公开(公告)日：2010-11-23
申请号：US29357776
申请日：2010-03-17
申请人： Ji Ho Kim
设计人： Ji Ho Kim

10. 发明申请

US20120171844A1 DICING DIE BONDING FILM, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE 有权
标题翻译：点焊膜，半导体晶体管和半导体器件
公开(公告)号：US20120171844A1
公开(公告)日：2012-07-05
申请号：US13287367
申请日：2011-11-02
申请人： Min Kyu HWANG , Ji Ho Kim , Ki Tae Song
发明人： Min Kyu HWANG , Ji Ho Kim , Ki Tae Song
IPC分类号： H01L21/78 , B32B27/30 , B32B27/00 , B32B27/38 , H01L23/00 , C09J7/02
CPC分类号： H01L24/27 , C09J7/22 , C09J7/38 , C09J133/04 , C09J2203/326 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/27001 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/83191 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01025 , H01L2924/01033 , H01L2924/01072 , H01L2924/01073 , H01L2924/01077 , H01L2924/01082 , H01L2924/0665 , H01L2924/15788 , Y10T428/28 , Y10T428/2817 , Y10T428/2826 , Y10T428/287 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A dicing die bonding film including a bonding layer; and a pressure-sensitive adhesive layer adjoining the bonding layer, the pressure-sensitive adhesive layer having a storage modulus of about 400 to about 600 kPa at 25° C. and a peel strength of about 200 to about 350 mN/25 mm with respect to the bonding layer as measured according to KS-A-01107 standard.
摘要翻译：一种包含接合层的切割芯片接合薄膜; 和粘合层相邻的压敏粘合剂层，该压敏粘合剂层在25℃下的储能模量为约400至约600kPa，剥离强度为约200至约350mN / 25mm，相对于到根据KS-A-01107标准测量的粘合层。

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