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    • 3. 发明授权
    • Liquid-cooled heat sink configured to facilitate drainage
    • 液冷式散热器配置方便排水
    • US09420728B2
    • 2016-08-16
    • US14252971
    • 2014-04-15
    • INTERNATIONAL BUSINESS MACHINES CORPORATION
    • Frank M. DesianoDavid L. EdwardsRobert K. MulladyDonald W. PorterRandy Zoodsma
    • H05K7/20
    • H05K7/20781H05K7/20254H05K7/20263H05K7/20272H05K7/20409H05K7/20772
    • Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.
    • 提供了冷却装置,冷却的电子模块和制造方法,其有助于在操作模式下从一个或多个电子部件到液体冷却剂的热传递,并且在传送模式中排出冷却剂。 冷却装置包括被配置为沿主传热面水平耦合到电子部件的液冷散热器。 散热器包括具有冷却剂流动的冷却剂携带隔间的导热结构,以及固定到导热结构并与冷却剂携带室流体连通的冷却剂入口管和冷却剂出口管,以便于冷却剂流过 隔间。 冷却剂承载室具有基座表面,并且冷却剂出口管朝着基座表面延伸进入冷却剂容纳室,以便于在冷却装置的输送模式中将液体冷却剂从隔室中取出。