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    • 4. 发明申请
    • MULTIPLE-BEAM LASER PROCESSING USING MULTIPLE LASER BEAMS WITH DISTINCT WAVELENGTHS AND/OR PULSE DURATIONS
    • 多波束激光加工使用多个激光波长和/或脉冲持续时间
    • US20150246412A1
    • 2015-09-03
    • US14633912
    • 2015-02-27
    • IPG Photonics Corporation
    • Marco MendesJeffrey P. SercelRouzbeh SarrafiXiangyang SongJoshua SchoenlyRoy Van GemertCristian Porneala
    • B23K26/00B23K26/38
    • B23K26/0006B23K26/0604B23K2103/12
    • Multiple-beam laser processing may be performed on a workpiece using at least first and second laser beams with different characteristics (e.g., wavelengths and/or pulse durations). In some applications, an assist laser beam is directed at a target location on or within the workpiece to modify a property of the non-absorptive material. A process laser beam is directed at the target location and is coupled into absorption centers formed in the non-absorptive material to complete processing of the non-absorptive material. Multiple-beam laser processing may be used, for example, to drill holes in a substrate made of alumina or other transparent ceramics. In other applications, multiple-beam laser processing may be used in melting applications such as micro-welding, soldering, and forming laser fired contacts. In these applications, the assist laser beam may be used to modify a property of the material or to change the geometry of the parts.
    • 可以使用至少具有不同特性(例如波长和/或脉冲持续时间)的第一和第二激光束在工件上执行多光束激光处理。 在一些应用中,辅助激光束被引导到工件上或工件内的目标位置,以改变非吸收材料的性质。 过程激光束被引导到目标位置,并且耦合到形成在非吸收材料中的吸收中心,以完成非吸收材料的处理。 可以使用多光束激光加工,例如在由氧化铝或其它透明陶瓷制成的基板中钻孔。 在其他应用中,多光束激光加工可用于熔化应用,例如微焊接,焊接和形成激光烧结接触。 在这些应用中,辅助激光束可用于改变材料的性质或改变部件的几何形状。