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    • 1. 发明申请
    • SOLID-STATE IMAGE PICKUP DEVICE, IMAGE PICKUP APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME
    • 固态图像拾取装置,包括其的图像拾取装置及其制造方法
    • US20110079832A1
    • 2011-04-07
    • US12892017
    • 2010-09-28
    • Atsushi MasagakiIkuhiro Yamamura
    • Atsushi MasagakiIkuhiro Yamamura
    • H01L31/062H01L31/18
    • H01L27/14609H01L27/14612H01L27/14643H01L27/14689
    • A solid-state image pickup device includes: a semiconductor substrate; and a plurality of pixel circuits formed on the semiconductor substrate; each of the plurality of pixel circuits formed on the semiconductor substrate including a photoelectric conversion element, a first buried gate electrode formed adjacent to the photoelectric conversion element, a second buried gate electrode formed away from each of the photoelectric conversion element and the first buried gate electrode, a first diffusion layer formed between the first buried gate electrode and the second buried gate electrode, and a second diffusion layer formed between the first buried gate electrode and the second buried gate electrode away from the first diffusion layer so as to overlap the first diffusion layer; wherein electric charges accumulated in the photodiode conversion element are transferred to the second diffusion layer through the first diffusion layer.
    • 固体摄像装置包括:半导体衬底; 以及形成在所述半导体衬底上的多个像素电路; 形成在包括光电转换元件的半导体衬底上的多个像素电路中的每一个,与光电转换元件相邻形成的第一掩埋栅极电极,远离光电转换元件和第一掩埋栅极 电极,形成在第一掩埋栅极电极和第二掩埋栅极电极之间的第一扩散层,以及形成在第一掩埋栅极电极和第二掩埋栅极电极之间的第二扩散层,远离第一扩散层, 扩散层; 其中累积在所述光电二极管转换元件中的电荷通过所述第一扩散层传递到所述第二扩散层。
    • 2. 发明申请
    • SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING APPARATUS AND METHODS FOR MANUFACTURING THE SAME
    • 固态成像装置,固态成像装置及其制造方法
    • US20100136738A1
    • 2010-06-03
    • US12703105
    • 2010-02-09
    • Ikuhiro Yamamura
    • Ikuhiro Yamamura
    • H01L31/18
    • H01L27/14636H01L27/1462H01L27/14623Y10S438/927
    • To arrange diffusion-inhibitory films 5a, 5b, and 5c for inhibiting the diffusion of a wiring material absent in a region on or above a light receiving unit 2,the diffusion-inhibitory films 5a, 5b, and 5c formed on a region above the light receiving unit 2 are selectively removed. Alternatively, the diffusion-inhibitory films are arranged only on top surfaces of wirings 4a, 4b, and 4c, and only a passivation film 12 and interlayer insulating films 3a, 3b, and 3c are arranged in the region on or above the light receiving unit 2. Thus, with less interface between different insulation films and less reflection of incident light in an incident region, the incident light 13 highly efficiently passes through these insulating films and comes into the light receiving unit 2. The light receiving unit 2 can thereby receive a sufficient quantity of the incident light 13.
    • 为了配置用于抑制不在光接收单元2上或上方的区域中的布线材料的扩散的扩散抑制膜5a,5b和5c,形成在上述区域上方的扩散抑制膜5a,5b,5c 光接收单元2被选择性地去除。 或者,扩散抑制膜仅布置在布线4a,4b和4c的顶表面上,并且仅在光接收单元上或上方的区域中布置钝化膜12和层间绝缘膜3a,3b和3c 因此,通过不同的绝缘膜之间的界面较少,入射区域的入射光的反射较少,入射光13高效地通过这些绝缘膜并进入光接收单元2.因此,光接收单元2可以接收 足够量的入射光13。
    • 4. 发明授权
    • Semiconductor nonvolatile memory device and method of producing the same
    • 半导体非易失性存储器件及其制造方法,包括在隔离绝缘膜上形成浮栅的部分
    • US06403421B1
    • 2002-06-11
    • US09583906
    • 2000-05-31
    • Naoshi IkedaIkuhiro YamamuraHidetoshi Yamanaka
    • Naoshi IkedaIkuhiro YamamuraHidetoshi Yamanaka
    • H01L21336
    • H01L27/11521H01L27/115
    • A semiconductor nonvolatile memory device using SA-STI cells improved in quality and suitable for increasing the degree of integration is provided with a semiconductor substrate having in its surface a channel formation region; an element isolation insulating film buried in a trench formed in the semiconductor substrate so as to divide the channel formation region into a plurality of regions; a gate insulating film formed on the channel formation region; a floating gate provided with a first floating gate formed at an upper layer of the gate insulating film and second floating gates formed at facing sides of the same; an inter-layer insulating film formed at an upper layer of the first floating gate and the second floating gates; a control gate formed at an upper layer of the inter-layer insulating film; and a source-drain region former connected to the channel formation region.
    • 使用在其表面具有沟道形成区域的半导体衬底设置使用质量提高并适于增加集成度的SA-STI单元的半导体非易失性存储器件; 掩模在半导体衬底中形成的沟槽中的元件隔离绝缘膜,以便将沟道形成区域分成多个区域; 形成在沟道形成区上的栅极绝缘膜; 设置有形成在栅绝缘膜的上层的第一浮栅和形成在其相对侧的第二浮栅的浮置栅; 形成在第一浮动栅极和第二浮动栅极的上层的层间绝缘膜; 形成在所述层间绝缘膜的上层的控制栅极; 以及连接到沟道形成区的源极 - 漏极区前体。
    • 6. 发明授权
    • Transistor controlled thyristor memory device
    • 晶体管控制晶闸管存储器件
    • US07465965B2
    • 2008-12-16
    • US11512313
    • 2006-08-30
    • Ikuhiro Yamamura
    • Ikuhiro Yamamura
    • H01L29/74
    • H01L27/1027H01L27/11
    • A semiconductor device including: a bulk semiconductor substrate; an access transistor; a thruster formed on the bulk semiconductor substrate connecting to the access transistor; an element separating region to separate the region for the access transistor and the region for the thruster from each other; and a wiring layer connecting one of the diffused layers of the access transistor and the cathode of the thruster together through a connecting hole, the impurity region at the anode side of the thruster being composed of a p-type impurity region, an n-type impurity region, p-type impurity region, and an n-type impurity region, which are formed sequentially in the depth wise direction, with the lowermost n-type impurity region receiving the same voltage as that applied to the anode at the time of data holding.
    • 一种半导体器件,包括:体半导体衬底; 存取晶体管; 形成在连接到存取晶体管的体半导体衬底上的推进器; 元件分离区域,用于将用于存取晶体管的区域和用于推进器的区域彼此分离; 以及通过连接孔将存取晶体管的一个扩散层和推进器的阴极连接在一起的布线层,推进器的阳极侧的杂质区域由p型杂质区域,n型 杂质区域,p型杂质区域和n型杂质区域,其在深度方向依次形成,最低n型杂质区域在数据时接收与施加到阳极的电压相同的电压 保持。
    • 8. 发明申请
    • Solid-state imaging device, solid-state imaging apparatus and methods for manufacturing the same
    • 固态成像装置,固态成像装置及其制造方法
    • US20070075343A1
    • 2007-04-05
    • US11607756
    • 2006-11-30
    • Ikuhiro Yamamura
    • Ikuhiro Yamamura
    • H01L31/113
    • H01L27/14636H01L27/1462H01L27/14623Y10S438/927
    • To arrange diffusion-inhibitory films 5a, 5b, and 5c for inhibiting the diffusion of a wiring material absent in a region on or above a light receiving unit 2, the diffusion-inhibitory films 5a, 5b, and 5c formed on a region above the light receiving unit 2 are selectively removed. Alternatively, the diffusion-inhibitory films are arranged only on top surfaces of wirings 4a, 4b, and 4c, and only a passivation film 12 and interlayer insulating films 3a, 3b, and 3c are arranged in the region on or above the light receiving unit 2. Thus, with less interface between different insulation films and less reflection of incident light in an incident region, the incident light 13 highly efficiently passes through these insulating films and comes into the light receiving unit 2. The light receiving unit 2 can thereby receive a sufficient quantity of the incident light 13.
    • 为了配置用于抑制在光接收单元2上或上方的区域中不存在的布线材料的扩散的扩散抑制膜5a,5b和5c,扩散抑制膜5a,5b和5c 形成在光接收单元2上方的区域上。 或者,扩散抑制膜仅布置在布线4a,4b和4c的顶表面上,并且只有钝化膜12和层间绝缘膜3a,3b和3c布置在 或者在光接收单元2上方。因此,由于不同绝缘膜之间的界面较少,入射区域的入射光反射较少,所以入射光13高效地通过这些绝缘膜并进入光接收单元2.光 接收单元2可以由此接收足够数量的入射光13。
    • 10. 发明授权
    • Solid-state imaging device, solid-state imaging apparatus and methods for manufacturing the same
    • 固态成像装置,固态成像装置及其制造方法
    • US07759712B2
    • 2010-07-20
    • US11607756
    • 2006-11-30
    • Ikuhiro Yamamura
    • Ikuhiro Yamamura
    • H01L31/062
    • H01L27/14636H01L27/1462H01L27/14623Y10S438/927
    • To arrange diffusion-inhibitory films 5a, 5b, and 5c for inhibiting the diffusion of a wiring material absent in a region on or above a light receiving unit 2, the diffusion-inhibitory films 5a, 5b, and 5c formed on a region above the light receiving unit 2 are selectively removed. Alternatively, the diffusion-inhibitory films are arranged only on top surfaces of wirings 4a, 4b, and 4c, and only a passivation film 12 and interlayer insulating films 3a, 3b, and 3c are arranged in the region on or above the light receiving unit 2. Thus, with less interface between different insulation films and less reflection of incident light in an incident region, the incident light 13 highly efficiently passes through these insulating films and comes into the light receiving unit 2. The light receiving unit 2 can thereby receive a sufficient quantity of the incident light 13.
    • 为了配置用于抑制不在光接收单元2上或上方的区域中的布线材料的扩散的扩散抑制膜5a,5b和5c,形成在上述区域上方的扩散抑制膜5a,5b,5c 光接收单元2被选择性地去除。 或者,扩散抑制膜仅布置在布线4a,4b和4c的顶表面上,并且仅在光接收单元上或上方的区域中布置钝化膜12和层间绝缘膜3a,3b和3c 因此,通过不同的绝缘膜之间的界面较少,入射区域的入射光的反射较少,入射光13高效地通过这些绝缘膜并进入光接收单元2.因此,光接收单元2可以接收 足够量的入射光13。