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    • 3. 发明授权
    • Probe needle for probe card
    • 探针针探针
    • US06366106B1
    • 2002-04-02
    • US09642654
    • 2000-08-22
    • Yoshio KimoriYoshinobu KageyamaTomoki Kitafuji
    • Yoshio KimoriYoshinobu KageyamaTomoki Kitafuji
    • G01R1067
    • G01R1/0675
    • A probe needle for a probe card which is characterized by applying a Ni plating containing PTFE to at least an end face of a tip portion thereof is disclosed. A Ni plating containing PTFE layer may preferably be formed on the tip portion of the probe needle by using a Ni plating layer as a substrate. The Ni plating may preferably have a thickness of 0.5-2 &mgr;m to ensure the adhesion of the Ni plating containing PTFE, while the Ni plating containing PTFE may preferably have a thickness of 0.5-2 &mgr;m to ensure the sliding property of the PTFE. In this probe needle, since the tip portion thereof is covered with the Ni plating containing PTFE layer, the wear resistance is not deteriorated, the favorable conductivity is obtained, and the oxidization of the end face which is brought into contact with an integrated circuit is prevented. Further, with the use of PTFE, the sliding property is enhanced so that the adhesion of the aluminum oxide can be substantially completely prevented thus ensuring the stable conductivity.
    • 公开了一种用于探针卡的探针,其特征在于,将至少包含PTFE的Ni镀层施加到其尖端部分的至少端面。 优选通过使用Ni镀层作为基材,在探针的前端部形成含有PTFE层的Ni镀层。 Ni镀层的厚度优选为0.5-2μm,以确保含有PTFE的Ni镀层的粘附性,而含有PTFE的Ni镀层可优选具有0.5-2μm的厚度以确保PTFE的滑动性。 在该探针中,由于其顶端部分被含有PTFE层的镀镍层覆盖,所以耐磨性不劣化,获得良好的导电性,并且与集成电路接触的端面的氧化为 防止了 此外,通过使用PTFE,滑动性能得到提高,从而可以基本上完​​全防止氧化铝的粘合,从而确保稳定的导电性。