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1. 发明申请

US20160285513A1 TECHNIQUES FOR DEVICE-TO-DEVICE COMMUNICATIONS 有权
标题翻译：用于设备到设备通信的技术
公开(公告)号：US20160285513A1
公开(公告)日：2016-09-29
申请号：US14668199
申请日：2015-03-25
申请人： Intel Corporation
发明人： Shreyas Sen , Chintan S. Thakkar , Bryan K. Casper , James E. Jaussi
IPC分类号： H04B5/00 , H04W76/04 , H01P3/16
CPC分类号： H04B5/0012 , H01P3/16 , H01Q13/24 , H04B5/0031
摘要： Embodiments of the present disclosure provide apparatuses and systems for proximity communications. The apparatus may include an integrated circuit (IC) package with a central processing unit (CPU) circuit, an input-output (I/O) circuit coupled with the CPU circuit, and a dielectric electromagnetic waveguide coupled with the I/O circuit, to enable communications between the CPU circuit and another apparatus. In another instance, the apparatus may include a plurality of coupler pads disposed on a first surface of the apparatus; and a processor electrically coupled with the coupler pads. One of the coupler pads may form capacitive coupling with one of coupler pads disposed on a second surface of another apparatus, in response to a placement of the first surface in at least partial contact with the second surface, to enable proximity data communication between the processor and the other apparatus. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供用于邻近通信的装置和系统。该装置可以包括具有中央处理单元（CPU）电路，与CPU电路耦合的输入输出（I / O）电路和与I / O电路耦合的介电电磁波导的集成电路（IC）封装，以实现CPU电路和另一装置之间的通信。在另一种情况下，该设备可以包括设置在设备的第一表面上的多个耦合器焊盘; 以及与耦合器焊盘电耦合的处理器。响应于第一表面与第二表面至少部分接触的布置，耦合器中的一个可以与设置在另一装置的第二表面上的耦合器焊盘之一形成电容耦合，以使处理器之间的接近数据通信和另一台设备。可以描述和/或要求保护其他实施例。

2. 发明申请

US20200304171A1 DISPERSIVE WAVEGUIDE CROSSTALK MITIGATION 审中-公开
公开(公告)号：US20200304171A1
公开(公告)日：2020-09-24
申请号：US16897135
申请日：2020-06-09
申请人： Intel Corporation
发明人： Henning Braunisch , Georgios Dogiamis , Diego Correas-Serrano , Neelam Prabhu-Gaunkar , Telesphor Kamgaing , Cooper S. Levy , Chintan S. Thakkar , Stefano Pellerano
IPC分类号： H04B3/32 , H04L25/03
摘要： Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.

3. 发明授权

US09929775B2 Techniques for device-to-device communications 有权
公开(公告)号：US09929775B2
公开(公告)日：2018-03-27
申请号：US14668199
申请日：2015-03-25
申请人： Intel Corporation
发明人： Shreyas Sen , Chintan S. Thakkar , Bryan K. Casper , James E. Jaussi
IPC分类号： H04B7/00 , H04B5/00 , H01P3/16 , H01Q13/24
CPC分类号： H04B5/0012 , H01P3/16 , H01Q13/24 , H04B5/0031
摘要： Embodiments of the present disclosure provide apparatuses and systems for proximity communications. The apparatus may include an integrated circuit (IC) package with a central processing unit (CPU) circuit, an input-output (I/O) circuit coupled with the CPU circuit, and a dielectric electromagnetic waveguide coupled with the I/O circuit, to enable communications between the CPU circuit and another apparatus. In another instance, the apparatus may include a plurality of coupler pads disposed on a first surface of the apparatus; and a processor electrically coupled with the coupler pads. One of the coupler pads may form capacitive coupling with one of coupler pads disposed on a second surface of another apparatus, in response to a placement of the first surface in at least partial contact with the second surface, to enable proximity data communication between the processor and the other apparatus. Other embodiments may be described and/or claimed.

4. 发明申请

US20200091608A1 WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS 审中-公开
公开(公告)号：US20200091608A1
公开(公告)日：2020-03-19
申请号：US16472830
申请日：2017-12-20
申请人： Intel Corporation
发明人： Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC分类号： H01Q9/04 , H01Q1/38 , H01Q1/48 , H01Q1/24 , H01Q5/47 , H01Q3/24 , H01Q21/24 , H04B1/3827 , H04B15/04 , H04B7/0456 , H04B7/06 , H03L7/14
摘要： Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

5. 发明授权

US09455529B2 Proximity capacitive coupling for board-to-board wide bandwidth transmissions 有权
标题翻译：用于板对板宽带宽传输的接近电容耦合
公开(公告)号：US09455529B2
公开(公告)日：2016-09-27
申请号：US14286445
申请日：2014-05-23
申请人： Intel Corporation
发明人： Shreyas Sen , Chintan S. Thakkar , James E. Jaussi , Bryan K. Casper
IPC分类号： H01R12/00 , H01R13/6461 , H01R43/20 , H01R13/6586 , H01R13/6598 , H01R13/652 , H01R13/627 , G06F3/044 , H01R13/6464 , H01R13/62 , H01R13/66
CPC分类号： H01R13/6461 , G06F3/044 , G06F2203/04108 , H01R13/6205 , H01R13/627 , H01R13/6464 , H01R13/652 , H01R13/6586 , H01R13/6598 , H01R13/6625 , H01R43/20 , Y10T29/435
摘要： Techniques for forming high-bandwidth proximity connection between capacitively coupled plug and receptacle are described herein. A system for achieving capacitive coupling between contactless pads is described. The techniques include aligning and retaining the plug and receptacle in close proximity to one another. The techniques include cancelling crosstalk in the system based on the symmetry and orientation of differential pairs comprising signal pads. The techniques include enabling a high-bandwidth proximity transmission by filtering the transmission using a silicon buffer component.
摘要翻译：本文描述了用于在电容耦合插头和插座之间形成高带宽接近连接的技术。描述了用于实现非接触焊盘之间的电容耦合的系统。这些技术包括将插头和插座对准并保持彼此靠近。这些技术包括基于包括信号焊盘的差分对的对称性和取向来消除系统中的串扰。这些技术包括通过使用硅缓冲器组件对传输进行滤波来实现高带宽接近传输。

6. 发明申请

US20220384956A1 WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS 有权
公开(公告)号：US20220384956A1
公开(公告)日：2022-12-01
申请号：US17734529
申请日：2022-05-02
申请人： Intel Corporation
发明人： Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asi , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC分类号： H01Q9/04 , H01Q5/47 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
摘要： Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

7. 发明授权

US11424539B2 Wireless communication technology, apparatuses, and methods 有权
公开(公告)号：US11424539B2
公开(公告)日：2022-08-23
申请号：US16472830
申请日：2017-12-20
申请人： Intel Corporation
发明人： Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC分类号： H01Q5/47 , H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
摘要： Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

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