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1. 发明授权

US10394280B2 Wearable electronic devices and components thereof 有权
公开(公告)号：US10394280B2
公开(公告)日：2019-08-27
申请号：US15870819
申请日：2018-01-12
申请人： INTEL CORPORATION
发明人： Thorsten Meyer , Dirk Plenkers , Hans-Joachim Barth , Bernd Waidhas , Yen Hsiang Chew , Kooi Chi Ooi , Howe Yin Loo
IPC分类号： G06F1/16 , B29C39/02 , B29C39/10 , B29C65/48 , G02C5/14 , G02C11/00 , B29L31/34
摘要： Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.

2. 发明申请

US20190206698A1 3D STACKED-IN-RECESS SYSTEM IN PACKAGE 审中-公开
公开(公告)号：US20190206698A1
公开(公告)日：2019-07-04
申请号：US16325665
申请日：2016-09-27
申请人： Bok Eng CHEAH , Min Suet LIM , Jackson Chung Peng KONG , Howe Yin LOO , Intel Corporation
发明人： Bok Eng Cheah , Min Suet Lim , Jackson Chung Peng Kong , Howe Yin Loo
IPC分类号： H01L21/48 , H01L23/48 , H01L23/538 , H01L23/552 , H01L25/065 , H01L25/00 , H01L29/06
CPC分类号： H01L21/48 , H01L23/00 , H01L23/48 , H01L23/538 , H01L23/552 , H01L25/0652 , H01L25/0655 , H01L25/18 , H01L25/50 , H01L29/0657 , H01L2224/13025 , H01L2224/16146 , H01L2224/16225 , H01L2224/16235 , H01L2224/17181 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/1432 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/3025
摘要： A system in package device includes a landed first die disposed on a package substrate. The landed first die includes a notch that is contoured and that opens the backside surface of the die to a ledge. A stacked die is mounted at the ledge and the two dice are each contacted by a through-silicon via (TSV). The system in package device also includes a landed subsequent die on the package substrate and a contoured notch in the landed subsequent die and the notch in the first die form a composite contoured recess into which the stacked die is seated.

3. 发明申请

US20170075388A1 MULTI-ORIENTATION DISPLAY DEVICE 审中-公开
标题翻译：多方位显示设备
公开(公告)号：US20170075388A1
公开(公告)日：2017-03-16
申请号：US14852592
申请日：2015-09-13
申请人： Intel Corporation
发明人： Chee Chun Yee , David W. Browning , Bok Eng Cheah , Jackson Chung Peng Kong , Min Suet Lim , Howe Yin Loo , Poh Tat Oh
IPC分类号： G06F1/16 , G06F3/041
CPC分类号： G06F1/1652 , G06F1/1626 , G06F1/1641 , G06F1/1643 , G06F1/1675 , G06F3/041 , G06F2203/04102
摘要： A computing device includes a flexible display screen, a housing to house at least one processor device and at least one memory element, and a first wing to support a side portion of the display screen. The front face of the housing includes a center portion of the display screen. The first wing is connected to the housing by a hinge, the first wing configured to swivel about an axis defined by the hinge. The hinge is configured to lock the first wing in at least two wing positions, a first of the wing positions supports the side portion of the display screen in a first orientation, a second of the wing positions supports the side portion of the display screen in a second orientation, and the side portion of the display screen is active in the first orientation and hidden in the second orientation.
摘要翻译：计算设备包括柔性显示屏，用于容纳至少一个处理器设备的壳体和至少一个存储器元件，以及支撑显示屏幕的侧面部分的第一翼片。壳体的前表面包括显示屏的中心部分。第一翼通过铰链连接到壳体，第一翼构造成围绕由铰链限定的轴线旋转。所述铰链被构造成将所述第一翼片锁定在至少两个翼位置中，所述机翼位置中的第一翼位置以第一方向支撑所述显示屏的侧部，所述翼位置中的第二翼支撑所述显示屏幕的侧部第二取向，并且显示屏幕的侧部在第一取向中是有效的，并且在第二取向中被隐藏。

4. 发明申请

US20160274621A1 WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF 有权
标题翻译：电子设备及其组件
公开(公告)号：US20160274621A1
公开(公告)日：2016-09-22
申请号：US14778070
申请日：2014-11-12
申请人： INTEL CORPORATION
发明人： Thorsten Meyer , Dirk Plenkers , Hans-Joachim Barth , Bernd Waidhas , Yen Hsiang Chew , Kooi Chi Ooi , Howe Yin Loo
IPC分类号： G06F1/16 , B29C65/48 , B29C39/02 , B29C39/10 , G02C11/00 , G02C5/14
CPC分类号： G06F1/163 , B29C39/021 , B29C39/10 , B29C65/4825 , B29L2031/3481 , G02C5/143 , G02C11/10
摘要： Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.
摘要翻译：可穿戴式电子设备，其组件以及相关系统和技术的实施例在此公开。例如，可穿戴电子设备可以包括具有第一表面和第二表面的可穿戴支撑结构; 位于所述第一表面的第一电极，其中当所述可穿戴电子设备被所述用户佩戴在所述用户身体的一部分上时，所述第一电极布置成在所述用户身体的所述部分中接触所述用户的皮肤; 位于所述第二表面的第二电极，其中，当所述可佩戴的电子装置被使用者佩戴在所述使用者身体的所述部分上时，所述第二电极被布置成在所述使用者身体的所述部分中不接触所述使用者的皮肤; 以及电阻开关，其具有分别耦合到第一和第二电极的第一和第二输入端子。可以公开和/或要求保护其他实施例。

5. 发明申请

US20200325711A1 MICRO-HINGE FOR AN ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20200325711A1
公开(公告)日：2020-10-15
申请号：US16859452
申请日：2020-04-27
申请人： Intel Corporation
发明人： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Jackson Chung Peng Kong , Poh Tat Oh
IPC分类号： E05D3/06 , G06F1/16 , G06F1/3218 , G06F1/3234 , E05D11/00 , H05K5/02
摘要： Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.

6. 发明申请

US20180157289A1 WEARABLE ELECTRONIC DEVICES AND COMPONENTS THEREOF 审中-公开
公开(公告)号：US20180157289A1
公开(公告)日：2018-06-07
申请号：US15870819
申请日：2018-01-12
申请人： INTEL CORPORATION
发明人： Thorsten Meyer , Dirk Plenkers , Hans-Joachim Barth , Bernd Waidhas , Yen Hsiang Chew , Kooi Chi Ooi , Howe Yin Loo
IPC分类号： G06F1/16 , G02C11/00 , G02C5/14 , B29C39/02 , B29C65/48 , B29C39/10 , B29L31/34
CPC分类号： G06F1/163 , B29C39/021 , B29C39/10 , B29C65/4825 , B29L2031/3481 , G02C5/143 , G02C11/10
摘要： Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the users skin in the portion of the users body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the users body, the second electrode is arranged to not contact the users skin in the portion of the users body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.

7. 发明申请

US20170265306A1 MICROELECTRONIC DEVICE ATTACHMENT ON A REVERSE MICROELECTRONIC PACKAGE 审中-公开
公开(公告)号：US20170265306A1
公开(公告)日：2017-09-14
申请号：US15607612
申请日：2017-05-29
申请人： INTEL CORPORATION
发明人： Howe Yin Loo , Choong Kooi Chee
IPC分类号： H05K1/18 , H01L23/13 , H01L23/367 , H01L23/498 , H01L25/065 , H05K1/14 , H05K3/30 , H01L23/427 , H05K3/34
CPC分类号： H05K1/181 , H01L23/13 , H01L23/3677 , H01L23/427 , H01L23/49827 , H01L25/0652 , H01L2224/16 , H01L2225/06517 , H01L2225/0652 , H05K1/141 , H05K1/144 , H05K1/182 , H05K1/183 , H05K3/30 , H05K3/3415 , H05K2201/09036 , H05K2201/09063 , H05K2201/09072 , H05K2201/10378 , H05K2201/10416 , H05K2201/10734 , Y02P70/611 , Y10T29/4913
摘要： The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

8. 发明授权

US11006514B2 Three-dimensional decoupling integration within hole in motherboard 有权
公开(公告)号：US11006514B2
公开(公告)日：2021-05-11
申请号：US16481043
申请日：2017-03-30
申请人： Intel Corporation
发明人： Jia Yan Go , Min Suet Lim , Tin Poay Chuah , Seok Ling Lim , Howe Yin Loo
IPC分类号： H01L23/552 , H05K1/02 , H01L21/50 , H01L23/498 , H01L25/16 , H05K1/11 , H05K1/18 , H05K3/30 , H01L49/02 , H01L23/64
摘要： Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer mounted on a motherboard. The semiconductor package also includes a hole in motherboard (HiMB) that is formed in the motherboard. The semiconductor package has one or more capacitors mounted on an electrical shield. The electrical shield may be embedded in the HiMB of the motherboard. Accordingly, the semiconductor package has capacitors vertically embedded between the electrical shield and the HiMB of the motherboard. The semiconductor package may also have one or more HiMB sidewalls formed on the HiMB, where each of the one or more HiMB sidewalls includes at least one or more plated through holes (PTHs) with an exposed layer. The PTHs may be electrically coupled to the capacitors as the capacitors are vertically embedded between the electrical shield sidewalls and the HiMB sidewalls (i.e., three-dimensional (3D) capacitors).

9. 发明授权

US10036187B2 Micro-hinge for an electronic device 有权
公开(公告)号：US10036187B2
公开(公告)日：2018-07-31
申请号：US14996568
申请日：2016-01-15
申请人： Intel Corporation
发明人： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Chung Peng Jackson Kong , Poh Tat Oh
IPC分类号： E05D3/06 , G06F1/16 , G06F1/32 , E05D11/00 , H05K5/02
摘要： An apparatus is provided including a docking device to accept a computing device, the docking device including a keyboard and a hinge to connect the computing device to the keyboard, the hinge is configured to allow the computing device, when connected to the hinge, to rotate relative to the keyboard in a laptop orientation. The hinge includes a plurality of interlinked parallel hinge segments at least partially enclosed in a flexible covering, and each hinge segment is to rotate about a respective one of a plurality of parallel axes of the hinge.

10. 发明授权

US10000953B2 Micro-hinge for an electronic device 有权
公开(公告)号：US10000953B2
公开(公告)日：2018-06-19
申请号：US14996568
申请日：2016-01-15
申请人： Intel Corporation
发明人： Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Chung Peng Jackson Kong , Poh Tat Oh
IPC分类号： E05D3/06 , G06F1/16 , G06F1/32 , E05D11/00 , H05K5/02
摘要： An apparatus is provided including a docking device to accept a computing device, the docking device including a keyboard and a hinge to connect the computing device to the keyboard, the hinge is configured to allow the computing device, when connected to the hinge, to rotate relative to the keyboard in a laptop orientation. The hinge includes a plurality of interlinked parallel hinge segments at least partially enclosed in a flexible covering, and each hinge segment is to rotate about a respective one of a plurality of parallel axes of the hinge.

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