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    • 5. 发明申请
    • CHEMO-EPITAXY MASK GENERATION
    • US20160357896A1
    • 2016-12-08
    • US14733040
    • 2015-06-08
    • International Business Machines Corporation
    • Joy ChengGregory S. DoerkMichael A. GuillornKafai LaiHsinYu Tsai
    • G06F17/50
    • H01L21/3086G03F7/0002
    • A method to generate chemo-epitaxy masks includes receiving a device pattern comprising a plurality of device geometries, wherein the device pattern conforms to chemo-epitaxy constraints, enlarging the device geometries along a width of the device geometries to provide enlarged device geometries, and using the enlarged device geometries to generate at least one chemo-epitaxy mask corresponding to the device pattern. The at least one chemo-epitaxy mask may include a neutral hard mask and one or more cut masks. The method may also include bridging device geometries that are within a selected distance along a length of the device geometries and merging device geometries that overlap. The method may also include filling break regions between the device geometries with a neutral fill pattern. A corresponding computer program product and computer system are also disclosed herein.
    • 生成化学外延掩模的方法包括接收包括多个器件几何形状的器件图案,其中器件图案符合化学外延约束,沿着器件几何形状的宽度扩大器件几何形状以提供扩大的器件几何形状,并且使用 放大的器件几何形状以产生对应于器件图案的至少一个化学外延掩模。 所述至少一个化学外延掩模可以包括中性硬掩模和一个或多个切割掩模。 该方法还可以包括沿着装置几何形状的长度和重叠的合并装置几何形状的选定距离内的桥接装置几何形状。 该方法还可以包括在具有中性填充图案的装置几何形状之间填充断裂区域。 本文还公开了相应的计算机程序产品和计算机系统。
    • 6. 发明授权
    • Chemo epitaxy mask generation
    • Chemo外延掩模生成
    • US09514263B1
    • 2016-12-06
    • US14733040
    • 2015-06-08
    • International Business Machines Corporation
    • Joy ChengGregory S. DoerkMichael A. GuillornKafai LaiHsinYu Tsai
    • G06F17/50
    • H01L21/3086G03F7/0002
    • A method to generate chemo-epitaxy masks includes receiving a device pattern comprising a plurality of device geometries, wherein the device pattern conforms to chemo-epitaxy constraints, enlarging the device geometries along a width of the device geometries to provide enlarged device geometries, and using the enlarged device geometries to generate at least one chemo-epitaxy mask corresponding to the device pattern. The at least one chemo-epitaxy mask may include a neutral hard mask and one or more cut masks. The method may also include bridging device geometries that are within a selected distance along a length of the device geometries and merging device geometries that overlap. The method may also include filling break regions between the device geometries with a neutral fill pattern. A corresponding computer program product and computer system are also disclosed herein.
    • 产生化学外延掩模的方法包括接收包括多个器件几何形状的器件图案,其中器件图案符合化学外延约束,沿着器件几何形状的宽度放大器件几何形状以提供扩大的器件几何形状,以及使用 放大的器件几何形状以产生对应于器件图案的至少一个化学外延掩模。 所述至少一个化学外延掩模可以包括中性硬掩模和一个或多个切割掩模。 该方法还可以包括沿着装置几何形状的长度和重叠的合并装置几何形状的选定距离内的桥接装置几何形状。 该方法还可以包括在具有中性填充图案的装置几何形状之间填充断裂区域。 本文还公开了相应的计算机程序产品和计算机系统。
    • 8. 发明授权
    • Fin design level mask decomposition for directed self assembly
    • 翅片设计级面罩分解用于定向自组装
    • US08656322B1
    • 2014-02-18
    • US13744606
    • 2013-01-18
    • International Business Machines Corporation
    • Daniel J. DecheneMichael A. GuillornKafai LaiJed W. PiteraHsinYu Tsai
    • G06F17/50
    • G06F17/5068G03F7/0002H01L21/823431
    • A design layout including shapes of target areas for forming semiconductor fins employing directed self-assembly can be decomposed into guiding patterns and cut patterns. The lengthwise edges of the shapes of target areas are adjusted. Widthwise edges of the adjusted shapes are extended outward to generate diffusion shapes. Guiding pattern shapes are then generated employing the diffusion shapes. Taper edges are adjusted based on process bias of a photoresist material to be subsequently employed. Optionally, a portion of a guiding pattern shape between diffusion shapes may be removed as a connection shape. The guiding pattern shapes can define at least one guiding pattern mask for lithographic pattern of guiding pattern shapes, and cut shapes can be derived from the diffusion shapes and the guiding pattern shapes. The guiding pattern shapes and the cut shapes may be adjusted to accommodate effects at device cell edges and at device macro edges.
    • 包括使用定向自组装形成半导体翅片的目标区域的形状的设计布局可以分解为引导图案和切割图案。 调整目标区域的形状的纵向边。 调整后的形状的纵向边缘向外延伸以产生扩散形状。 然后使用扩散形状产生引导图案形状。 基于待随后使用的光致抗蚀剂材料的工艺偏压来调整锥边。 可选地,作为连接形状,可以去除扩散形状之间的引导图案形状的一部分。 引导图案形状可以限定用于引导图案形状的平版印刷图案的至少一个引导图案掩模,并且可以从扩散形状和引导图案形状导出切割形状。 可以调整引导图案形状和切割形状以适应设备单元边缘和设备宏边缘处的效果。