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1. 发明申请

US20220155022A1 HEAT DISSIPATION DEVICE 有权
公开(公告)号：US20220155022A1
公开(公告)日：2022-05-19
申请号：US17338698
申请日：2021-06-04
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： Kai-Yang Tung , Hung-Ju Chen
IPC分类号： F28D15/02
摘要： A heat dissipation device includes a first pipeline and a second pipeline. The first pipeline is configured to circulate a first fluid. The second pipeline is configured to circulate a second fluid. The second pipeline has a sleeve section, an input portion, and an output portion. The sleeve section sleeved with a part of the first pipeline to form a circulation tunnel between the sleeve section and the part of the first pipeline. The input portion and the output portion are connected to two ends of the sleeve section respectively.

2. 发明授权

US11306980B2 Heat sink and thermal dissipation system 有权
公开(公告)号：US11306980B2
公开(公告)日：2022-04-19
申请号：US17030403
申请日：2020-09-24
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： Kai-Yang Tung , Hung-Ju Chen
IPC分类号： F28F7/00 , F28F3/02 , F28F13/00 , F28F21/08 , F28D21/00
摘要： A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.

3. 发明授权

US11622459B2 Sealing method for server 有权
公开(公告)号：US11622459B2
公开(公告)日：2023-04-04
申请号：US17335030
申请日：2021-05-31
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： Kai-Yang Tung , Hung-Ju Chen
IPC分类号： H05K5/06
摘要： A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

4. 发明授权

US11032938B2 Temperature control device and control method thereof 有权
公开(公告)号：US11032938B2
公开(公告)日：2021-06-08
申请号：US15867408
申请日：2018-01-10
申请人： INVENTEC (PUDONG) TECHNOLOGY CORPORATION , INVENTEC CORPORATION
发明人： Cheng-Ming Lee , Kai-Yang Tung , Mao-Ching Lin
IPC分类号： H05K7/20 , G01K3/08 , G01K7/00 , G05B6/02 , G05D23/19 , G05D23/00
摘要： A temperature control device comprises a fan, a temperature sensor, a modeling circuit and a PID controller, with the PID controller connected with the fan, the temperature sensor and the modeling circuit. The fan drives airflows for controlling the temperature of a controlled region. The temperature sensor is disposed in the controlled region and obtains a detected temperature indicating the temperature of the controlled region. The modeling circuit obtains at least one cooling parameter group based on a transfer function. The PID controller controls the fan based on an initial parameter group when the detected temperature is lower than a first temperature, and controls the fan based on said at least one cooling parameter group when the detected temperature is equal to or higher than the first temperature. The initial parameter group comprises initial parameters, with the value of each of the initial parameters equal to a preset value.

5. 发明授权

US09007765B2 Server system and method for controlling the same 有权
标题翻译：服务器系统及其控制方法
公开(公告)号：US09007765B2
公开(公告)日：2015-04-14
申请号：US13802923
申请日：2013-03-14
申请人： Inventec (Pudong) Technology Corporation , Inventec Corporation
发明人： Chien-An Chen , Chih-Chien Lin , Kai-Yang Tung , Hsueh-Hui Chang , Hui-Min Feng
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： G06F1/206 , H05K7/20736 , H05K7/20836
摘要： A server system has an air inlet side and an air outlet side. The server system includes two server rack modules arranged side by side and a controller electrically connected to the server rack modules. Each server rack module includes a cabinet having a first side close to the air inlet side, multiple server hosts detachably disposed in the cabinet and a fan component. The fan component, disposed at the first side, includes multiple fans electrically connected to the controller. The first side of one of the cabinets abuts against the second side of the other cabinet. When the fan components operate, an air flow is formed in the cabinets. The server hosts are located in the flow path of the air flow. When one of the fans is failed, the controller is adapted for increasing a rotational speed of the fan component close to the air outlet side.
摘要翻译：服务器系统具有空气入口侧和出气侧。服务器系统包括并排布置的两个服务器机架模块和与服务器机架模块电连接的控制器。每个服务器机架模块包括具有靠近空气入口侧的第一侧的机柜，可拆卸地布置在机壳中的多个服务器主机和风扇组件。设置在第一侧的风扇部件包括电连接到控制器的多个风扇。其中一个机柜的第一面靠在另一个机柜的第二面。当风扇部件运行时，机柜中形成有空气流。服务器主机位于空气流的流动路径中。当其中一个风扇发生故障时，控制器适于增加靠近出风侧的风扇部件的转速。

6. 发明授权

US11470745B1 Electronic device and heat dissipation assembly 有权
公开(公告)号：US11470745B1
公开(公告)日：2022-10-11
申请号：US17349206
申请日：2021-06-16
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： Kai-Yang Tung , Hung-Ju Chen
IPC分类号： H05K7/20
摘要： An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed on the chassis. The heat dissipation assembly includes evaporator and condenser. The evaporator is in thermal contact with the heat source. The condenser is disposed on the chassis and comprises first thermally conductive plate, second thermally conductive plate and third thermally conductive plate that are stacked on one another. A condensation space is formed between the first thermally conductive plate and the second thermally conductive plate. A first liquid-cooling space is formed between the second thermally conductive plate and the third thermally conductive plate. The condensation space is in fluid communication with the evaporator. The first liquid-cooling space is not in fluid communication with the condensation space and is configured to be in fluid communication with the external heat dissipation device.

7. 发明授权

US11291138B2 Cooling system for server 有权
公开(公告)号：US11291138B2
公开(公告)日：2022-03-29
申请号：US16892564
申请日：2020-06-04
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： Kai-Yang Tung , Hung-Ju Chen
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00 , H05K7/20 , H05K5/02 , H05K5/03
摘要： The invention provides a cooling system for a server. The cooling system includes a casing and a first heat dissipation device. The casing includes a tank and a cover. The tank has an accommodation space. The cover is movably mounted on the tank, and the cover covers the accommodation space so as to form an airtight space with the tank. The first heat dissipation device is mounted on the cover and located within the airtight space of the casing.

8. 发明授权

US11564336B2 Electronic device 有权
公开(公告)号：US11564336B2
公开(公告)日：2023-01-24
申请号：US17349232
申请日：2021-06-16
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： Kai-Yang Tung , Hung-Ju Chen
IPC分类号： H05K7/20
摘要： An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

9. 发明授权

US11378344B2 Immersion cooling system 有权
公开(公告)号：US11378344B2
公开(公告)日：2022-07-05
申请号：US16902687
申请日：2020-06-16
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： Kai-Yang Tung , Hung-Ju Chen
IPC分类号： F28D15/02
摘要： An immersion cooling system configured to store a coolant configured for cooling a heat source and including a liquid container, a tube and a gas regulating assembly. The liquid container is configured to store the coolant configured to cool the heat source. One end of the tube is connected to the liquid container. The gas regulating assembly is located above the tube and includes a valve, a cooler, and a gas container. The valve includes a first pipe, a second pipe and a third pipe. The valve is switchable to connect the first pipe to the second pipe or connect the first pipe to the third pipe. The first pipe of the valve is connected to the tube via the cooler. The second pipe is connected to ambient air, and the third pipe is connected to the gas container.

10. 发明授权

US11262135B2 Cooling device 有权
公开(公告)号：US11262135B2
公开(公告)日：2022-03-01
申请号：US16714780
申请日：2019-12-15
申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
发明人： Kai-Yang Tung , Hung-Ju Chen
IPC分类号： H05K7/20 , F28D15/02
摘要： A cooling device configured to cool a heat source includes a tank, a bellow and a solenoid valve. The tank contains a coolant, and the heat source is immersed in the coolant. The solenoid valve includes a first channel, a second channel, a third channel and a piston. The first channel is connected to the tank. The second channel is connected to the bellow. The third channel is connected to an external space. The piston is configured to seal the second channel and the third channel. The piston is configured to connect the first channel to one of the second channel and the third channel. When the heat source is initially activated, the piston is moved to connect the first channel to the third channel. When the heat source operates, the piston is moved to connect the first channel to the second channel.

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