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1. 发明授权

US10442514B2 Human powered watercraft or land vehicle 有权
公开(公告)号：US10442514B2
公开(公告)日：2019-10-15
申请号：US16164718
申请日：2018-10-18
申请人： Jack Chen
发明人： Jack Chen
IPC分类号： B63H16/18 , B60F3/00 , B63H23/04 , B63H23/02
摘要： A human powered watercraft or land vehicle is described herein. A watercraft or land vehicle may have two pedals that reciprocated are in a linear or slightly curved trajectory but not a circular motion. As the two pedals are reciprocated, an output shaft is rotated in either a clockwise or counterclockwise direction when the left pedal is pushed forward or when the right pedal is pushed forward. The output shaft may be connected to a propeller of a watercraft or a land vehicle so as to propel the watercraft or land vehicle forward. The output shaft may receive rotational input through two gears mounted to the output shaft with one-way bearings that enable the output shaft to rotate in the same direction regardless of whether the left pedal or the right pedal is being pushed forward.

2. 外观设计

USD817738S1 Manual knife sharpener 有权
公开(公告)号：USD817738S1
公开(公告)日：2018-05-15
申请号：US29567995
申请日：2016-06-14
申请人： Jack Chen
设计人： Jack Chen

3. 发明授权

US08910169B2 Methods and systems to perform a computer task in a reduced power consumption state 有权
标题翻译：在降低功耗状态下执行计算机任务的方法和系统
公开(公告)号：US08910169B2
公开(公告)日：2014-12-09
申请号：US12241849
申请日：2008-09-30
申请人： Jing W. Wang , Ming Kuang , Michael A. Rothman , Vincent J. Zimmer , Jack Chen , Yebin Andy Zhao
发明人： Jing W. Wang , Ming Kuang , Michael A. Rothman , Vincent J. Zimmer , Jack Chen , Yebin Andy Zhao
IPC分类号： G06F1/32
CPC分类号： G06F1/3203
摘要： Methods and systems to perform a computer task in a reduced power consumption state, including to virtualize physical resources with respect to an operating environment and service environment, to exit the operating environment and enter the service environment, to place a first set of one or more of the physical resources in a reduced power consumption state, and to perform a task in the service environment utilizing a processor and a second set of one or more of the physical resources. A physical resource may be assigned to an operating environment upon an initialization of the operating environment, and re-assigned to the service environment to be utilized by the service environment while other physical resources are placed in a reduced power consumption state.
摘要翻译：在降低的功耗状态下执行计算机任务的方法和系统，包括虚拟化相对于操作环境和服务环境的物理资源，以退出操作环境并进入服务环境，以放置第一组一个或多个的物理资源，并且使用处理器和一个或多个物理资源的第二组在服务环境中执行任务。物理资源可以在操作环境的初始化时被分配给操作环境，并且被重新分配给要由服务环境利用的服务环境，而其他物理资源被置于降低的功耗状态。

4. 发明授权

US08555909B2 Tent 失效
标题翻译：帐篷
公开(公告)号：US08555909B2
公开(公告)日：2013-10-15
申请号：US13242015
申请日：2011-09-23
申请人： Jack Chen
发明人： Jack Chen
IPC分类号： E04H15/44
CPC分类号： E04H15/38 , E04H6/005 , E04H6/04
摘要： A tent having two joints, multiple frames and a fly. The frames are mounted on the joints and are classified into a stationary frame, a supporting frame and at least one pivoting frame. The frames cooperate to define a parking space for receiving a cycle when unfolding. The fly covers the frames and the parking space. The frames are capable of folding and overlapping one another to facilitate carrying and storage of the tent.
摘要翻译：一个帐篷有两个关节，多个框架和飞行。框架安装在接头上，并分为固定框架，支撑框架和至少一个枢转框架。这些框架协作以定义用于在展开时接收周期的停车空间。苍蝇覆盖框架和停车位。这些框架能够彼此折叠和重叠，以便于帐篷的搬运和储存。

5. 发明授权

US08135485B2 Offset correction techniques for positioning substrates within a processing chamber 有权
标题翻译：用于将衬底定位在处理室内的偏移校正技术
公开(公告)号：US08135485B2
公开(公告)日：2012-03-13
申请号：US12237155
申请日：2008-09-24
申请人： Jack Chen , Andrew D. Bailey, III , Ben Mooring , Stephen J Cain
发明人： Jack Chen , Andrew D. Bailey, III , Ben Mooring , Stephen J Cain
IPC分类号： H01L21/00 , G06F19/00 , G05B19/418 , G05B15/00 , B44C1/22 , G06K9/00
CPC分类号： H01L21/681 , H01L21/68
摘要： A method for aligning a substrate to a process center of a support mechanism is provided. The method includes determining substrate thickness after substrate processing at a plurality of orientations and at a plurality of radial distances from a geometric center of the substrate. The method also includes deriving a set of process rate values from substrate thickness and process duration. The method further includes creating for a process rate an off-centered plot, which represents a substantially concentric circle whose points are a circumference of the off-centered plot having substantially the first process rate. The method yet also includes applying a curve-fitting equation to the off-centered plot to determine a set of parameters. The method yet further includes teaching a set of robot arms the set of parameters, thereby enabling the set of robot arms to align another substrate that is supported by the support mechanism with the process center.
摘要翻译：提供了一种将基板对准支撑机构的处理中心的方法。该方法包括在基板处理之后确定基板厚度，该基板在多个取向并且距离基板的几何中心的多个径向距离处。该方法还包括从衬底厚度和工艺持续时间导出一组工艺速率值。该方法还包括为处理速率创建偏心图，其表示基本上同心的圆，其点是具有基本上第一处理速率的偏心图的圆周。该方法还包括将曲线拟合方程应用于偏心图以确定一组参数。该方法还包括向一组机器人手臂提供一组参数，从而使得该组机器人臂将由支撑机构支撑的另一个基板与处理中心对准。

6. 外观设计

USD645421S1 LED base 有权
标题翻译： LED底座
公开(公告)号：USD645421S1
公开(公告)日：2011-09-20
申请号：US29383417
申请日：2011-01-18
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
设计人： Bily Wang , Sung-Yi Hsiao , Jack Chen

7. 发明申请

US20110140248A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110140248A1
公开(公告)日：2011-06-16
申请号：US13030887
申请日：2011-02-18
申请人： Chia-Lun TSAI , Ching-Yu Ni , Jack Chen , Wen-Cheng Chien
发明人： Chia-Lun TSAI , Ching-Yu Ni , Jack Chen , Wen-Cheng Chien
IPC分类号： H01L23/552 , H01L23/485
CPC分类号： H01L24/11 , H01L2224/0401 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/05644 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A semiconductor device and manufacturing method thereof are disclosed. The device comprises a semiconductor die, a passivation layer, a wiring redistribution layer (RDL), an Ni/Au layer, and a solder mask. The semiconductor die comprises a top metal exposed in an active surface thereof. The passivation layer overlies the active surface of the semiconductor die, and comprises a through passivation opening overlying the top metal. The wiring RDL, comprising an Al layer, overlies the passivation layer, and electrically connects to the top metal via the passivation opening. The solder mask overlies the passivation layer and the wiring RDL, exposing a terminal of the wiring RDL.
摘要翻译：公开了一种半导体器件及其制造方法。该器件包括半导体管芯，钝化层，布线再分布层（RDL），Ni / Au层和焊料掩模。半导体管芯包括在其活性表面中暴露的顶部金属。钝化层覆盖半导体管芯的有源表面，并且包括覆盖顶部金属的贯通钝化开口。包括Al层的布线RDL覆盖钝化层，并通过钝化开口电连接到顶部金属。焊接掩模覆盖钝化层和布线RDL，露出布线RDL的端子。

8. 发明申请

US20100127292A1 Wafer level led package structure for increasing light-emitting efficiency and method for making the same 审中-公开
标题翻译：用于提高发光效率的晶片级LED封装结构和制造它的方法
公开(公告)号：US20100127292A1
公开(公告)日：2010-05-27
申请号：US12461742
申请日：2009-08-24
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L33/00 , H01L21/30
CPC分类号： H01L33/38 , H01L33/508 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： A wafer level LED package structure for increasing light-emitting efficiency includes: a light-emitting unit, an insulating unit, two first conductive units and two second conductive units. The light-emitting unit has a light-emitting body, a positive conductive layer, a negative conductive layer, and a reflecting insulating layer formed between the positive conductive layer and the negative conductive layer. The light-emitting body has a bottom material layer and a top material layer. The insulating unit is formed around an outer area of a top surface of the bottom material layer and formed on a top surface of the reflecting insulating layer. One first conductive unit is formed on one part of the positive conductive layer and the insulating unit, and another first conductive unit is formed on one part of the negative conductive layer and the insulating unit. The two second conductive units are respectively formed on the two first conductive units.
摘要翻译：用于提高发光效率的晶片级LED封装结构包括：发光单元，绝缘单元，两个第一导电单元和两个第二导电单元。发光单元具有形成在正导电层和负导电层之间的发光体，正导电层，负导电层和反射绝缘层。发光体具有底部材料层和顶部材料层。绝缘单元形成在底部材料层的顶表面的外部区域周围，并形成在反射绝缘层的顶表面上。一个第一导电单元形成在正导电层和绝缘单元的一部分上，另一个第一导电单元形成在负导电层和绝缘单元的一部分上。两个第二导电单元分别形成在两个第一导电单元上。

9. 发明申请

US20100032706A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING CONDUCTIVE AREA AND HEAT-DISSIPATING AREA AND METHOD FOR MAKING THE SAME 有权
标题翻译：用于增加导电区域和散热区域的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20100032706A1
公开(公告)日：2010-02-11
申请号：US12346329
申请日：2008-12-30
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H01L33/00 , H01L21/02
CPC分类号： H01L33/38 , H01L33/44 , H01L33/508 , H01L2224/48091 , H01L2224/73265 , H01L2933/0016 , H01L2924/00014
摘要： A wafer level LED package structure includes a light-emitting unit, a first conductive unit, a second conductive unit and an insulative unit. The light-emitting unit has a light-emitting body, a positive conductive layer and a negative conductive layer formed on the light-emitting body, and a first insulative layer formed between the positive conductive layer and the negative conductive layer. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive layer formed on the first positive conductive layer and a second negative conductive layer formed on the first negative conductive layer. The insulative unit has a second insulative layer formed on the first insulative layer and disposed between the second positive conductive layer and the second negative conductive layer.
摘要翻译：晶圆级LED封装结构包括发光单元，第一导电单元，第二导电单元和绝缘单元。发光单元具有形成在发光体上的发光体，正导电层和负导电层，以及形成在正导电层和负导电层之间的第一绝缘层。第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。第二导电单元具有形成在第一正导电层上的第二正导电层和形成在第一负导电层上的第二负导电层。绝缘单元具有形成在第一绝缘层上并设置在第二正导电层和第二负导电层之间的第二绝缘层。

10. 发明申请

US20090104058A1 Sealed pump 审中-公开
标题翻译：密封泵
公开(公告)号：US20090104058A1
公开(公告)日：2009-04-23
申请号：US11975180
申请日：2007-10-18
申请人： Jack Chen
发明人： Jack Chen
IPC分类号： F04B17/03
CPC分类号： F04D3/00 , F04D13/064
摘要： A liquid pump has an annular stator having wire windings that extend around a generally tubular central opening. An inner housing made of a non-ferrous material has an inner opening, an input end, and an output end such that liquid can enter the input end, pass through the inner opening and exit through the output end. A portion of the housing extends through the central opening of the stator and a brushless rotor mounted on a shaft is positioned entirely within the housing to thereby seal the shaft from leakage. A drive attached to the shaft urges the liquid from the input end of the housing to the output.
摘要翻译：液体泵具有环形定子，其具有围绕大体上管状的中心开口延伸的线绕组。由有色金属材料制成的内壳体具有内部开口，输入端和输出端，使得液体可以进入输入端，穿过内部开口并通过输出端排出。壳体的一部分延伸穿过定子的中心开口，并且安装在轴上的无刷转子完全位于壳体内，从而密封轴免于泄漏。连接到轴的驱动器将液体从壳体的输入端推到输出端。

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