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1. 外观设计

USD717208S1 Mobile robotic platform with surface pattern 有权
标题翻译：具有表面图案的移动机器人平台
公开(公告)号：USD717208S1
公开(公告)日：2014-11-11
申请号：US29426696
申请日：2012-07-09
申请人： Jason Stone , Albert Shane , Peter Privitera
设计人： Jason Stone , Albert Shane , Peter Privitera

2. 外观设计

USD722632S1 Mobile robotic platform 有权
公开(公告)号：USD722632S1
公开(公告)日：2015-02-17
申请号：US29426693
申请日：2012-07-09
申请人： Jason Stone , Albert Shane , Peter Privitera
设计人： Jason Stone , Albert Shane , Peter Privitera

3. 外观设计

USD722281S1 Mobile robotic platform 有权
公开(公告)号：USD722281S1
公开(公告)日：2015-02-10
申请号：US29426695
申请日：2012-07-09
申请人： Jason Stone , Albert Shane , Peter Privitera
设计人： Jason Stone , Albert Shane , Peter Privitera

4. 外观设计

USD722631S1 Mobile robotic platform 有权
公开(公告)号：USD722631S1
公开(公告)日：2015-02-17
申请号：US29426692
申请日：2012-07-09
申请人： Jason Stone , Albert Shane , Peter Privitera
设计人： Jason Stone , Albert Shane , Peter Privitera

5. 发明授权

US08991950B2 Modular electronics chassis 有权
标题翻译：模块化电子机箱
公开(公告)号：US08991950B2
公开(公告)日：2015-03-31
申请号：US13939027
申请日：2013-07-10
申请人： Peter Privitera , Jon Carver , Joshua Druker , Tad Hunt , Douglas Brockett , Ramesh Balan
发明人： Peter Privitera , Jon Carver , Joshua Druker , Tad Hunt , Douglas Brockett , Ramesh Balan
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00 , G06F1/18 , G11B33/12 , H05K5/02 , H05K13/00
CPC分类号： G06F1/187 , G06F1/183 , G11B33/124 , G11B33/128 , H05K5/0295 , H05K13/00 , Y10T29/49002
摘要： An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis includes a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, an ejection actuator including a spring member connected to the ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis includes a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the ejection actuator along the chassis enclosure.
摘要翻译：提供了一种用于从底盘移除模块化电子设备的装置及其组装方法。用于从底盘移除模块化电子设备的装置包括可枢转地联接到底盘的门，与门滑动接合的滑动元件，包括连接到弹出致动器和底盘后部的弹簧构件的弹出致动器，以及将滑动元件与喷射致动器连接的联动元件。此外，用于从底盘移除模块化电子设备的装置包括设置在机箱外壳中的导轨，以引导模块化电子设备并沿着底盘外壳引导排出致动器。

6. 外观设计

USD750033S1 Modular electronics chassis 有权
标题翻译：模块化电子机箱
公开(公告)号：USD750033S1
公开(公告)日：2016-02-23
申请号：US29460435
申请日：2013-07-10
申请人： Peter Privitera , Jon Carver , Joshua Druker , Tad Hunt , Douglas Brockett , Ramesh Balan
设计人： Peter Privitera , Jon Carver , Joshua Druker , Tad Hunt , Douglas Brockett , Ramesh Balan

7. 发明申请

US20150015131A1 Modular Electronics Chassis 有权
标题翻译：模块化电子机箱
公开(公告)号：US20150015131A1
公开(公告)日：2015-01-15
申请号：US13939027
申请日：2013-07-10
申请人： Peter Privitera , Jon Carver , Joshua Druker , Tad Hunt , Douglas Brockett , Ramesh Balan
发明人： Peter Privitera , Jon Carver , Joshua Druker , Tad Hunt , Douglas Brockett , Ramesh Balan
IPC分类号： G06F1/18 , H05K13/00
CPC分类号： G06F1/187 , G06F1/183 , G11B33/124 , G11B33/128 , H05K5/0295 , H05K13/00 , Y10T29/49002
摘要： An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis comprises a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, an ejection actuator including a spring member connected to the ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis comprises a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the ejection actuator along the chassis enclosure.
摘要翻译：提供了一种用于从底盘移除模块化电子设备的装置及其组装方法。用于从底盘移除模块化电子设备的装置包括可枢转地联接到底盘的门，与门滑动接合的滑动元件，包括连接到排出致动器和底盘后部的弹簧构件的弹出致动器，以及将滑动元件与喷射致动器连接的联动元件。此外，用于从底盘移除模块化电子设备的装置包括设置在机箱外壳中的导轨，以引导模块化电子设备并沿着机箱外壳引导排出致动器。

8. 发明授权

US09389651B2 Modular electronics chassis 有权
标题翻译：模块化电子机箱
公开(公告)号：US09389651B2
公开(公告)日：2016-07-12
申请号：US13900358
申请日：2013-05-22
申请人： Douglas Brockett , Peter Privitera , Jon Carver , Joshua Druker , Tad Hunt , Ramesh Balan
发明人： Douglas Brockett , Peter Privitera , Jon Carver , Joshua Druker , Tad Hunt , Ramesh Balan
IPC分类号： G06F1/18
CPC分类号： G06F1/187 , G06F1/181 , G11B33/128 , Y10T29/49826 , Y10T29/53274
摘要： An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis comprises a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, a first ejection actuator coupled to the door and configured to move simultaneously with the door, a second ejection actuator including a spring member connected to the second ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the second ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis comprises a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the second ejection actuator along the chassis enclosure.
摘要翻译：提供了一种用于从底盘移除模块化电子设备的装置及其组装方法。用于从底盘移除模块化电子设备的装置包括可枢转地联接到底盘的门，与门滑动接合的滑动元件，联接到门并被配置为与门同时移动的第一弹出致动器，第二弹出致动器，包括连接到第二喷射致动器和底盘后部的弹簧部件，以及将滑动元件与第二喷射致动器连接的联动元件。另外，用于从底盘移除模块化电子设备的装置包括设置在机箱外壳中的导轨，以引导模块化电子设备并沿着机箱外壳引导第二弹出致动器。

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