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    • 1. 发明授权
    • Ball grid array formed on printed circuit board
    • 球形阵列形成在印刷电路板上
    • US09060424B2
    • 2015-06-16
    • US13590590
    • 2012-08-21
    • Jian-Feng ShiuEer-wen TyanTing-Kuang Wang
    • Jian-Feng ShiuEer-wen TyanTing-Kuang Wang
    • H05K1/11H05K3/10H05K1/02
    • H05K1/0219H05K1/0243H05K1/112H05K2201/10734Y10T29/49155
    • A ball grid array formed on a printed circuit board is provided. The ball grid array includes a first bailout module and a second bailout module. The first bailout module includes a plurality of first solder balls arranged as an array. Two of the first solder balls are grounded, and remaining of the first solder balls are disposed within a shielding area defined by the two grounded first balls. Two among the second solder balls are grounded, and remaining of the second solder balls are disposed within a shielding area of the two grounded second balls. The first and second bailout modules deploy substantially a same bailout arrangement, which is associated with relative positions of the two grounded solder balls and the remaining solder balls that are not grounded in each bailout module.
    • 提供形成在印刷电路板上的球栅阵列。 球栅阵列包括第一救援模块和第二救援模块。 第一救援模块包括排列成阵列的多个第一焊球。 第一焊球中的两个接地,并且第一焊球的剩余部分设置在由两个接地的第一球限定的屏蔽区域内。 第二焊球中的两个接地,并且第二焊球的剩余部分设置在两个接地的第二球的屏蔽区域内。 第一和第二救援模块基本上部署相同的救援装置,其与两个接地焊球和在每个救援模块中未接地的剩余焊球相关联。