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1. 发明授权

US09269371B2 Adaptive systems using correntropy 有权
标题翻译：使用科学的自适应系统
公开(公告)号：US09269371B2
公开(公告)日：2016-02-23
申请号：US13578358
申请日：2011-02-11
申请人： Jose Carlos Principe , Abhishek Singh , Weifeng Liu
发明人： Jose Carlos Principe , Abhishek Singh , Weifeng Liu
IPC分类号： G10L21/02 , G10L21/0264 , H03H21/00
CPC分类号： G10L21/0264 , H03H21/0043
摘要： Various methods and systems are provided for related to adaptive systems using correntropy. In one embodiment, a signal processing device includes a processing unit and a memory storing an adaptive system executable in the at least one processing unit. The adaptive system includes modules that, when executed by the processing unit, cause the signal processing device to adaptively filter a desired signal using a correntropy cost function. In another embodiment, a method includes adjusting a coefficient of an adaptive filter based at least in part on a correntropy cost function signal, providing an adaptive filter output signal based at least in part on the adjusted coefficient and a reference signal, and determining an error signal based at least in part on a received signal and the adaptive filter output signal.
摘要翻译：提供了各种方法和系统，用于与使用correntropy的自适应系统相关。在一个实施例中，信号处理设备包括处理单元和存储可在该至少一个处理单元中执行的自适应系统的存储器。自适应系统包括当由处理单元执行时使得信号处理装置使用科学成本函数自适应地过滤所需信号的模块。在另一个实施例中，一种方法包括至少部分地基于科学成本函数信号来调整自适应滤波器的系数，至少部分地基于经调整的系数和参考信号提供自适应滤波器输出信号，并且确定误差信号至少部分地基于接收信号和自适应滤波器输出信号。

2. 发明申请

US20100197258A1 ROBUST SIGNAL DETECTION USING CORRENTROPY 有权
标题翻译：使用CORRENTROPY的稳健信号检测
公开(公告)号：US20100197258A1
公开(公告)日：2010-08-05
申请号：US12597561
申请日：2007-04-26
申请人： Jose C. Principe , Weifeng Liu
发明人： Jose C. Principe , Weifeng Liu
IPC分类号： H04B17/00
CPC分类号： H04L25/06 , G06K9/00523 , G06K9/6248
摘要： A method (200) for detecting a periodic signal (141) in a noisy signal (101) is provided. The method can include applying (210) correntropy to the noisy signal to generate a non-linear mapping, and applying (220) a sub-space projection to the non-linear mapping to produce principal components. A correntropy kernel can be applied to the noisy signal to generate a Gram matrix that is used in a Temporal Principal Component Analysis (TPCA). The correntropy kernel projects nonlinearly the input data to a reproducing kernel Hilbert Space (RKHS) preserving the input time structure and attenuating impulsive noise. The correntropy kernel is data dependent, and the RKHS correlation matrix has the same dimension as the input data correlation matrix. A principal component having a majority of signal energy can be chosen (230) to detect the periodic signal.
摘要翻译：提供一种用于检测噪声信号（101）中的周期信号（141）的方法（200）。该方法可以包括对噪声信号应用（210）精度以产生非线性映射，并且将（220）子空间投影应用于（220）非线性映射以产生主成分。可以将熵核应用于噪声信号以产生在时间主成分分析（TPCA）中使用的Gram矩阵。科学核心非线性地将输入数据投射到重现核心希尔伯特空间（RKHS），保留输入时间结构并衰减脉冲噪声。熵核是数据相关的，RKHS相关矩阵与输入数据相关矩阵具有相同的维度。可以选择具有多数信号能量的主成分（230）来检测周期信号。

3. 发明授权

US08611839B2 Robust signal detection using correntropy 有权
标题翻译：使用correntropy的鲁棒信号检测
公开(公告)号：US08611839B2
公开(公告)日：2013-12-17
申请号：US12597561
申请日：2007-04-26
申请人： Jose C. Principe , Weifeng Liu
发明人： Jose C. Principe , Weifeng Liu
IPC分类号： H04B1/16 , H04B17/00
CPC分类号： H04L25/06 , G06K9/00523 , G06K9/6248
摘要： A method (200) for detecting a periodic signal (141) in a noisy signal (101) is provided. The method can include applying (210) correntropy to the noisy signal to generate a non-linear mapping, and applying (220) a sub-space projection to the non-linear mapping to produce principal components. A correntropy kernel can be applied to the noisy signal to generate a Gram matrix that is used in a Temporal Principal Component Analysis (TPCA). The correntropy kernel projects nonlinearly the input data to a reproducing kernel Hilbert Space (RKHS) preserving the input time structure and attenuating impulsive noise. The correntropy kernel is data dependent, and the RKHS correlation matrix has the same dimension as the input data correlation matrix. A principal component having a majority of signal energy can be chosen (230) to detect the periodic signal.
摘要翻译：提供一种用于检测噪声信号（101）中的周期信号（141）的方法（200）。该方法可以包括对噪声信号应用（210）精度以产生非线性映射，并且将（220）子空间投影应用于（220）非线性映射以产生主成分。可以将熵核应用于噪声信号以产生在时间主成分分析（TPCA）中使用的Gram矩阵。科学核心非线性地将输入数据投射到重现核心希尔伯特空间（RKHS），保留输入时间结构并衰减脉冲噪声。熵核是数据相关的，RKHS相关矩阵与输入数据相关矩阵具有相同的维度。可以选择具有多数信号能量的主成分（230）来检测周期信号。

4. 外观设计

USD634671S1 Automobile 有权
公开(公告)号：USD634671S1
公开(公告)日：2011-03-22
申请号：US29369892
申请日：2010-09-15
申请人： Yong Huang , Yaning Zhao , Baoshan Kang , Chao Wang , Shengguang Zhao , Zhengfei Liu , Weifeng Liu
设计人： Yong Huang , Yaning Zhao , Baoshan Kang , Chao Wang , Shengguang Zhao , Zhengfei Liu , Weifeng Liu

5. 发明授权

US07742311B2 Damage prevention interposer for electronic package and electronic interconnect structure 有权
标题翻译：电子封装和电子互连结构的防损坏插件
公开(公告)号：US07742311B2
公开(公告)日：2010-06-22
申请号：US11735067
申请日：2007-04-13
申请人： Weifeng Liu
发明人： Weifeng Liu
IPC分类号： H01R9/00
CPC分类号： H05K3/303 , H01L23/49811 , H01L23/49816 , H01L2924/0002 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00
摘要： An assembly. The assembly reduces damage to a related electronic package during attachment to a related electronic interconnect structure. The assembly includes an interposer. The interposer has a first side and an opposing second side and has multiple holes formed in the interposer that extend from the first side to the second side. The electronic package is configurable to comprise one or more electronic structures; the interposer is configured for placement between the electronic package and the electronic interconnect structure; the locus of a wall of each of the holes is configured to facilitate insertion of a matching coupling component configured for electrically coupling the electronic package to the electronic interconnect structure; the wall of each hole is configured to provide complete encirclement of that hole; and the interposer mechanically inhibits physical contact between the electronic package and the electronic interconnect structure.
摘要翻译：一个装配该组件在附接到相关电子互连结构期间减少对相关电子封装的损坏。组件包括插入器。插入器具有第一侧和相对的第二侧，并且具有形成在插入件中的从第一侧延伸到第二侧的多个孔。电子封装可配置为包括一个或多个电子结构; 插入器被配置为放置在电子封装和电子互连结构之间; 每个孔的壁的轨迹被配置为便于插入被配置用于将电子封装电耦合到电子互连结构的匹配耦合部件; 每个孔的壁被构造成提供该孔的完全包围; 并且插入器机械地抑制电子封装和电子互连结构之间的物理接触。

6. 发明申请

US20070057382A1 Electronic package with compliant electrically-conductive ball interconnect 有权
标题翻译：具有兼容导电球互连的电子封装
公开(公告)号：US20070057382A1
公开(公告)日：2007-03-15
申请号：US11224919
申请日：2005-09-12
申请人： Weifeng Liu , John Lewis
发明人： Weifeng Liu , John Lewis
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/4867 , H01L2924/0002 , H05K3/3436 , H05K2201/0133 , H05K2201/0212 , H05K2201/0221 , Y02P70/613 , H01L2924/00
摘要： An electronic device comprises a device substrate, a plurality of compliant electrically-conductive balls, and a plurality of solder joints that couple the compliant electrically-conductive balls to the device substrate by a reflow process.
摘要翻译：电子设备包括器件衬底，多个柔性导电球以及通过回流工艺将柔性导电球耦合到器件衬底的多个焊点。

7. 发明申请

US20120299173A1 Thermally Enhanced Stacked Package and Method 审中-公开
标题翻译：热增强堆叠封装和方法
公开(公告)号：US20120299173A1
公开(公告)日：2012-11-29
申请号：US13446874
申请日：2012-04-13
申请人： Anwar A. Mohammed , Weifeng Liu
发明人： Anwar A. Mohammed , Weifeng Liu
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L23/373 , H01L23/3677 , H01L23/49816 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10253 , H01L2924/1305 , H01L2924/1515 , H01L2924/15153 , H01L2924/15311 , H01L2924/15331 , H01L2924/16195 , H01L2924/00
摘要： A package-on-package (PoP) device is provided. The device includes a first package with a first chip mounted on a first substrate, a heat spreader stacked on the first package, the heat spreader in thermal contact with the first chip, and a second package stacked on the heat spreader. In an embodiment, the heat spreader is formed using carbon fibers to provide good lateral thermal conductivity. In an embodiment, ends of the heat spreader project beyond a periphery of the first and second packages.
摘要翻译：提供封装封装（PoP）器件。该装置包括第一封装，其具有安装在第一基板上的第一芯片，堆叠在第一封装上的散热器，与第一芯片热接触的散热器以及堆叠在散热器上的第二封装。在一个实施例中，散热器使用碳纤维形成以提供良好的横向导热性。在一个实施例中，散热器的端部突出超过第一和第二封装的外围。

8. 发明授权

US07825512B2 Electronic package with compliant electrically-conductive ball interconnect 有权
标题翻译：具有兼容导电球互连的电子封装
公开(公告)号：US07825512B2
公开(公告)日：2010-11-02
申请号：US11224919
申请日：2005-09-12
申请人： Weifeng Liu , John J. Lewis
发明人： Weifeng Liu , John J. Lewis
IPC分类号： H01L23/48 , H01L21/44 , B23K31/02
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/4867 , H01L2924/0002 , H05K3/3436 , H05K2201/0133 , H05K2201/0212 , H05K2201/0221 , Y02P70/613 , H01L2924/00
摘要： An electronic device comprises a device substrate, a plurality of compliant electrically-conductive balls, and a plurality of solder joints that couple the compliant electrically-conductive balls to the device substrate by a reflow process.
摘要翻译：电子设备包括器件衬底，多个柔性导电球以及通过回流工艺将柔性导电球耦合到器件衬底的多个焊点。

9. 发明申请

US20100174859A1 HIGH CAPACITY CONTENT ADDRESSABLE MEMORY 审中-公开
标题翻译：高容量内容可寻址存储器
公开(公告)号：US20100174859A1
公开(公告)日：2010-07-08
申请号：US12683223
申请日：2010-01-06
申请人： JOSE C. PRINCIPE , Erion Hasanbelliu , Weifeng Liu
发明人： JOSE C. PRINCIPE , Erion Hasanbelliu , Weifeng Liu
IPC分类号： G06F12/00
CPC分类号： G11C15/04 , G11C7/1006
摘要： A set of data is stored in an input space of a kernel content addressable memory. The input space comprising the set of data is transformed into a feature space of higher dimension. The set of data is a set of transformed data within the feature space. An inner product is calculated between the set of transformed data in the feature space using a kernel function.
摘要翻译：一组数据存储在内核可寻址存储器的输入空间中。包含该组数据的输入空间被转换成较高维度的特征空间。数据集是特征空间内的一组变换数据。使用内核函数在特征空间中的变换数据集之间计算内积。

10. 发明申请

US20080253098A1 Damage Prevention Interposer for Electronic Package and Electronic Interconnect Structure 有权
标题翻译：电子封装和电子互连结构的防损中介器
公开(公告)号：US20080253098A1
公开(公告)日：2008-10-16
申请号：US11735067
申请日：2007-04-13
申请人： Weifeng Liu
发明人： Weifeng Liu
IPC分类号： H05K7/10 , H01L21/00
CPC分类号： H05K3/303 , H01L23/49811 , H01L23/49816 , H01L2924/0002 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00
摘要： An assembly. The assembly reduces damage to a related electronic package during attachment to a related electronic interconnect structure. The assembly includes an interposer. The interposer has a first side and an opposing second side and has multiple holes formed in the interposer that extend from the first side to the second side. The electronic package is configurable to comprise one or more electronic structures; the interposer is configured for placement between the electronic package and the electronic interconnect structure; the locus of a wall of each of the holes is configured to facilitate insertion of a matching coupling component configured for electrically coupling the electronic package to the electronic interconnect structure; the wall of each hole is configured to provide complete encirclement of that hole; and the interposer mechanically inhibits physical contact between the electronic package and the electronic interconnect structure.
摘要翻译：一个装配该组件在附接到相关电子互连结构期间减少对相关电子封装的损坏。组件包括插入器。插入器具有第一侧和相对的第二侧，并且具有形成在插入件中的从第一侧延伸到第二侧的多个孔。电子封装可配置为包括一个或多个电子结构; 插入器被配置为放置在电子封装和电子互连结构之间; 每个孔的壁的轨迹被配置为便于插入被配置用于将电子封装电耦合到电子互连结构的匹配耦合部件; 每个孔的壁被构造成提供该孔的完全包围; 并且插入器机械地抑制电子封装和电子互连结构之间的物理接触。

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