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    • 1. 发明申请
    • MEMORY DEVICE
    • 内存设备
    • US20140231740A1
    • 2014-08-21
    • US13904337
    • 2013-05-29
    • Kabushiki Kaisha Toshiba
    • Ryuji Ohba
    • H01L45/00
    • H01L45/12H01L27/2418H01L45/085H01L45/1233H01L45/145H01L45/146H01L45/148
    • According to one embodiment, a memory device includes first and second conductive layers, a variable resistance portion, and a multiple tunnel junction portion. The variable resistance portion is provided between the first and second conductive layers. The multiple tunnel junction portion is provided between the first conductive layer and the variable resistance portion, and includes first, second, and third tunnel insulating films, and first and second nanocrystal layers. The first nanocrystal layer between the first and second tunnel insulating films includes first conductive minute particles. The second nanocrystal layer between the second and third tunnel insulating films includes second conductive minute particles.
    • 根据一个实施例,存储器件包括第一和第二导电层,可变电阻部分和多个隧道结部分。 可变电阻部分设置在第一和第二导电层之间。 多重隧道结部分设置在第一导电层和可变电阻部分之间,并且包括第一,第二和第三隧道绝缘膜以及第一和第二纳米晶体层。 第一和第二隧道绝缘膜之间的第一纳米晶层包括第一导电微小颗粒。 第二和第三隧道绝缘膜之间的第二纳米晶层包括第二导电微小颗粒。
    • 3. 发明授权
    • Memory device
    • 内存设备
    • US08969843B2
    • 2015-03-03
    • US13904337
    • 2013-05-29
    • Kabushiki Kaisha Toshiba
    • Ryuji Ohba
    • H01L45/00
    • H01L45/12H01L27/2418H01L45/085H01L45/1233H01L45/145H01L45/146H01L45/148
    • According to one embodiment, a memory device includes first and second conductive layers, a variable resistance portion, and a multiple tunnel junction portion. The variable resistance portion is provided between the first and second conductive layers. The multiple tunnel junction portion is provided between the first conductive layer and the variable resistance portion, and includes first, second, and third tunnel insulating films, and first and second nanocrystal layers. The first nanocrystal layer between the first and second tunnel insulating films includes first conductive minute particles. The second nanocrystal layer between the second and third tunnel insulating films includes second conductive minute particles.
    • 根据一个实施例,存储器件包括第一和第二导电层,可变电阻部分和多个隧道结部分。 可变电阻部分设置在第一和第二导电层之间。 多重隧道结部分设置在第一导电层和可变电阻部分之间,并且包括第一,第二和第三隧道绝缘膜以及第一和第二纳米晶体层。 第一和第二隧道绝缘膜之间的第一纳米晶层包括第一导电微小颗粒。 第二和第三隧道绝缘膜之间的第二纳米晶层包括第二导电微小颗粒。
    • 5. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20150263121A1
    • 2015-09-17
    • US14483601
    • 2014-09-11
    • KABUSHIKI KAISHA TOSHIBA
    • Kana HIRAYAMARyuji OhbaTakeshi Kamigaichi
    • H01L29/51H01L29/423H01L21/28H01L29/66H01L21/762H01L27/115H01L29/788H01L29/49
    • H01L27/11519H01L21/76224H01L27/11521H01L29/40114H01L29/42324H01L29/66825H01L29/7883
    • A semiconductor device including semiconductor substrate having an active region and an element isolation region, the active region isolated by the element isolation region, the element isolation region provided with an element isolation trench; a memory-cell transistor formed above the semiconductor substrate and having a gate electrode formed above the active region via a first insulating film, the gate electrode formed of a stack including a floating gate electrode, a first interelectrode insulating film, and a control gate electrode; an element isolation insulating film filled in the element isolation trench; and a second interelectrode insulating film disposed above the element isolation insulating film so as to form a stack of the second interelectrode insulating film and the control electrode above the element isolation insulating and a dielectric constant of the second interelectrode insulating film being higher than a dielectric constant of the first interelectrode insulating film.
    • 一种半导体器件,包括具有有源区和元件隔离区的半导体衬底,所述有源区由元件隔离区隔离,元件隔离区设置有元件隔离沟槽; 形成在所述半导体衬底上并且具有通过第一绝缘膜形成在所述有源区上方的栅电极的存储单元晶体管,所述栅电极由包括浮置栅电极,第一电极间绝缘膜和控制栅电极 ; 填充在元件隔离沟槽中的元件隔离绝缘膜; 以及第二电极间绝缘膜,其设置在所述元件隔离绝缘膜的上方,以在所述元件隔离绝缘件的上方形成所述第二电极间绝缘膜和所述控制电极的叠层,并且所述第二电极间绝缘膜的介电常数高于介电常数 的第一电极间绝缘膜。