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    • 4. 发明申请
    • Atomic Layer Deposition of Metal Oxides for Memory Applications
    • 用于存储器应用的金属氧化物的原子层沉积
    • US20150179935A1
    • 2015-06-25
    • US14624295
    • 2015-02-17
    • Intermolecular Inc.Kabushiki Kaisha ToshibaSanDisk 3D LLC
    • Zhendong HongVidyut GopalImran HashimRandall J. HiguchiTim MinvielleHieu PhamTakeshi Yamaguchi
    • H01L45/00
    • H01L45/146H01L27/2463H01L45/04H01L45/08H01L45/1233H01L45/1616
    • Embodiments of the invention generally relate to nonvolatile memory devices and methods for manufacturing such memory devices. The methods for forming improved memory devices, such as a ReRAM cells, provide optimized, atomic layer deposition (ALD) processes for forming a metal oxide film stack which contains at least one hard metal oxide film (e.g., metal is completely oxidized or substantially oxidized) and at least one soft metal oxide film (e.g., metal is less oxidized than hard metal oxide). The soft metal oxide film is less electrically resistive than the hard metal oxide film since the soft metal oxide film is less oxidized or more metallic than the hard metal oxide film. In one example, the hard metal oxide film is formed by an ALD process utilizing ozone as the oxidizing agent while the soft metal oxide film is formed by another ALD process utilizing water vapor as the oxidizing agent.
    • 本发明的实施例一般涉及用于制造这种存储器件的非易失性存储器件和方法。 用于形成改进的存储器件(例如ReRAM单元)的方法提供优化的原子层沉积(ALD)工艺,用于形成金属氧化物膜堆叠,其包含至少一个硬金属氧化物膜(例如,金属被完全氧化或基本上被氧化 )和至少一种软金属氧化物膜(例如,金属比硬金属氧化物氧化较少)。 由于软金属氧化物膜比硬金属氧化物膜氧化得更少或更金属,所以软金属氧化物膜的电阻小于硬金属氧化物膜。 在一个实例中,通过利用臭氧作为氧化剂的ALD工艺形成硬质金属氧化物膜,而通过利用水蒸汽作为氧化剂的另一ALD工艺形成软金属氧化物膜。