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1. 发明授权

US09852868B2 Chip fuse and manufacturing method therefor 有权
公开(公告)号：US09852868B2
公开(公告)日：2017-12-26
申请号：US14432128
申请日：2012-09-28
申请人： KAMAYA ELECTRIC CO., LTD.
发明人： Katsuya Yamagishi , Hideki Seino
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00 , H01H85/00 , H01H85/046 , H01H69/02 , H01H85/48 , H01H85/38 , H01H85/143
CPC分类号： H01H85/0013 , H01H69/02 , H01H69/022 , H01H85/046 , H01H85/143 , H01H85/38 , H01H85/48 , H01H2069/025 , H01H2085/383 , Y10T29/49107
摘要： In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.

2. 发明申请

US20150270085A1 CHIP FUSE AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：芯片保险丝及其制造方法
公开(公告)号：US20150270085A1
公开(公告)日：2015-09-24
申请号：US14432128
申请日：2012-09-28
申请人： KAMAYA ELECTRIC CO., LTD.
发明人： Katsuya Yamagishi , Hideki Seino
IPC分类号： H01H85/00 , H01H85/143 , H01H69/02 , H01H85/48
CPC分类号： H01H85/0013 , H01H69/02 , H01H69/022 , H01H85/046 , H01H85/143 , H01H85/38 , H01H85/48 , H01H2069/025 , H01H2085/383 , Y10T29/49107
摘要： In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.
摘要翻译：在芯片保险丝中，在绝缘基板上形成蓄热层，在保温层上形成保险膜，在熔丝元件部分形成保护膜。芯片保险丝包括在芯片保险丝的长度方向两端的表面电极部分和表面电极部分之间的熔丝元件部分。在该芯片保险丝中，在蓄热层和表面电极部分之上形成矩形堤部分，以围绕熔丝元件部分，并且在堤部分的内侧形成第一保护层。此外，在堤形成过程中，在熔丝元件部分，表面电极部分和储热层上层压含片状感光基团的材料，并且使片状感光基材料暴露对紫外线进行发光，形成矩形堤段。

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