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1. 发明公开

US20240237220A1 Electrically Functional Circuit Board Core Material 审中-公开
公开(公告)号：US20240237220A1
公开(公告)日：2024-07-11
申请号：US18615432
申请日：2024-03-25
申请人： KEMET Electronics Corporation
发明人： Brandon Summey , Peter Blais , Robert Ramsbottom , Jeffrey Poltorak , Courtney Elliott
IPC分类号： H05K1/18 , H05K1/02 , H05K1/03 , H05K1/11
CPC分类号： H05K1/183 , H05K1/028 , H05K1/0366 , H05K1/115 , H05K2201/10015
摘要： An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.

2. 发明申请

US20230065146A1 Device and Process for Forming Membrane Type Capacitor Devices 有权
公开(公告)号：US20230065146A1
公开(公告)日：2023-03-02
申请号：US17462459
申请日：2021-08-31
申请人： KEMET Electronics Corporation
发明人： Brandon Summey , Jeffrey Poltorak , Robert Andrew Ramsbottom , Kevin A. Agosto
IPC分类号： H01G9/08 , H01G9/26 , H01G9/042
摘要： An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with
a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.

3. 发明授权

US10079113B2 Capacitor and method of manufacture utilizing membrane for encapsulant thickness control 有权
公开(公告)号：US10079113B2
公开(公告)日：2018-09-18
申请号：US15381526
申请日：2016-12-16
申请人： KEMET Electronics Corporation
发明人： Brandon Summey , Jeffrey Poltorak , Robert Andrew Ramsbottom
IPC分类号： H01G9/012 , H01G9/15 , H01G9/00 , H01G9/042 , H01G9/048 , H01G9/07 , H01G9/08 , H01G9/045
CPC分类号： H01G9/012 , H01G9/0032 , H01G9/042 , H01G9/045 , H01G9/048 , H01G9/052 , H01G9/07 , H01G9/08 , H01G9/10 , H01G9/15
摘要： An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.

4. 发明授权

US09941056B2 Solid electrolytic capacitor and method 有权
公开(公告)号：US09941056B2
公开(公告)日：2018-04-10
申请号：US14162268
申请日：2014-01-23
申请人： Kemet Electronics Corporation
发明人： Brandon Summey , Jeffrey Poltorak
IPC分类号： H01G9/012 , H01G9/10 , H01G9/15
CPC分类号： H01G9/012 , H01G9/10 , H01G9/15 , Y10T29/435
摘要： An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.

5. 发明授权

US11361908B2 Capacitor with volumetrically efficient hermetic packaging 有权
公开(公告)号：US11361908B2
公开(公告)日：2022-06-14
申请号：US17089875
申请日：2020-11-05
申请人： KEMET Electronics Corporation
发明人： Antony Chacko , Randolph S. Hahn , David Jacobs , Brandon Summey
IPC分类号： H01G9/10 , H01G9/00 , H01G9/15 , H01G9/04 , H01G9/042
摘要： An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

6. 发明授权

US10319529B2 One-sided capacitor foils and methods of making one-sided capacitor foils 有权
公开(公告)号：US10319529B2
公开(公告)日：2019-06-11
申请号：US14180946
申请日：2014-02-14
申请人： Kemet Electronics Corporation
发明人： Yanming Liu , Jessica P. Love , Brandon Summey
IPC分类号： H01G4/38 , H01G4/005 , H01G9/00 , H01G9/055 , H01G4/008
摘要： A method of forming a capacitor is described as is an improved capacitor formed with a one-sided capacitor foil. The method includes: providing a foil comprising a conductive core and a high surface area on each side of a first side and a second side of the core; removing at least a portion of the high surface area on the first side of the core; and forming a conductive layer on the dielectric.

7. 发明申请

US20180211790A1 Low ESR Capacitor 审中-公开
公开(公告)号：US20180211790A1
公开(公告)日：2018-07-26
申请号：US15926391
申请日：2018-03-20
申请人： KEMET Electronics Corporation
发明人： Randolph S. Hahn , Jeffrey Poltorak , Brandon Summey , Antony P. Chacko , John T. Kinard , Philip M. Lessner
IPC分类号： H01G9/15 , H01G9/048
CPC分类号： H01G9/15 , H01G9/0036 , H01G9/0425 , H01G9/048
摘要： An improved capacitor is provided wherein the improved capacitor has improved ESR. The capacitor has a fluted anode and an anode wire extending from the fluted anode. A dielectric is on the fluted anode. A conformal cathode is on the dielectric and a plated metal layer is on the carbon layer.

8. 发明申请

US20140211371A1 Solid Electrolytic Capacitor and Method 有权
标题翻译：固体电解电容器及方法
公开(公告)号：US20140211371A1
公开(公告)日：2014-07-31
申请号：US14162268
申请日：2014-01-23
申请人： Kemet Electronics Corporation
发明人： Brandon Summey , Jeffrey Poltorak
IPC分类号： H01G9/048 , H01G9/00
CPC分类号： H01G9/012 , H01G9/10 , H01G9/15 , Y10T29/435
摘要： An improved capacitor is provided with at least one anode having a dielectric on the anode and an anode lead extending from the anode. A conductive cathode layer is on the dielectric. An anode leadframe is electrically connected to the anode and a cathode leadframe is electrically connected to the cathode. An encapsulant encases the anode, a portion of the anode leadframe and a portion of the cathode leadframe such that the anode leadframe extends from the encapsulant to form an external anode leadframe and the cathode leadframe extends from the encapsulant to form an external cathode leadframe. At least one secondary electrical connection is provided wherein the secondary electrical connection is in electrical contact with the cathode and extends through the encapsulant to the external cathode leadframe or the secondary electrical contact is in electrical contact with the anode and extends through the encapsulant to the external anode leadframe.
摘要翻译：提供了一种改进的电容器，其具有至少一个在阳极上具有电介质的阳极和从阳极延伸的阳极引线。导电阴极层位于电介质上。阳极引线框架电连接到阳极，阴极引线框架电连接到阴极。密封剂封装阳极，阳极引线框架的一部分和阴极引线框架的一部分，使得阳极引线框架从密封剂延伸以形成外部阳极引线框架，并且阴极引线框架从密封剂延伸以形成外部阴极引线框架。提供至少一个次级电连接，其中次级电连接与阴极电接触并且延伸通过密封剂到外部阴极引线框架，或者次级电触点与阳极电接触并延伸穿过密封剂到外部阳极引线框架

9. 发明授权

US09741494B2 Capacitor array and method of manufacture 有权
公开(公告)号：US09741494B2
公开(公告)日：2017-08-22
申请号：US14180842
申请日：2014-02-14
申请人： Kemet Electronics Corporation
发明人： Brandon Summey , Peter Blais , Yanming Liu
IPC分类号： H01G4/38 , H01G9/00 , H01G4/005 , H01G9/055
CPC分类号： H01G4/38 , H01G4/005 , H01G4/008 , H01G9/0029 , H01G9/055 , Y10T29/302 , Y10T29/43
摘要： An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.

10. 发明申请

US20170178821A1 Capacitor and Method of Manufacture Utilizing Membrane for Encapsulant Thickness Control 审中-公开
公开(公告)号：US20170178821A1
公开(公告)日：2017-06-22
申请号：US15381526
申请日：2016-12-16
申请人： KEMET Electronics Corporation
发明人： Brandon Summey , Jeffrey Poltorak , Robert Andrew Ramsbottom
IPC分类号： H01G9/012 , H01G9/048 , H01G9/00 , H01G9/08 , H01G9/15 , H01G9/042 , H01G9/07
CPC分类号： H01G9/012 , H01G9/0032 , H01G9/042 , H01G9/045 , H01G9/048 , H01G9/052 , H01G9/07 , H01G9/08 , H01G9/10 , H01G9/15
摘要： An improved capacitor is provided wherein the capacitor has improved volumetric efficiency. The capacitor comprises a capacitive element comprising an anode, a dielectric on the anode and a cathode on the dielectric. An encapsulant at least partially encases the capacitive element wherein the encapsulant comprises at least one membrane between the capacitive element and an external surface of the encapsulant.

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