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1. 发明申请

US20110233755A1 Semiconductor Housing Package, Semiconductor Package Structure Including The Semiconductor Housing Package, And Processor-Based System Including The Semiconductor Package Structure 有权
标题翻译：半导体封装封装，半导体封装结构包括半导体封装封装和基于处理器的系统，包括半导体封装结构
公开(公告)号：US20110233755A1
公开(公告)日：2011-09-29
申请号：US13072012
申请日：2011-03-25
申请人： Dong-Han Kim , Sung-Woo Park , Jin-Woo Park , So-Young Lim , Jung-Hwan Kim , Kwang-Jin Bae , Pa-Lan Lee
发明人： Dong-Han Kim , Sung-Woo Park , Jin-Woo Park , So-Young Lim , Jung-Hwan Kim , Kwang-Jin Bae , Pa-Lan Lee
IPC分类号： H01L23/48
CPC分类号： H01L25/105 , H01L21/6835 , H01L23/3128 , H01L23/49811 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L29/0657 , H01L2221/68359 , H01L2224/04105 , H01L2224/05171 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/12105 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/48235 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73259 , H01L2224/73265 , H01L2224/73277 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/10158 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system.
摘要翻译：可以提供半导体外壳封装。半导体外壳封装可以包括模具层，壳体芯片，再分布结构和壳体节点。模具层可围绕并部分地暴露外壳芯片。再分布结构可以电连接到壳体芯片并且可以设置在模具层上。壳体节点可以与再分布结构接触。半导体外壳封装可以设置在半导体基底封装上，并且可以与半导体基底封装构成半导体封装结构。半导体封装结构可以设置在基于处理器的系统上。

2. 发明授权

US08466554B2 Electronic device having interconnections, openings, and pads having greater width than the openings 有权
标题翻译：具有互连，开口和垫片的电子设备具有比开口宽的宽度
公开(公告)号：US08466554B2
公开(公告)日：2013-06-18
申请号：US13028836
申请日：2011-02-16
申请人： Ji-Yong Park , Hee-Seok Lee , Chul-Woo Kim , Sang-Gui Jo , Kwang-Jin Bae , Seung-Hwan Kim
发明人： Ji-Yong Park , Hee-Seok Lee , Chul-Woo Kim , Sang-Gui Jo , Kwang-Jin Bae , Seung-Hwan Kim
IPC分类号： H01L23/498 , H01L21/768 , H01L23/12 , H01L23/053
CPC分类号： H01L24/03 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/05 , H01L24/06 , H01L24/13 , H01L2224/02166 , H01L2224/0401 , H01L2224/05553 , H01L2224/05558 , H01L2224/05559 , H01L2224/0557 , H01L2224/0603 , H01L2224/13006 , H01L2224/13007 , H01L2224/1403 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2224/05552 , H01L2924/00
摘要： An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.
摘要翻译：电子设备包括形成在基板的第一表面上并彼此间隔开的第一和第二互连。电子设备包括设置在基板上的第一绝缘材料层，包括第一和第二互连，并且包括暴露第一互连的预定区域的第一开口。电子设备还包括填充第一开口并且具有比第一开口更大的宽度的第一垫。第一焊盘覆盖与第一互连的一端相邻的第二互连的至少一部分，并且第一焊盘通过第一绝缘材料层与第二互连电绝缘。

3. 发明授权

US06470175B1 Flip-up type portable phone and hinge mechanism thereof 有权
标题翻译：翻盖式便携式电话及其铰链机构
公开(公告)号：US06470175B1
公开(公告)日：2002-10-22
申请号：US09222392
申请日：1998-12-29
申请人： Sung-Sun Park , Kwang-Jin Bae
发明人： Sung-Sun Park , Kwang-Jin Bae
IPC分类号： H04B138
CPC分类号： H04M1/0216
摘要： A flip-up type portable phone and a hinge mechanism for opening and closing a flip cover of such a flip-up type portable phone. A speaker is mounted in the interior of the flip cover, so that the space for occupying the speaker is eliminated from a phone body, thereby enabling the phone body to be compact. The hinge mechanism includes a pair of hinge assemblies adapted to open and close a flip cover and arranged at opposite sides of a liquid crystal display module disposed at the upper portion of the phone body, so that the flip cover can be opened by an upward pivotal movement thereof carried out about hinge shafts arranged at opposite sides of the LCD module. Accordingly, a microphone unit can be arranged at the lower end of the phone body. Moreover, the microphone unit can be arranged at an optional position on the lower end of the phone body. In accordance with the above arrangement, the LCD unit is always exposed.
摘要翻译：用于打开和关闭这种翻盖式便携式电话的翻盖的翻盖型便携式电话和铰链机构。扬声器安装在翻盖的内部，使得用于占据扬声器的空间从电话机体中消除，从而使得电话机体能够紧凑。铰链机构包括一对铰链组件，其适于打开和关闭翻盖并且布置在设置在电话主体上部的液晶显示模块的相对侧，使得翻盖可以通过向上的枢转关于布置在LCD模块的相对侧的铰链轴的运动。因此，麦克风单元可以布置在电话机体的下端。此外，麦克风单元可以布置在电话机体的下端的可选位置。根据上述布置，LCD单元总是被曝光。

4. 发明授权

US08339561B2 Wiring substrate, tape package having the same, and display device having the same 有权
标题翻译：配线基板，具有该布线基板的带包装及其显示装置
公开(公告)号：US08339561B2
公开(公告)日：2012-12-25
申请号：US12353317
申请日：2009-01-14
申请人： Ji-Hwan Hwang , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
发明人： Ji-Hwan Hwang , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
IPC分类号： G02F1/1345
CPC分类号： H05K1/0277 , H01L23/49838 , H01L23/4985 , H01L24/50 , H01L2924/14 , H01L2924/181 , H05K1/111 , H05K1/189 , H05K2201/097 , H05K2201/09709 , H05K2201/10128 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.
摘要翻译：布线基板包括基膜，多个第一布线和多个第二布线。基膜具有芯片安装区域，用于在其上安装半导体芯片。第一布线沿芯片安装区域内的第一方向延伸到芯片安装区域的外部，并且包括沿与第一方向不同的第二方向延伸的第一连接端部。第一连接端部可以形成在芯片安装区域的内部并且被配置为电连接到半导体芯片。所述第二配线从所述芯片安装区域的内部朝向所述芯片安装区域的外侧沿所述第一方向延伸，并且包括沿与所述第一连接端部延伸的所述第二方向相反的方向延伸的第二连接端部，连接端部可以形成在芯片安装区域内部，并且被配置为电连接到半导体芯片。

5. 发明申请

US20110247871A1 MULTI-LAYER PRINTED CIRCUIT BOARD COMPRISING FILM AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：包含薄膜的多层印刷电路板及其制造方法
公开(公告)号：US20110247871A1
公开(公告)日：2011-10-13
申请号：US13032100
申请日：2011-02-22
申请人： Soo-Jeoung Park , Chul-Woo Kim , Kyoung-Sei Choi , Kwang-Jin Bae
发明人： Soo-Jeoung Park , Chul-Woo Kim , Kyoung-Sei Choi , Kwang-Jin Bae
IPC分类号： H05K1/11
CPC分类号： H05K3/46 , H05K3/4602 , H05K3/462 , H05K2201/096 , Y10T29/49155
摘要： A multi-layer printed circuit board (PCB) and a method for fabricating the same are provided. The multi-layer printed circuit board may include a first film and a first insulation layer. The first film may include a first via therein and the first film may further include a first conductive pattern on an upper surface thereof and the first conductive layer may be electrically connected to the first via. The first insulation layer may be on the upper surface of the first film and the first insulation layer may include a second via therein and a second conductive pattern on an upper surface thereof and the second conductive pattern may be electrically connected to the second via. The second via may be electrically connected to the first conductive pattern.
摘要翻译：提供了一种多层印刷电路板（PCB）及其制造方法。多层印刷电路板可以包括第一膜和第一绝缘层。第一膜可以包括其中的第一通孔，并且第一膜还可以包括在其上表面上的第一导电图案，并且第一导电层可以电连接到第一通孔。第一绝缘层可以在第一膜的上表面上，并且第一绝缘层可以包括其中的第二通孔和在其上表面上的第二导电图案，并且第二导电图案可以电连接到第二通孔。第二通孔可以电连接到第一导电图案。

6. 发明授权

US07933116B2 Portable terminal having hard disk 失效
标题翻译：带硬盘的便携式终端
公开(公告)号：US07933116B2
公开(公告)日：2011-04-26
申请号：US11875114
申请日：2007-10-19
申请人： Hong-Joon Park , Kwang-Jin Bae
发明人： Hong-Joon Park , Kwang-Jin Bae
IPC分类号： G06F1/16
CPC分类号： G06F1/187 , G06F1/1615 , G06F1/1656
摘要： A portable terminal is provided. The terminal includes a hard disk, a housing having an opening formed thereon, and a motor protruding out of the hard disk while being received in the opening. Even when the space for receiving the hard disk is the same, the distance between the body of the hard disk and the inner peripheral surface of the housing of the terminal is sufficient to prevent external impact from directly acting on the hard disk. In addition, even if the distance between the body of the hard disk and the inner peripheral surface of the housing of the terminal remains the same, no extra space is unnecessarily occupied inside the housing because the motor of the hard disk is received in the opening. This has the merit of achieving compactness of the terminal.
摘要翻译：提供便携式终端。端子包括硬盘，具有形成在其上的开口的壳体，以及从容纳在开口中的硬盘突出的电动机。即使当接收硬盘的空间相同时，硬盘的主体与终端的壳体的内周表面之间的距离足以防止外部冲击直接作用在硬盘上。此外，即使硬盘的主体与终端的壳体的内周面之间的距离保持相同，由于硬盘的电动机被接收在开口部中，所以不会在壳体内不必要地占用额外的空间。这具有实现终端紧凑性的优点。

7. 发明授权

US07759587B2 Two-way key of portable terminal 有权
标题翻译：便携式终端双向钥匙
公开(公告)号：US07759587B2
公开(公告)日：2010-07-20
申请号：US11846268
申请日：2007-08-28
申请人： Ki-Bum Kim , Kwang-Jin Bae
发明人： Ki-Bum Kim , Kwang-Jin Bae
IPC分类号： H01H9/00
CPC分类号： H01H19/6355 , G04C3/001 , G04G21/00 , H01H19/001 , H01H19/48 , H01H19/63 , H01H2300/016
摘要： A two-way key of a portable terminal is provided. The two-way terminal includes a fixed member mounted on the portable terminal, a driving member rotatably assembled with the fixed member, and an operating member pivotably assembled with the fixed member, wherein, as the driving member rotates, the driving member comes into contact with the operating member and causes the operating member to pivot. The two-way key as configured above can construct a key capable of operating in two ways while taking a small space so that it contributes to the compact size of the terminal. Further, if the two-way key is employed in the watch-type portable terminal, the operating scheme is identical to that of a spring of a common analog wrist watch or a time control lever, so that it is familiar to a user and thus it is convenient for a user to use.
摘要翻译：提供便携式终端的双向密钥。双向终端包括安装在便携式终端上的固定构件，可旋转地组装有固定构件的驱动构件和与该固定构件可转动地组装的操作构件，其中，随着驱动构件旋转，驱动构件接触与操作构件一起使操作构件枢转。如上构造的双向键可以构造一个能够以两种方式操作的键，同时占用小空间，从而有助于终端的紧凑尺寸。此外，如果在手表式便携式终端中采用双向键，则操作方案与普通模拟手表或时间控制杆的弹簧的操作方案相同，使得用户熟悉，因此方便用户使用。

8. 发明授权

US08082632B2 Hinge device for portable terminal having sub-housing stopper 有权
标题翻译：便携式终端的铰链装置具有副壳体止动器
公开(公告)号：US08082632B2
公开(公告)日：2011-12-27
申请号：US10795424
申请日：2004-03-09
申请人： Kwang-Jin Bae
发明人： Kwang-Jin Bae
IPC分类号： E05D11/06
CPC分类号： H04M1/0212 , E05D3/10 , E05D11/06 , E05Y2900/208 , E05Y2900/606 , G06F1/162 , G06F1/1679 , G06F1/1681 , H05K5/0226 , Y10T16/551 , Y10T16/5515
摘要： A hinge device in a portable terminal is provided. In the hinge device, a first hinge base has a stopper protrusion at a predetermined position on an outer circumferential surface thereof. A second hinge base is rotatably engaged with an end of the first hinge base, facing the first hinge base, and fixed within a cylindrical hinge housing. The hinge housing has a stopper which pops out therefrom when the stopper contacts the stopper protrusion. The stopper restricts an angle at which a sub-housing is opened from a main housing in the portable terminal. Thus, a voice call can be conducted conveniently.
摘要翻译：提供便携式终端中的铰链装置。在铰链装置中，第一铰链座在其外圆周表面上的预定位置处具有止动器突起。第二铰链座与第一铰链座的端部可旋转地接合，面向第一铰链座，并固定在圆柱形铰链外壳内。当止动器接触止动突起时，铰链壳体具有从其中弹出的止动件。止动器限制从便携式终端中的主壳体开启副壳体的角度。因此，可以方便地进行语音呼叫。

9. 发明申请

US20090184418A1 WIRING SUBSTRATE, TAPE PACKAGE HAVING THE SAME, AND DISPLAY DEVICE HAVING THE SAME 有权
标题翻译：接线基板，具有该基板的带包装及其相关的显示装置
公开(公告)号：US20090184418A1
公开(公告)日：2009-07-23
申请号：US12353317
申请日：2009-01-14
申请人： Ji-Hwan HWANG , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
发明人： Ji-Hwan HWANG , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
IPC分类号： H01L23/498 , H05K1/18
CPC分类号： H05K1/0277 , H01L23/49838 , H01L23/4985 , H01L24/50 , H01L2924/14 , H01L2924/181 , H05K1/111 , H05K1/189 , H05K2201/097 , H05K2201/09709 , H05K2201/10128 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.
摘要翻译：布线基板包括基膜，多个第一布线和多个第二布线。基膜具有芯片安装区域，用于在其上安装半导体芯片。第一布线沿芯片安装区域内的第一方向延伸到芯片安装区域的外部，并且包括沿与第一方向不同的第二方向延伸的第一连接端部。第一连接端部可以形成在芯片安装区域的内部并且被配置为电连接到半导体芯片。所述第二配线从所述芯片安装区域的内部朝向所述芯片安装区域的外侧沿所述第一方向延伸，并且包括沿与所述第一连接端部延伸的所述第二方向相反的方向延伸的第二连接端部，连接端部可以形成在芯片安装区域内部，并且被配置为电连接到半导体芯片。

10. 发明申请

US20050005401A1 Hinge device for portable terminal having sub-housing stopper 有权
标题翻译：便携式终端的铰链装置具有副壳体止动器
公开(公告)号：US20050005401A1
公开(公告)日：2005-01-13
申请号：US10795424
申请日：2004-03-09
申请人： Kwang-Jin Bae
发明人： Kwang-Jin Bae
IPC分类号： H04B1/38 , E05D3/10 , E05D11/06 , G06F1/16 , H04M1/02 , H05K5/00 , H05K5/02 , H05K7/16
CPC分类号： H04M1/0212 , E05D3/10 , E05D11/06 , E05Y2900/208 , E05Y2900/606 , G06F1/162 , G06F1/1679 , G06F1/1681 , H05K5/0226 , Y10T16/551 , Y10T16/5515
摘要： A hinge device in a portable terminal is provided. In the hinge device, a first hinge base has a stopper protrusion at a predetermined position on an outer circumferential surface thereof A second hinge base is rotatably engaged with an end of the first hinge base, facing the first hinge base, and fixed within a cylindrical hinge housing. The hinge housing has a stopper which pops out therefrom when the stopper contacts the stopper protrusion. The stopper restricts an angle at which a sub-housing is opened from a main housing in the portable terminal. Thus, a voice call can be conducted conveniently.
摘要翻译：提供便携式终端中的铰链装置。在铰链装置中，第一铰链座在其外周面上的预定位置处具有止动器突起。第二铰链座与第一铰链座的端部可旋转地接合，面向第一铰链座，并且固定在圆柱形铰链外壳。当止动器接触止动突起时，铰链壳体具有从其中弹出的止动件。止动器限制从便携式终端中的主壳体开启副壳体的角度。因此，可以方便地进行语音呼叫。

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