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    • 3. 发明授权
    • Devices and methods for connecting device cover components
    • 用于连接设备盖组件的设备和方法
    • US09095046B2
    • 2015-07-28
    • US13786679
    • 2013-03-06
    • LENOVO (SINGAPORE) PTE. LTD.
    • Akinori UchinoTetsuya OhtaniMasahiro KitamuraTatsuya Ushioda
    • H05K5/00G06F1/16H05K7/00G06F1/18
    • H05K5/0008G06F1/181Y10T29/49826
    • Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.
    • 提供了用于连接设备盖组件的设备和方法。 通常,装置和方法可允许电子装置的第一和第二盖在多个连接点处连接在一起,而在连接点处第一和第二盖之间没有间隙。 在示例性实施例中,电子设备可以包括具有在多个附接点处彼此附接的第一和第二盖的壳体。 第一盖可以由第一材料形成,并且第二盖可以由第二不同的材料形成。 第一材料可以是比第二材料更软的材料,这可以允许第二盖在制造壳体期间穿透第一盖并使其变形,使得在每个附件处的第一和第二盖之间不存在间隙空间 积分