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1. 外观设计

USD865687S1 LED package 有权
公开(公告)号：USD865687S1
公开(公告)日：2019-11-05
申请号：US29653758
申请日：2018-06-18
申请人： LUMENS CO., LTD.
设计人： Seung Hyun Oh , Hyo Gu Jeon , Chi Gyun Song

2. 发明授权

US09853017B2 Light emitting device package and light emitting device package module 有权
公开(公告)号：US09853017B2
公开(公告)日：2017-12-26
申请号：US15169217
申请日：2016-05-31
申请人： LUMENS CO., LTD.
发明人： Hyo Gu Jeon , Jung Hyun Park , Dae Gil Jung , Seung Hyun Oh , Yun Geon Cho , Bo Gyun Kim , Suk Min Han , Jun Hyeok Han
IPC分类号： H01L33/62 , H01L33/54 , H01L25/075 , H01L33/50 , H01L33/48
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/62 , H01L2224/16245
摘要： Disclosed herein is a light emitting device package and a light emitting device package module. The light emitting device package includes: a base including a cavity; a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element configured to produce light having a first peak wavelength and a first fluorescent layer covering a top and side surfaces of the first light emitting element; and a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side surfaces of the second light emitting element, wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength.

3. 发明授权

US10784429B2 Light emitting element package with thin film pad and manufacturing method thereof 有权
公开(公告)号：US10784429B2
公开(公告)日：2020-09-22
申请号：US16371756
申请日：2019-04-01
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Hyo Gu Jeon , Chi Gyun Song , Jung Hye Park
IPC分类号： H01L33/64 , H01L25/075 , H01L33/54 , H01L33/60 , H01L33/62
摘要： The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof.Disclosed is a light emitting element package including: a plurality of light emitting diodes having a first electrode pad and a second electrode pad at a lower portion thereof; a thin film pad having the plurality of light emitting diodes mounted thereon and constituted by one common thin film pad and a plurality of individual thin film pads; and a molding layer molding the plurality of light emitting diodes and the thin film pad, in which a lower surface of the thin film pad has a light emitting element package soldering region for soldering the light emitting element package, and an area of the light emitting element package soldering region is larger than that of each of the first electrode pad and the second electrode pad of the light emitting diode.

4. 发明授权

US10163870B2 Light emitting device package and light emitting device package module 有权
公开(公告)号：US10163870B2
公开(公告)日：2018-12-25
申请号：US15815667
申请日：2017-11-16
申请人： LUMENS CO., LTD.
发明人： Hyo Gu Jeon , Jung Hyun Park , Dae Gil Jung , Seung Hyun Oh , Yun Geon Cho , Bo Gyun Kim , Suk Min Han , Jun Hyeok Han
IPC分类号： H01L33/62 , H01L25/075 , H01L33/50 , H01L33/48
摘要： Disclosed herein is a light emitting device package and a light emitting device package module. The light emitting device package includes: a base including a cavity; a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element configured to produce light having a first peak wavelength and a first fluorescent layer covering a top and side surfaces of the first light emitting element; and a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side surfaces of the second light emitting element, wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength.

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