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1. 发明授权

US10553757B2 UV LED package 有权
公开(公告)号：US10553757B2
公开(公告)日：2020-02-04
申请号：US16034341
申请日：2018-07-12
申请人： LUMENS CO., LTD.
发明人： MinPyo Kim , DaeWon Kim
IPC分类号： H01L33/38 , H01L33/62 , H01L33/64 , F21K9/237 , G02B6/10 , H01L23/12 , H01L23/13 , H01L23/482 , H01L23/485 , H01L25/075 , H01L33/34 , H01L33/36 , H01L33/48 , H05B33/08 , H01L25/16 , H01L33/32 , H01L33/60
摘要： A UV LED package disclosed herein includes a submount, a UV LED chip adapted to emit UV light at 200 nm to 400 nm, and a package body mounted with the submount. The submount includes a heat dissipating substrate, a first reflective electrode film and a second reflective electrode film separated from each other by an electrode separation gap on the heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film. The UV LED chip includes a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad. The UV LED chip is flip-chip bonded to the submount through a first bonding bump interposed between the first flip-chip bonding pad and the first conductive electrode pad and a second bonding bump interposed between the second flip-chip bonding pad and the second conductive electrode pad. The package body includes a first metal body electrically connected to the first wire bonding pad through a first bonding wire and a second metal body separated from the first metal body by an insulating material and electrically connected to the second wire bonding pad through a second bonding wire.

2. 发明授权

US10056527B2 UV LED package 有权
公开(公告)号：US10056527B2
公开(公告)日：2018-08-21
申请号：US15654478
申请日：2017-07-19
申请人： LUMENS CO., LTD.
发明人： MinPyo Kim , DaeWon Kim
IPC分类号： H01L33/38 , H05B33/08 , H01L25/075 , H01L33/34 , H01L33/48 , F21K9/237 , G02B6/10 , H01L23/485 , H01L23/12 , H01L23/13 , H01L33/36 , H01L23/482
CPC分类号： H01L33/38 , F21K9/237 , G02B6/102 , H01L23/12 , H01L23/13 , H01L23/4824 , H01L23/485 , H01L25/0753 , H01L25/167 , H01L33/32 , H01L33/34 , H01L33/36 , H01L33/387 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H05B33/08 , H01L2924/00014
摘要： A UV LED package disclosed herein includes a submount, a UV LED chip adapted to emit UV light at 200 nm to 400 nm, and a package body mounted with the submount. The submount includes a heat dissipating substrate, a first reflective electrode film and a second reflective electrode film separated from each other by an electrode separation gap on the heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film. The UV LED chip includes a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad. The UV LED chip is flip-chip bonded to the submount through a first bonding bump interposed between the first flip-chip bonding pad and the first conductive electrode pad and a second bonding bump interposed between the second flip-chip bonding pad and the second conductive electrode pad. The package body includes a first metal body electrically connected to the first wire bonding pad through a first bonding wire and a second metal body separated from the first metal body by an insulating material and electrically connected to the second wire bonding pad through a second bonding wire.

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