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1. 发明授权

US10600714B2 Methods for establishing thermal joints between heat spreaders or lids and heat sources 有权
公开(公告)号：US10600714B2
公开(公告)日：2020-03-24
申请号：US16529063
申请日：2019-08-01
申请人： Laird Technologies, Inc.
发明人： Jason L. Strader , Richard F. Hill
IPC分类号： H01L23/42 , H01L23/367 , H01L23/427 , B23P15/26
摘要： According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

2. 发明授权

US10334716B2 Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding 有权
公开(公告)号：US10334716B2
公开(公告)日：2019-06-25
申请号：US15884584
申请日：2018-01-31
申请人： Laird Technologies, Inc.
发明人： Jason L. Strader , Eugene Anthony Pruss
IPC分类号： H05K1/02 , H05K3/10 , H05K3/30 , H05K7/20 , H05K9/00 , H01L21/50 , H01L21/77 , H01L23/34 , H01L23/367 , H01L23/427 , H01L23/40 , H01L23/36 , H01L23/373 , H01L23/552
摘要： Exemplary embodiments are disclosed of multifunctional components for electronic devices. In an exemplary embodiment, a multifunctional component generally includes a base component, such as a smart phone case (e.g., a back cover, etc.), an inner plate (e.g., a screenplate, a mid-plate, etc.). A heat spreader may be disposed on the base component. Thermal interface material and electromagnetic interference shielding may be disposed on area(s) of the heat spreader. The area(s) may correspond in mirror image relation to component(s) of a circuit board with which the multifunctional component is configured to be joined. During operation of the electronic device, the multifunctional component may draw waste heat from one area and transfer/spread the waste heat to one or more other areas of the electronic device, which may increase a temperature of these one or more other areas. This, in turn, may make device temperature more uniform.

3. 发明申请

US20180009072A1 SYSTEMS AND METHODS OF APPLYING THERMAL INTERFACE MATERIALS 审中-公开
公开(公告)号：US20180009072A1
公开(公告)日：2018-01-11
申请号：US15207444
申请日：2016-07-11
申请人： Laird Technologies, Inc.
发明人： Mark D. Kittel , Jason L. Strader
IPC分类号： B23P15/26 , H05K7/20
CPC分类号： B23P15/26 , B29C63/0013 , B29C63/02 , H01L21/4803 , H01L21/4882 , H01L23/42 , H01L24/743 , H01L2224/27436 , H01L2224/32245 , H01L2224/83192 , H05K7/2039
摘要： Disclosed are exemplary embodiments of systems and methods of applying thermal interface materials (TIMs). The thermal interface materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.

4. 发明授权

US09515004B2 Thermal interface materials 有权
标题翻译：热界面材料
公开(公告)号：US09515004B2
公开(公告)日：2016-12-06
申请号：US13840119
申请日：2013-03-15
申请人： Laird Technologies, Inc.
发明人： Jason L. Strader , Karen J. Bruzda , Richard F. Hill
IPC分类号： H01L23/427 , H01L23/42 , F28F13/00
CPC分类号： H01L23/4275 , F28F2013/006 , H01L23/42 , H01L2924/0002 , Y10T156/10 , H01L2924/00
摘要： A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.
摘要翻译：热界面材料被配置为与电子设备一起使用，用于在发热部件和电子设备的除热部件之间传递热量。热界面材料通常包括结合有接触电阻降低材料的第一材料（例如间隙填料等）。接触电阻降低材料操作以填充其中安装第一材料的部件表面的间隙，从而减少第一材料和部件表面之间的表面接触电阻。接触电阻降低材料可以施加到第一材料的一个或多个侧表面。或者，可以将接触电阻降低材料混合在第一材料中。

5. 发明申请

US20150305189A1 THERMAL INTERFACE MATERIAL ASSEMBLIES AND RELATED METHODS 有权
标题翻译：热接口材料组件及相关方法
公开(公告)号：US20150305189A1
公开(公告)日：2015-10-22
申请号：US14463196
申请日：2014-08-19
申请人： Laird Technologies, Inc.
发明人： Jason L. Strader , Richard F. Hill
IPC分类号： H05K7/20 , H01L23/373 , H01L23/367
CPC分类号： H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L23/3737 , H01L23/42
摘要： Example embodiments of the present disclosure generally relate to thermal interface material assemblies. In an example embodiment, a thermal interface material assembly generally includes a substrate and one or more pillars along a first and/or second side portion of the substrate.
摘要翻译：本公开的示例性实施例一般涉及热界面材料组件。在示例性实施例中，热界面材料组件通常包括基底和沿着基底的第一和/或第二侧部的一个或多个柱。

6. 发明申请

US20150301568A1 Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader 审中-公开
标题翻译：使用各向异性散热器同一侧从电子设备散热的热解决方案和方法
公开(公告)号：US20150301568A1
公开(公告)日：2015-10-22
申请号：US14687940
申请日：2015-04-16
申请人： Laird Technologies, Inc.
发明人： Richard F. Hill , Jason L. Strader
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/20445 , G06F1/20 , H05K7/20481
摘要： Example embodiments of the present disclosure generally relate to thermal solutions and methods for dissipating or removing heat from electronic devices using the same side of an anisotropic heat spreader. In an example embodiment, a thermal solution generally includes a heat removal structure and an anisotropic heat spreader. The anisotropic heat spreader is configured such that the heat removal structure and the heat source are in thermal contact with a same side of the anisotropic heat spreader and such that a thermally-conductive heat path is provided along that same side of the anisotropic heat spreader from the heat source to the heat removal structure. Heat from the heat source may be transferrable to the same side of the anisotropic heat spreader from which heat is also transferrable to the heat removal structure.
摘要翻译：本公开的示例性实施例一般涉及使用各向异性散热器的相同侧从电子设备散热或去除热量的热解决方案和方法。在一个示例性实施例中，热解通常包括散热结构和各向异性散热器。各向异性散热器被构造成使得除热结构和热源与各向异性散热器的同一侧热接触，并且沿着各向异性散热器的同一侧设置导热热路径，热源到散热结构。来自热源的热量可以转移到各向异性散热器的同一侧，热量也可从该散热器传热到除热结构。

7. 发明授权

US11610831B2 Methods for establishing thermal joints between heat spreaders or lids and heat sources 有权
公开(公告)号：US11610831B2
公开(公告)日：2023-03-21
申请号：US17197611
申请日：2021-03-10
申请人： Laird Technologies, Inc.
发明人： Jason L. Strader , Richard F. Hill
IPC分类号： H01L23/42 , H01L23/367 , H01L23/427 , B23P15/26
摘要： According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

8. 发明授权

US10477738B2 Board level shields and systems and methods of applying board level shielding 有权
公开(公告)号：US10477738B2
公开(公告)日：2019-11-12
申请号：US15912067
申请日：2018-03-05
申请人： Laird Technologies, Inc.
发明人： Jason L. Strader , Eugene Anthony Pruss , Gerald R. English
IPC分类号： H05K9/00 , H05K1/03 , H05K3/32 , H05K3/46 , B32B37/20
摘要： A multilayer board level shield includes an electrically-conductive shielding layer disposed between inner and outer dielectric layers. The multilayer board level shield may have an overall thickness of about 25 microns or less. The multilayer board level shield may have sufficient flexibility to be reconfigurable generally over one or more components on a substrate to thereby provide board level shielding for the one or more components. One or more dielectric joints may be defined between the printed circuit board and the outer dielectric layer that attach the multilayer board level shield to the printed circuit board.

9. 发明授权

US10373891B2 Methods for establishing thermal joints between heat spreaders or lids and heat sources 有权
公开(公告)号：US10373891B2
公开(公告)日：2019-08-06
申请号：US14294973
申请日：2014-06-03
申请人： Laird Technologies, Inc.
发明人： Jason L. Strader , Richard F. Hill
IPC分类号： H01L23/367 , H01L23/42 , H01L23/427 , B23P15/26
摘要： According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

10. 发明申请

US20180153031A1 MULTIFUNCTIONAL COMPONENTS FOR ELECTRONIC DEVICES AND RELATED METHODS OF PROVIDING THERMAL MANAGEMENT AND BOARD LEVEL SHIELDING 审中-公开
公开(公告)号：US20180153031A1
公开(公告)日：2018-05-31
申请号：US15884584
申请日：2018-01-31
申请人： Laird Technologies, Inc.
发明人： Jason L. Strader , Eugene Anthony Pruss
IPC分类号： H05K1/02 , H05K9/00 , H01L23/40 , H05K7/20
CPC分类号： H05K1/0203 , H01L23/36 , H01L23/373 , H01L23/40 , H01L23/552 , H05K7/20436 , H05K9/0032
摘要： Exemplary embodiments are disclosed of multifunctional components for electronic devices. In an exemplary embodiment, a multifunctional component generally includes a base component, such as a smart phone case (e.g., a back cover, etc.), an inner plate (e.g., a screenplate, a mid-plate, etc.). A heat spreader may be disposed on the base component. Thermal interface material and electromagnetic interference shielding may be disposed on area(s) of the heat spreader. The area(s) may correspond in mirror image relation to component(s) of a circuit board with which the multifunctional component is configured to be joined. During operation of the electronic device, the multifunctional component may draw waste heat from one area and transfer/spread the waste heat to one or more other areas of the electronic device, which may increase a temperature of these one or more other areas. This, in turn, may make device temperature more uniform.

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