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1. 发明授权

US08344734B2 Test module for radio frequency identification chips and method of the same 有权
标题翻译：射频识别芯片的测试模块及其方法
公开(公告)号：US08344734B2
公开(公告)日：2013-01-01
申请号：US12574372
申请日：2009-10-06
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： G01R31/02
CPC分类号： G01R31/2822
摘要： A test module and method for radio frequency identification (RFID) chips are provided. The test module includes a test head having a chip carrier for carrying a RFID chip to be tested, the chip carrier having a first antenna electronically connecting the RFID chip. The module further includes a second antenna for communicating with the first antenna; and a base supporting the chip carrier and the second antenna. The test module further includes a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna.
摘要翻译：提供了一种用于射频识别（RFID）芯片的测试模块和方法。测试模块包括具有用于承载要测试的RFID芯片的芯片载体的测试头，芯片载体具有电子连接RFID芯片的第一天线。该模块还包括用于与第一天线通信的第二天线; 以及支撑芯片载体和第二天线的基座。测试模块还包括电子连接第二天线的测试计算机，其中测试计算机通过第一天线和第二天线之间的通信来评估RFID芯片的功能。

2. 发明授权

US07943426B2 Package structure for integrated circuit device and method of the same 有权
标题翻译：集成电路器件的封装结构及其方法
公开(公告)号：US07943426B2
公开(公告)日：2011-05-17
申请号：US12421512
申请日：2009-04-09
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/97 , H01L21/561 , H01L21/6835 , H01L23/14 , H01L23/3114 , H01L23/481 , H01L24/24 , H01L24/82 , H01L2221/68336 , H01L2221/68377 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/16 , H01L2224/24226 , H01L2224/2518 , H01L2224/274 , H01L2224/82039 , H01L2224/82047 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/3511 , H01L2224/82 , H01L2924/00
摘要： The present invention discloses a package structure for an integrated circuit device and method for manufacturing the same. The method includes providing a wafer with multiple integrated circuit devices; providing an extendable substrate having a first surface supporting the wafer; forming multiple anti-elongation layers on a second surface of the extendable substrate, the second surface being opposite to the first surface; forming multiple recesses in the wafer for separating the integrated circuit devices from each other; elongating the extendable substrate to enlarge the multiple recesses; and forming an insulating layer to fill the recesses and cover multiple integrated circuit devices.
摘要翻译：本发明公开了一种用于集成电路器件的封装结构及其制造方法。该方法包括向晶片提供多个集成电路器件; 提供具有支撑所述晶片的第一表面的可延伸基板; 在所述可延伸基板的第二表面上形成多个抗延伸层，所述第二表面与所述第一表面相对; 在所述晶片中形成多个凹槽以将所述集成电路器件彼此分离; 伸长可伸缩基片以扩大多个凹槽; 以及形成绝缘层以填充凹部并覆盖多个集成电路器件。

3. 发明申请

US20060234460A1 Method for making cable with a conductive bump array, and method for connecting the cable to a task object 有权
标题翻译：用于制造具有导电凸块阵列的电缆的方法，以及用于将电缆连接到任务对象的方法
公开(公告)号：US20060234460A1
公开(公告)日：2006-10-19
申请号：US11106151
申请日：2005-04-13
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01L21/331 , H01L21/00
CPC分类号： H01L21/563 , G02F1/13452 , H01L2224/73203 , H01L2924/01079 , H05K1/118 , H05K3/244 , H05K3/305 , H05K3/325 , H05K3/361 , H05K2201/0367 , H05K2201/0373 , H05K2201/10977
摘要： A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.
摘要翻译：具有导电凸块的电缆通过在电缆基底上形成具有多个开口的光致抗蚀剂层来制造，在光致抗蚀剂层上涂覆导电层，由此开口中的导电层在电缆基底上的电路处形成凸块，然后除去光致抗蚀剂层。当将电缆连接到诸如LCD玻璃基板或PCB的任务对象时，仅使用通常的不导电浆料来连接电缆和任务对象，而不使用昂贵的各向异性导电膏或膜。

4. 发明申请

US20060084191A1 Packaging method for an electronic element 有权
标题翻译：电子元件的包装方法
公开(公告)号：US20060084191A1
公开(公告)日：2006-04-20
申请号：US10968006
申请日：2004-10-20
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01L21/58
CPC分类号： H01L23/49582 , H01L21/4832 , H01L21/563 , H01L23/3135 , H01L24/16 , H01L24/28 , H01L24/48 , H01L24/81 , H01L33/486 , H01L33/62 , H01L2221/68377 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/05611 , H01L2224/05639 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/81192 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2924/01028 , H01L2924/00015 , H01L2924/00 , H01L2224/05099 , H01L2924/00012
摘要： A packaging method for an electronic element has: etching portions of a top surface of a metal board to form recesses between raised unetched segments and filling the recesses with a dielectric material of high density polymer; forming multiple solder balls respectively on the raised unetched segments; coating the solder balls with a thin flux layer; bonding contacts on a die respectively to the solder balls with the thin flux layer; injecting an encapsulant between the die and the metal board; sealing the die with an outer encapsulant; etching a bottom surface of the metal board to form multiple metal leads; coating the bottom surface of the metal board other than the metal leads with a solder resist; and conducting a continuity test. The solder balls are not formed directly on the fragile die so the packaging method can be used with any types of dies and has a good applicability.
摘要翻译：电子元件的封装方法具有：金属板的上表面的蚀刻部分，以在凸起的未蚀刻段之间形成凹槽，并用高密度聚合物的介电材料填充凹部; 分别在凸起的未蚀刻段上形成多个焊球; 用薄的焊剂层涂覆焊球; 将模具上的触点分别与具有薄焊剂层的焊球接合; 在模具和金属板之间注入密封剂; 用外封装密封模具; 蚀刻金属板的底表面以形成多个金属引线; 用阻焊剂涂覆除金属引线之外的金属板的底面; 并进行连续性测试。焊球不直接形成在脆性模具上，所以包装方法可以与任何类型的模具一起使用并且具有良好的适用性。

5. 发明授权

US09136585B2 Radio frequency identification tag 有权
标题翻译：射频识别标签
公开(公告)号：US09136585B2
公开(公告)日：2015-09-15
申请号：US13401584
申请日：2012-02-21
申请人： Lu-Chen Hwan , Po Ching Chen
发明人： Lu-Chen Hwan , Po Ching Chen
IPC分类号： G08B13/14 , G06K19/077 , H01Q1/22 , H01Q9/24 , H01Q9/28
CPC分类号： H01Q1/2225 , G06K19/07754 , H01Q9/24 , H01Q9/285
摘要： A radio frequency identification tag includes a housing shaped as a stripe defining a longitudinal side and an inlay disposed within the housing. The inlay includes a carrier board supporting a packaged chip and a wiring antenna in connection with the packaged chip. The wiring antenna is formed with an electrical joint directly and electrically connecting the packaged chip and an extension portion directly extending out of the electrical joint. The extension direction of the extension portion is substantially perpendicular to the longitudinal side.
摘要翻译：射频识别标签包括形成为限定纵向侧的条带的壳体和设置在壳体内的嵌体。嵌体包括支撑封装芯片的载板和与封装芯片相连的布线天线。布线天线形成有直接电连接电连接的电接头和直接延伸出电接头的延伸部分。延伸部分的延伸方向基本上垂直于纵向侧。

6. 发明申请

US20130140368A1 RADIO FREQUENCY IDENTIFICATION TAG 有权
标题翻译：无线电频率识别标签
公开(公告)号：US20130140368A1
公开(公告)日：2013-06-06
申请号：US13401584
申请日：2012-02-21
申请人： Lu-Chen Hwan , Po Ching Chen
发明人： Lu-Chen Hwan , Po Ching Chen
IPC分类号： G06K19/077
CPC分类号： H01Q1/2225 , G06K19/07754 , H01Q9/24 , H01Q9/285
摘要： A radio frequency identification tag includes a housing shaped as a stripe defining a longitudinal side and an inlay disposed within the housing. The inlay includes a carrier board supporting a packaged chip and a wiring antenna in connection with the packaged chip. The wiring antenna is formed with an electrical joint directly and electrically connecting the packaged chip and an extension portion directly extending out of the electrical joint. The extension direction of the extension portion is substantially perpendicular to the longitudinal side.
摘要翻译：射频识别标签包括形成为限定纵向侧的条带的壳体和设置在壳体内的嵌体。嵌体包括支撑封装芯片的载板和与封装芯片相连的布线天线。布线天线形成有直接电连接电连接的电接头和直接延伸出电接头的延伸部分。延伸部分的延伸方向基本上垂直于纵向侧。

7. 发明授权

US07886421B2 Method for manufacturing integrated circuit device having antenna conductors 有权
标题翻译：具有天线导体的集成电路装置的制造方法
公开(公告)号：US07886421B2
公开(公告)日：2011-02-15
申请号：US12715551
申请日：2010-03-02
申请人： Lu-Chen Hwan , P. C. Chen , Yu-Lin Ma
发明人： Lu-Chen Hwan , P. C. Chen , Yu-Lin Ma
IPC分类号： H01Q17/00
CPC分类号： H01Q23/00 , H01L23/645 , H01L23/66 , H01L24/48 , H01L2223/6677 , H01L2224/48091 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/13091 , H01L2924/14 , H01L2924/19015 , Y10T29/49016 , Y10T29/49018 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/49169 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.
摘要翻译：提供一种具有天线导体的集成电路装置的制造方法。该方法包括以下步骤：为晶片提供多个集成电路部件; 在每个集成电路部件的表面上形成第一天线导体; 在所述第一天线导体上方形成多个金属凸块; 涂覆绝缘层以封装所述多个集成电路部件并覆盖所述多个金属凸块; 去除所述绝缘层的一部分以暴露每个金属凸块的顶部; 以及通过丝网印刷在所述绝缘层上形成第二天线导体。

8. 发明申请

US20050284841A1 Method for forming wiring on a substrate 有权
标题翻译：在基板上形成布线的方法
公开(公告)号：US20050284841A1
公开(公告)日：2005-12-29
申请号：US10875551
申请日：2004-06-25
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01B13/00 , H05K3/20 , H05K3/38
CPC分类号： H05K3/205 , H05K3/386 , H05K2201/0154 , H05K2203/0376
摘要： A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate with a soft polyamide substrate, and etching the copper substrate.
摘要翻译：在基板上形成布线的方法包括以下步骤：制备铜基板，在铜基板的一部分上镀铜镍层，将铜基板与软质聚酰胺基板结合，并蚀刻铜基板。

9. 发明申请

US20100090707A1 TEST MODULE FOR RADIO FREQUENCY IDENTIFICATION CHIPS AND METHOD OF THE SAME 有权
标题翻译：无线电频率识别卡的测试模块及其方法
公开(公告)号：US20100090707A1
公开(公告)日：2010-04-15
申请号：US12574372
申请日：2009-10-06
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： G01R31/02
CPC分类号： G01R31/2822
摘要： A test module and method for radio frequency identification (RFID) chips are provided. The test module includes a test head having a chip carrier for carrying a RFID chip to be tested, the chip carrier having a first antenna electronically connecting the RFID chip. The module further includes a second antenna for communicating with the first antenna; and a base supporting the chip carrier and the second antenna. The test module further includes a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna.
摘要翻译：提供了一种用于射频识别（RFID）芯片的测试模块和方法。测试模块包括具有用于承载要测试的RFID芯片的芯片载体的测试头，芯片载体具有电子连接RFID芯片的第一天线。该模块还包括用于与第一天线通信的第二天线; 以及支撑芯片载体和第二天线的基座。测试模块还包括电子连接第二天线的测试计算机，其中测试计算机通过第一天线和第二天线之间的通信来评估RFID芯片的功能。

10. 发明申请

US20080066945A1 METHOD FOR MAKING CABLE WITH A CONDUCTIVE BUMP ARRAY, AND METHOD FOR CONNECTING THE CABLE TO A TASK OBJECT 有权
标题翻译：用于制造具有导电BUMP阵列的电缆的方法，以及将电缆连接到任务对象的方法
公开(公告)号：US20080066945A1
公开(公告)日：2008-03-20
申请号：US11945511
申请日：2007-11-27
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01B7/18
CPC分类号： H01L21/563 , G02F1/13452 , H01L2224/73203 , H01L2924/01079 , H05K1/118 , H05K3/244 , H05K3/305 , H05K3/325 , H05K3/361 , H05K2201/0367 , H05K2201/0373 , H05K2201/10977
摘要： A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.
摘要翻译：具有导电凸块的电缆通过在电缆基底上形成具有多个开口的光致抗蚀剂层来制造，在光致抗蚀剂层上涂覆导电层，由此开口中的导电层在电缆基底上的电路处形成凸块，然后除去光致抗蚀剂层。当将电缆连接到诸如LCD玻璃基板或PCB的任务对象时，仅使用通常的不导电浆料来连接电缆和任务对象，而不使用昂贵的各向异性导电膏或膜。

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