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    • 6. 发明授权
    • Semiconductor structure and method for manufacturing the same
    • 半导体结构及其制造方法
    • US09455403B1
    • 2016-09-27
    • US14838500
    • 2015-08-28
    • MACRONIX INTERNATIONAL CO., LTD.
    • Erh-Kun LaiFeng-Min LeeYu-Yu LinDai-Ying Lee
    • H01L27/24H01L45/00
    • H01L45/1233H01L27/2436H01L27/2463H01L45/1253H01L45/146H01L45/1633
    • A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure comprises an access device, a dielectric layer, a barrier layer, a first interlayer conductor, a first barrier liner, a second interlayer conductor, a second barrier liner, a memory element and a top electrode layer. The access device has two terminals. The dielectric layer covers the access device. The barrier layer is disposed on the dielectric layer. The first and second interlayer conductors are connected to the two terminals, respectively. The first and second barrier liners are disposed on sidewalls of the first and second interlayer conductors, respectively. The memory element is disposed on the first interlayer conductor. The top electrode layer is disposed on the barrier layer and the memory element and covers the memory element.
    • 提供半导体结构及其制造方法。 半导体结构包括存取装置,电介质层,阻挡层,第一层间导体,第一阻挡衬垫,第二层间导体,第二阻挡衬垫,存储元件和顶电极层。 接入设备有两个终端。 电介质层覆盖接入装置。 阻挡层设置在电介质层上。 第一和第二层间导体分别连接到两个端子。 第一和第二阻挡衬垫分别设置在第一和第二层间导体的侧壁上。 存储元件设置在第一层间导体上。 顶部电极层设置在阻挡层和存储元件上并覆盖存储元件。
    • 8. 发明授权
    • RRAM process with metal protection layer
    • RRAM工艺与金属保护层
    • US09245925B1
    • 2016-01-26
    • US14598116
    • 2015-01-15
    • Macronix International Co., Ltd.
    • Feng-Min LeeErh-Kun LaiYu-Yu Lin
    • H01L45/00H01L27/24
    • H01L27/2436H01L45/08H01L45/1233H01L45/146H01L45/1633H01L45/1675
    • Metal oxide based memory devices and methods for manufacturing are described herein. A method for manufacturing a memory cell includes forming an insulation layer on an access device followed by forming vias through the insulation layer to expose the first and second access device terminals. First and second interlayer conductors extending through the vias are formed next. Top surfaces of the interlayer conductors are oxidized to form oxide layers. The oxide layer on the first interlayer conductor forms a memory layer. On top of the insulation layer a layer of protection metal is formed covering the oxide layers. The layer of protection metal is patterned and etched to form a top electrode layer covering the memory layer. The oxide layer on the second interlayer conductor is removed. Parallel first and second access lines are then formed on the top electrode layer and the second interlayer conductor, respectively.
    • 本文描述了基于金属氧化物的存储器件及其制造方法。 一种用于制造存储单元的方法包括在存取装置上形成绝缘层,随后通过绝缘层形成通孔以暴露第一和第二接入装置终端。 接下来形成穿过通孔延伸的第一和第二层间导体。 层间导体的顶表面被氧化形成氧化物层。 第一层间导体上的氧化物层形成存储层。 在绝缘层的顶部,形成覆盖氧化物层的保护金属层。 保护金属层被图案化和蚀刻以形成覆盖存储层的顶部电极层。 去除第二层间导体上的氧化物层。 然后分别在顶电极层和第二层间导体上形成平行的第一和第二存取线。