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1. 发明申请

US20160163571A1 APPARATUS FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER 有权
标题翻译：从地面半导体波形去除环形加固边缘的装置
公开(公告)号：US20160163571A1
公开(公告)日：2016-06-09
申请号：US14903741
申请日：2014-07-10
申请人： MECHATRONIC SYSTEMTECHNIK GMBH
发明人： Walter SCHOBER
IPC分类号： H01L21/67 , H01L21/683
CPC分类号： H01L21/67132 , B32B38/10 , B32B43/006 , H01L21/67092 , H01L21/67115 , H01L21/6836 , H01L2221/68381 , Y10T156/1132 , Y10T156/1158 , Y10T156/1184 , Y10T156/1917 , Y10T156/1944 , Y10T156/1967
摘要： An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film. In order to be able to detach the reinforcement edge from the carrier film without damage, the holder device has a clamping device encompassing the support and serving for clamping the wafer frame and/or the carrier film, wherein the clamping device interacts with the support to stretch the carrier film, and the separating device has a tool guide with a dividing tool for moving the dividing tool between carrier film and reinforcement edge in order to detach the reinforcement edge in one piece from the carrier film stretched by interaction of clamping device and support.
摘要翻译：一种从与地面半导体晶片相接合的环形加强件的边缘与粘合地连接到弹性载体膜并经由载体膜固定到圆周晶片框架的装置包括一个保持装置，用于将半导体晶片保持在支撑体的支撑表面上的开口，以及分离装置，其包括用于将加强边缘与载体膜一体地分离的装置。为了能够将加强边缘与载体膜分离而不损坏，保持器装置具有包围支撑件并用于夹紧晶片框架和/或载体膜的夹紧装置，其中夹紧装置与支撑件相互作用拉伸承载膜，并且分离装置具有工具引导件，该工具引导件具有用于在分隔工具在载体膜和加强件边缘之间移动的分割工具，以便将加强边缘与通过夹持装置和支撑件的相互作用拉伸的载体膜分离成一体。

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