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    • 2. 发明授权
    • Electronic component
    • 电子元器件
    • US09142344B2
    • 2015-09-22
    • US14151739
    • 2014-01-09
    • MURATA MANUFACTURING CO., LTD.
    • Kaoru TachibanaMitsuru Odahara
    • H01F5/00H01F27/24H01F27/28H01F17/00H01F27/29
    • H01F27/2804H01F17/0013H01F17/0033H01F27/292
    • An electronic component having a laminate having a plurality of insulator layers. A coil is provided consisting of a plurality of coil conductors that are connected by via-conductors piercing through the insulator layers, the coil winding helically about an axis along a direction of lamination. External electrodes are provided on surfaces of the laminate, in which at least some pairs of the coil conductors that neighbor each other with one of the insulator layers provided therebetween have parallel sections that overlap each other when viewed in the direction of lamination. The parallel sections are connected in parallel by the via-conductors or the external electrodes, and each pair of the coil conductors that neighbor each other with one of the insulator layers provided therebetween do not overlap each other when viewed in the direction of lamination, except for the parallel sections, and connections between the coil conductors and the via-conductors.
    • 一种电子部件,具有具有多个绝缘体层的层叠体。 线圈由多个线圈导体组成,线圈导体通过穿过绝缘体层的通孔导体连接,线圈沿着层叠方向围绕轴线螺旋形缠绕。 外部电极设置在层压体的表面上,其中至少一些彼此相邻的一对线圈导体,其中设置有绝缘体层之一之间具有在层叠方向上观察时彼此重叠的平行部分。 平行部分通过通孔导体或外部电极并联连接,并且彼此相邻的每对线圈导体之间设置的绝缘体层之间彼此不相互重叠,除了层叠方向外 用于并联部分,以及线圈导体和通路导体之间的连接。
    • 7. 发明授权
    • Electronic component and method for producing same
    • 电子元件及其制造方法
    • US09502170B2
    • 2016-11-22
    • US14087771
    • 2013-11-22
    • MURATA MANUFACTURING CO., LTD.
    • Mitsuru Odahara
    • H01G4/30H01G4/005H01G4/228H01F27/29H01F17/00
    • H01F27/29H01F17/0013H01F27/292
    • An electronic component comprises: a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers. A plurality of first lead-out conductors are exposed between the insulator layers at the mounting surface. A first external electrode covers the first lead-out conductors at the mounting surface. The first external electrode is located at a first formation area at the mounting surface. The first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, is curved so as to bulge at a center of the formation area relative to opposite ends thereof.
    • 电子部件包括:具有多个矩形绝缘体层和由绝缘体层的一系列侧面形成的安装表面的层压体。 多个第一引出导体在安装表面处在绝缘体层之间露出。 第一外部电极覆盖安装表面处的第一引出导体。 第一外部电极位于安装表面的第一形成区域。 当构成安装表面的绝缘体层的侧面延伸的延伸方向的平面图中,第一形成区域弯曲成在形成区域的相对端部的中心处膨胀。