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    • 10. 发明授权
    • Chip-shaped electronic part
    • 芯片形电子零件
    • US07772961B2
    • 2010-08-10
    • US11662200
    • 2005-09-09
    • Yasuharu KinoshitaToshiki MatsukawaNaoki ShibuyaShoji Hoshitoku
    • Yasuharu KinoshitaToshiki MatsukawaNaoki ShibuyaShoji Hoshitoku
    • H01C1/012
    • H01C1/142H01C1/06H01C7/003H01C17/006
    • A chip-shaped electronic part includes: a substrate; a pair of upper surface electrodes formed on an upper surface of the substrate; a functional element formed to be electrically connected to the upper surface electrode pair; a pair of lower surface electrodes formed on a lower surface of the substrate at positions opposing the upper surface electrode pair; a pair of end surface electrodes formed on end surfaces of the substrate so that each of the end surface electrode pair is electrically connected to one of the upper surface electrode pair, and to one of the lower surface electrode pair corresponding to the one upper surface electrode; a protective film formed in such a manner as to cover at least the functional element; and a plated layer formed in such a manner as to cover at least each of the upper surface electrode pair, wherein the protective film or the plated layer has at least two points of application at which a load from above the substrate is exerted.
    • 芯片形电子部件包括:基板; 形成在所述基板的上表面上的一对上表面电极; 形成为与上表面电极对电连接的功能元件; 一对下表面电极,形成在与上表面电极对相对的位置的基板的下表面上; 形成在所述基板的端面上的一对端面电极,使得所述端面电极对中的每一个电连接到所述上表面电极对中的一个,并且与所述一个上表面电极对应的一个下表面电极对 ; 形成为至少覆盖功能元件的保护膜; 以及形成为覆盖上表面电极对中的至少每一个的镀层,其中保护膜或镀层具有至少两个施加点,在该点处施加来自基板上方的负载。