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    • 5. 发明授权
    • Virtual multi-port RAM
    • 虚拟多端口RAM
    • US5204841A
    • 1993-04-20
    • US873672
    • 1992-04-23
    • Barbara A. ChappellTerry I. ChappellMahmut K. EbciogluStanley E. Schuster
    • Barbara A. ChappellTerry I. ChappellMahmut K. EbciogluStanley E. Schuster
    • G06F12/04G06F12/08G11C7/10G11C8/12G11C8/16
    • G11C8/16G06F12/04G11C7/103G11C8/12G06F12/0855
    • A virtual multi-port RAM (VMPRAM) structure has automatic port sequencing and single-port array density and speed. VMPRAM employs input-triggered, self-resetting macros in a pipelined architecture to provide multiple self-timed on-chip cycles during one machine cycle. The VMPRAM incorporates an SRAM segmented into many input triggered, self-resetting, fast cycling blocks. A timing signal is derived from a selected SRAM block for releasing the next select signals and data to the SRAM blocks. The SRAM block inputs are only the data input bus and the decoded signals needed to select a wordline and a bitline pair, and the SRAM block cycle is only the time needed to provide adequate pulse width for word lines and bitlines. Each SRAM block, and all the circuit blocks in the path to access the SRAM blocks, are input-triggered and self-resetting. The multiple address and data input latches are multiplexed at the driver to the true and complement buses to the SRAM segments, and those buses are self-resetting. Similarly, the selected SRAM block reads data out onto a self-resetting bus, and address and data inputs are latched in blocks that are set up for the release signal by the release of the adjacent block, and these blocks are all self-resetting.
    • 虚拟多端口RAM(VMPRAM)结构具有自动端口排序和单端口阵列密度和速度。 VMPRAM采用输入触发的自复位宏,采用流水线架构,在一个机器周期内提供多个自定时片上循环。 VMPRAM集成了一个SRAM,分为许多输入触发,自复位,快速循环模块。 定时信号从所选择的SRAM块导出,用于将下一个选择信号和数据释放到SRAM块。 SRAM块输入只是数据输入总线和选择字线和位线对所需的解码信号,SRAM块周期只是为字线和位线提供足够的脉冲宽度所需的时间。 每个SRAM块和访问SRAM块的路径中的所有电路块都是输入触发和自复位。 多个地址和数据输入锁存器在驱动器处被复用到SRAM段的真实和补码总线,这些总线是自复位的。 类似地,所选的SRAM块将数据读出到自复位总线上,并且通过相邻块的释放来将地址和数据输入锁存在用于释放信号的块中,并且这些块都是自复位的。
    • 10. 发明授权
    • SRAM cell with capacitor
    • 带电容器的SRAM单元
    • US5541427A
    • 1996-07-30
    • US162588
    • 1993-12-03
    • Barbara A. ChappellBijan DavariGeorge A. Sai-HalaszYuan Taur
    • Barbara A. ChappellBijan DavariGeorge A. Sai-HalaszYuan Taur
    • G11C11/412H01L27/11H01L27/108
    • G11C11/4125H01L27/1104Y10S257/903
    • A storage latch comprising a gate insulating layer over the substrate, shallow trenches formed through the insulating layer and in the substrate to provide device insulation; and doped regions in the substrate between the shallow trenches. The doped regions define sources and drains. Gate stacks are formed over regions of oxide adjacent the doped regions. A planarized insulator is formed between the gate stacks. Openings are provided in the planarized insulator for contacts to the doped regions and the gate stacks. Conductive material fills the openings to form contacts for the doped regions and for the gate stacks. A patterned layer of conductive material on the planarized insulator connects selected ones of the contacts for wiring portions of the latch. A six device SRAM cell comprises a deep isolation trench formed in the substrate; a first latch including two transistors formed of p-type material on a first side of the trench; a second latch including two transistors formed of n-type material on a second side of the trench opposite the first side of the trench, and connection means for electrically cross wiring the transistors of the first latch to the transistors of the second latch. In forming the latch a self-aligned process for separately forming contacts to diffusion regions and gate stacks on the semiconductor substrate is used.
    • 存储锁存器,包括在所述衬底上的栅极绝缘层,穿过所述绝缘层形成的浅沟槽和所述衬底中的沟槽以提供器件绝缘; 以及在浅沟槽之间的衬底中的掺杂区域。 掺杂区域定义源和漏极。 栅极堆叠形成在与掺杂区域相邻的氧化物区域上。 在栅极堆叠之间形成平坦化的绝缘体。 在平坦化的绝缘体中提供了开口,用于与掺杂区域和栅极叠层的接触。 导电材料填充开口以形成用于掺杂区域和栅极叠层的触点。 平坦化绝缘体上的图案化的导电材料层连接用于闩锁的布线部分的所述触点中的所选择的一个。 六器件SRAM单元包括形成在衬底中的深隔离沟槽; 第一锁存器,包括在所述沟槽的第一侧上由p型材料形成的两个晶体管; 包括在与沟槽的第一侧相对的沟槽的第二侧上由n型材料形成的两个晶体管的第二锁存器以及用于将第一锁存器的晶体管与第二锁存器的晶体管电交叉布线的连接装置。 在形成锁存器时,使用用于单独形成与半导体衬底上的扩散区域和栅极堆叠的接触的自对准工艺。