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1. 发明授权

US09806054B2 Flexible substrate holder, device and method for detaching a first substrate 有权
公开(公告)号：US09806054B2
公开(公告)日：2017-10-31
申请号：US14366990
申请日：2011-12-22
申请人： Markus Wimplinger , Jurgen Burggraf , Gerald Mittendorfer
发明人： Markus Wimplinger , Jurgen Burggraf , Gerald Mittendorfer
IPC分类号： B32B38/10 , H01L23/00 , H01L21/67 , H01L21/687 , B32B43/00 , H01L21/683 , H01L21/66
CPC分类号： H01L24/799 , B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/67092 , H01L21/6835 , H01L21/68707 , H01L21/68721 , H01L21/68785 , H01L22/10 , H01L24/98 , H01L2924/0002 , Y10T156/11 , Y10T156/1168 , Y10T156/1978 , H01L2924/00
摘要： A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.

2. 发明申请

US20150096689A1 FLEXIBLE SUBSTRATE HOLDER, DEVICE AND METHOD FOR DETACHING A FIRST SUBSTRATE 有权
标题翻译：柔性基板保持器，用于拆卸第一基板的装置和方法
公开(公告)号：US20150096689A1
公开(公告)日：2015-04-09
申请号：US14366990
申请日：2011-12-22
申请人： Markus Wimplinger , Jurgen Burggraf , Gerald Mittendorfer
发明人： Markus Wimplinger , Jurgen Burggraf , Gerald Mittendorfer
IPC分类号： H01L23/00 , H01L21/66 , H01L21/683 , B32B43/00
CPC分类号： H01L24/799 , B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/67092 , H01L21/6835 , H01L21/68707 , H01L21/68721 , H01L21/68785 , H01L22/10 , H01L24/98 , H01L2924/0002 , Y10T156/11 , Y10T156/1168 , Y10T156/1978 , H01L2924/00
摘要： A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.
摘要翻译：一种柔性基板安装件，用于在第一基板从第二基板分离时保持第一基板，以及用于通过弯曲第一基板来使第二基板脱粘的分离装置。此外，本发明涉及一种用于在一个拆卸方向（L）上从第二基板分离第一基板的装置，具有以下特征：用于保持第一基板的基板安装件，所述第一基板安装件沿分离方向（L ），作为第一基板弯曲的用于保持第二基板的基板支架和用于从第二基板脱离第一基板的分离装置及其使用方法。

3. 发明授权

US09052422B2 Method and device for producing a microlens 有权
标题翻译：用于生产微透镜的方法和装置
公开(公告)号：US09052422B2
公开(公告)日：2015-06-09
申请号：US13583652
申请日：2010-03-31
申请人： Erich Thallner , Markus Wimplinger , Michael Kast
发明人： Erich Thallner , Markus Wimplinger , Michael Kast
IPC分类号： G02B3/00 , B29D11/00
CPC分类号： B29D11/00375 , G02B3/0031
摘要： This invention relates to a method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method. Furthermore the invention relates to a device for producing a microlens as well as a microlens.
摘要翻译：本发明涉及一种用于制造具有载体晶片的微透镜的方法，其中通过冲压透镜将载体晶片的一个开口中的透镜模制到载体晶片中以及用于执行该方法的相应装置和微透镜这是使用该方法生产的。此外，本发明涉及一种用于生产微透镜以及微透镜的装置。

4. 发明授权

US08763239B2 System for uniform structuring of substrates 有权
标题翻译：衬底均匀结构的系统
公开(公告)号：US08763239B2
公开(公告)日：2014-07-01
申请号：US12266630
申请日：2008-11-07
申请人： Friedrich Paul Lindner , Thomas Glinsner , Markus Wimplinger
发明人： Friedrich Paul Lindner , Thomas Glinsner , Markus Wimplinger
IPC分类号： B23P19/00 , B41L3/02 , B41L3/08 , G01G23/02 , B29C59/02 , G03F7/00
CPC分类号： B29C59/022 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T29/49124 , Y10T29/49815 , Y10T29/49895 , Y10T29/5313 , Y10T29/5317 , Y10T29/53265 , Y10T156/107
摘要： A system for transferring a nanostructure from a die to a flat side of a large-area substrate. The system has a substrate holder that receives the substrate on a substrate receiving surface. A structural surface of the die is oriented parallel to and opposite the substrate receiving surface. An adjusting means receives the substrate holder and adjusts the position of the substrate relative to the die in an x-direction, y-direction and a rotational direction. An actuator device includes at least two separately controllable actuators that each independently imposes a force in a direction orthogonal to the substrate receiving surface. A force measuring cell is in each actuator for measuring the force applied on the die or substrate. The forces, in combination, produce a single, controllable resultant force at a predetermined location. The single, resultant force is orientated in a direction orthogonal to the substrate receiving surface of the substrate holder.
摘要翻译：用于将纳米结构从模具转移到大面积基板的平坦侧的系统。该系统具有在衬底接收表面上接收衬底的衬底保持器。模具的结构表面平行于衬底接收表面并与衬底接收表面相对。调节装置接收衬底保持器并且在x方向，y方向和旋转方向上调整衬底相对于管芯的位置。致动器装置包括至少两个单独可控制的致动器，每个致动器在与基板接收表面正交的方向上独立地施加力。力测量单元位于每个致动器中，用于测量施加在模具或基板上的力。这些力组合在一个预定的位置产生一个可控的合力。单个合成力在与基板保持器的基板接收表面正交的方向上取向。

5. 发明申请

US20140073112A1 METHOD FOR PERMANENTLY BONDING WAFERS 有权
标题翻译：永久粘结方法
公开(公告)号：US20140073112A1
公开(公告)日：2014-03-13
申请号：US14110220
申请日：2011-04-08
申请人： Thomas Plach , Kurt Hingerl , Markus Wimplinger , Christoph Flötgen
发明人： Thomas Plach , Kurt Hingerl , Markus Wimplinger , Christoph Flötgen
IPC分类号： H01L21/20
CPC分类号： H01L21/20 , H01L21/2007 , H01L21/3105 , H01L21/76251
摘要： A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises: forming at least one reservoir in at least one reservoir formation layer on the first substrate and/or the second substrate, the reservoir comprised of an amorphous material, at least partial filling of the reservoir/reservoirs with a first educt or a first group of educts, forming or applying a reaction layer which contains a second educt or a second group of educts to the reservoir and/or the reservoir, the first contact surface making contact with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt or the first group with the second educt or the second group.
摘要翻译：一种用于将第一基板的第一接触表面接合到第二基板的第二接触表面的方法。该方法包括：在第一基板和/或第二基板上的至少一个储层形成层中形成至少一个储存器，储存器由非晶态材料构成，至少部分地填充储存器/储存器与第一流出物或第一组离子，将包含第二喷射或第二组离子的反应层形成或施加到储存器和/或储存器，第一接触表面与第二接触表面接触以形成预先连接的连接，以及在所述第一和第二接触表面之间形成永久性接合，至少部分地通过所述第一溶出物或所述第一组与所述第二溶剂或所述第二组的反应来加强。

6. 发明授权

US08640548B2 Apparatus, device and method for determining alignment errors 有权
标题翻译：用于确定对准误差的装置，装置和方法
公开(公告)号：US08640548B2
公开(公告)日：2014-02-04
申请号：US13512723
申请日：2011-09-07
申请人： Markus Wimplinger
发明人： Markus Wimplinger
IPC分类号： G01B5/30 , G01B7/16 , G01L1/00 , G01N3/00
CPC分类号： H01L21/681 , H01L21/67092 , H01L21/67259
摘要： The invention relates to an apparatus, a device and a method for determining local alignment errors which have occurred due to strain and/or distortion of a first substrate relative to a second substrate when the first substrate is joined to the second substrate and for alignment of two wafers by means of position maps, strain maps and/or stress maps of wafers which are recorded during and/or after alignment of the wafers, especially through at least one transparent region of at least one of the wafers, optionally the relative position of the two wafers to one another being corrected especially in-situ.
摘要翻译：本发明涉及一种用于确定由于第一衬底相对于第二衬底的应变和/或变形而发生的局部对准误差的装置，装置和方法，当第一衬底接合到第二衬底时，在晶片定位期间和/或之后记录的晶片的位置图，应变图和/或应力图，特别是通过至少一个晶片的至少一个透明区域，可选地相对位置相互之间的两个晶片被特别地原位校正。

7. 发明申请

US20130299080A1 METHOD FOR PERMANENT BONDING OF WAFERS 有权
标题翻译：永久粘结方法
公开(公告)号：US20130299080A1
公开(公告)日：2013-11-14
申请号：US13981353
申请日：2011-01-25
申请人： Thomas Plach , Kurt Hingerl , Markus Wimplinger , Christoph Flötgen
发明人： Thomas Plach , Kurt Hingerl , Markus Wimplinger , Christoph Flötgen
IPC分类号： H01L21/70
CPC分类号： H01L24/83 , H01L21/187 , H01L21/2007 , H01L21/70 , H01L21/76251 , H01L24/80 , H01L2224/80907 , H01L2224/83009 , H01L2224/83894 , H01L2224/83907 , H01L2924/01001 , H01L2924/01007 , H01L2924/01008 , H01L2924/01018 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106
摘要： A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.
摘要翻译：根据以下步骤将第一基板的第一接触表面接合到第二接触表面的方法：在所述第一接触表面上的表层中形成储存器，至少部分地用第一接触表面填充所述储存器第一组离散体，使第一接触表面与第二接触表面接触以形成预结合连接，以及在第一和第二接触表面之间形成永久接合，至少部分地通过第一离子流体与包含在第二基板的反应层中的第二喷射。

8. 发明申请

US20120292288A1 METHOD FOR TREATMENT OF A TEMPORARILY BONDED PRODUCT WAFER 有权
标题翻译：用于处理临时粘结产品的方法
公开(公告)号：US20120292288A1
公开(公告)日：2012-11-22
申请号：US13575316
申请日：2010-11-23
申请人： Jürgen Burggraf , Harald Wiesbauer , Markus Wimplinger
发明人： Jürgen Burggraf , Harald Wiesbauer , Markus Wimplinger
IPC分类号： B24B1/00 , C23C16/44 , C23C16/02 , B24B7/20 , B44C1/22
CPC分类号： H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： A method for treatment of a product wafer temporarily bonded on a carrier wafer with the following steps: grinding and/or backthinning of the product wafer on one flat side facing away from the carrier wafer to a product wafer thickness D of
摘要翻译：一种用于处理临时接合在载体晶片上的产品晶片的方法，其步骤如下：在远离载体晶片的一个平坦侧上研磨和/或反向沉积产品晶片到<150μm的产品晶片厚度D，特别是具有减小产品晶片的特别结构固有应力的装置的平坦表面处理<100μm，优选<75μm，甚至更优选<50μm，特别优选<30μm。

9. 发明申请

US20120184069A1 METHOD FOR BONDING OF CHIPS ON WAFERS 有权
标题翻译：用于在晶片上粘接晶片的方法
公开(公告)号：US20120184069A1
公开(公告)日：2012-07-19
申请号：US13496024
申请日：2010-09-03
申请人： Markus Wimplinger
发明人： Markus Wimplinger
IPC分类号： H01L21/78
CPC分类号： H01L21/568 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/3128 , H01L24/08 , H01L24/16 , H01L24/32 , H01L24/74 , H01L24/80 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/50 , H01L2221/68304 , H01L2221/68327 , H01L2221/68331 , H01L2221/68381 , H01L2224/0401 , H01L2224/0557 , H01L2224/08225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/74 , H01L2224/7598 , H01L2224/80006 , H01L2224/80065 , H01L2224/80075 , H01L2224/80205 , H01L2224/80805 , H01L2224/80815 , H01L2224/8082 , H01L2224/80907 , H01L2224/81 , H01L2224/81005 , H01L2224/81065 , H01L2224/81075 , H01L2224/81205 , H01L2224/81805 , H01L2224/81815 , H01L2224/8182 , H01L2224/81907 , H01L2224/83005 , H01L2224/83065 , H01L2224/83075 , H01L2224/83205 , H01L2224/83805 , H01L2224/83815 , H01L2224/8382 , H01L2224/83907 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06568 , H01L2924/00014 , H01L2924/0002 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15738 , H01L2224/80 , H01L2224/83 , H01L2924/01014 , H01L2924/00 , H01L2224/05552
摘要： Method for bonding of a plurality of chips onto a base wafer which contains chips on the front, the chips being stacked in at least one layer on the back of the base wafer and electrically conductive connections are established between the vertically adjacent chips, with the following steps: a) fixing of the front of the base wafer on a carrier, b) placing at least one layer of chips in defined positions on the back of the base wafer, and c) heat treatment of the chips on the base wafer fixed on the carrier, characterized in that prior to step c) at least partial separation of the chips of the base wafer into separated chip stack sections of the base after takes place.
摘要翻译：将多个芯片接合到包含前面的芯片的基底晶片上的方法，将芯片堆叠在基底晶片的背面上的至少一层中，并且在垂直相邻的芯片之间建立导电连接，具有以下步骤：a）将基底晶片的前部固定在载体上，b）将至少一层芯片放置在基底晶片的背面上的限定位置，以及c）将固定在基底晶片上的基片上的芯片进行热处理载体，其特征在于，在步骤c）之前，在发生基底晶片的芯片至少部分分离成基底的分离的芯片堆叠部分之后。

10. 发明申请

US20110045185A1 DEVICE FOR EMBOSSING OF SUBSTRATES 有权
标题翻译：基片破裂装置
公开(公告)号：US20110045185A1
公开(公告)日：2011-02-24
申请号：US12858509
申请日：2010-08-18
申请人： Friedrich Paul Lindner , Thomas Glinsner , Markus Wimplinger
发明人： Friedrich Paul Lindner , Thomas Glinsner , Markus Wimplinger
IPC分类号： B05D3/12 , B05C11/00 , B28B11/08
CPC分类号： B29C59/026 , B29C59/022 , B29C71/04 , B29C2059/023 , B29K2105/24 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of: at least one receiving means for holding the substrate in a working space, a calibration means located at least partially in the working space for calibration of the substrate, an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.
摘要翻译：本发明涉及一种用于压花衬底，特别是半导体衬底或晶片的装置，包括：用于将衬底保持在工作空间中的至少一个接收装置，至少部分地位于工作空间中用于校准衬底的校准装置至少部分地位于所述工作空间中的压花装置，用于在压花过程中将所述结构材料压花到所述基材上，所述工作空间在压花过程之前和期间暴露于限定的气氛下，而不中断;以及一种方法，基材压花。

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