专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08890203B2 LED module 有权
标题翻译： LED模块
公开(公告)号：US08890203B2
公开(公告)日：2014-11-18
申请号：US13695206
申请日：2011-04-28
申请人： Masahiko Kobayakawa
发明人： Masahiko Kobayakawa
IPC分类号： H01L33/00 , H01L33/64 , H01L33/62
CPC分类号： H01L33/641 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/45144 , H01L2224/48465 , H01L2224/73265 , H01L2924/01322 , H01L2924/00
摘要： A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1. An LED unit 3 includes an LED chip 30 with a electrode terminal 31 connected to the lead 1 and another electrode terminal 32 connected to the lead 2. The LED unit 3, mounted on a surface of the die-bonding portion 11 on a first side in z direction, overlaps the opening 11a. A wire 52 connects the lead 2 and the electrode terminal 32. A support member 4 supporting the leads 1-2 is held in contact with another surface of the die-bonding portion 11 on a second side in z direction. These arrangements ensure efficient heat dissipation from the LED chip 30 and efficient use of light emitted from the LED chip 3.
摘要翻译：引线1包括具有沿厚度方向贯通的开口11a的芯片接合部11。另一个引线2与引线1间隔开.LED单元3包括具有连接到引线1的电极端子31的LED芯片30和连接到引线2的另一个电极端子32.LED单元3安装在在z方向上的第一侧的芯片接合部分11与开口11a重叠。线52连接引线2和电极端子32.支撑引线1-2的支撑部件4在z方向的第二侧上与芯片接合部分11的另一个表面保持接触。这些布置确保了LED芯片30的有效散热和从LED芯片3发射的光的有效利用。

2. 发明授权

US08723215B2 LED module 有权
标题翻译： LED模块
公开(公告)号：US08723215B2
公开(公告)日：2014-05-13
申请号：US13397110
申请日：2012-02-15
申请人： Masahiko Kobayakawa
发明人： Masahiko Kobayakawa
IPC分类号： H01L33/36
CPC分类号： H01L33/62 , H01L24/48 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00 , H01L2924/00014 , H01L2924/3011 , H01L2224/05599 , H01L2224/85399
摘要： A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.
摘要翻译： LED模块包括基板，支撑在基板上的LED芯片，安装在基板上的金属布线，金属布线包括安装有LED芯片的安装部分，封装树脂，用于覆盖LED芯片和金属布线和覆盖构件，其被构造成覆盖金属布线以暴露安装部分，封装树脂布置成覆盖包层构件。

3. 发明申请

US20130027930A1 LED MODULE 有权
标题翻译： LED模块
公开(公告)号：US20130027930A1
公开(公告)日：2013-01-31
申请号：US13640177
申请日：2011-04-27
申请人： Masahiko Kobayakawa , Hidekazu Toda
发明人： Masahiko Kobayakawa , Hidekazu Toda
IPC分类号： F21V21/00 , F21V7/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00
摘要： An LED module 100 includes LED chips 21, 22 spaced apart from each other, and an LED chip 23 offset from a straight line connecting the LED chips 21 and 22 and located between the LSD chips 21, 22 in the direction in which the LED chips 21, 22 are spaced. The module further includes a lead 31 with a bonding portion 31a and a mounting terminal surface 31d, a lead 32 with at bonding portion 32a and a mounting terminal surface 32d, and a lead 33 with a bonding portion 33a and a mounting terminal surface 33d. The mounting terminal surfaces 31d, 32d, 33d are flush with each other. Light from the LED chips 21, 22, 23 is emitted in the direction in which the mounting terminal surfaces 31d, 32d and 33d extend. Thus, light of different colors properly mixed can be emitted from a compact LED module.
摘要翻译： LED模块100包括彼此间隔开的LED芯片21,22，以及从连接LED芯片21和22的直线偏移并位于LSD芯片21,22之间的LED芯片23，LED芯片 21,22间隔开。该模块还包括具有接合部分31a和安装端子表面31d的引线31，具有接合部分32a的引线32和安装端子表面32d，以及具有接合部分33a和安装端子表面33d的引线33。安装端子表面31d，32d，33d彼此齐平。来自LED芯片21,22,23的光沿安装端子面31d，32d，33d延伸的方向发射。因此，可以从紧凑的LED模块发射适当混合的不同颜色的光。

4. 发明授权

US08334548B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US08334548B2
公开(公告)日：2012-12-18
申请号：US12593836
申请日：2008-03-25
申请人： Masahiko Kobayakawa
发明人： Masahiko Kobayakawa
IPC分类号： H01L33/00 , H01L23/495 , H01L23/34
CPC分类号： H01L33/486 , H01L25/167 , H01L33/62 , H01L33/647 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor light emitting device (A) includes a lead frame (1) having a constant thickness, a semiconductor light emitting element (2) supported by the lead frame (1), a case (4) covering part of the lead frame (1) and a light transmitting member (5) covering the semiconductor light emitting element (2). The lead frame (1) includes a die bonding pad (11a) and an elevated portion (11b). The die bonding pad (11a) includes an obverse surface on which the semiconductor light emitting element (2) is mounted, and a reverse surface exposed from the case (4). The elevated portion (11b) is shifted in position from the die bonding pad (11a) in the direction normal to the obverse surface of the die bonding pad (11a).
摘要翻译：半导体发光器件（A）包括具有恒定厚度的引线框架（1），由引线框架（1）支撑的半导体发光元件（2），覆盖引线框架（1）的一部分的壳体（4））和覆盖半导体发光元件（2）的透光构件（5）。引线框架（1）包括芯片接合焊盘（11a）和升高部分（11b）。芯片接合焊盘（11a）包括安装有半导体发光元件（2）的正面和从壳体（4）露出的反面。升降部分（11b）在垂直于芯片接合焊盘（11a）的正面的方向上从芯片接合焊盘（11a）移位。

5. 外观设计

USD663703S1 Light emitting diode module 有权
公开(公告)号：USD663703S1
公开(公告)日：2012-07-17
申请号：US29399069
申请日：2011-08-09
申请人： Masahiko Kobayakawa , Takashi Moriguchi
设计人： Masahiko Kobayakawa , Takashi Moriguchi

6. 发明授权

US08154045B2 Semiconductor light-emitting device 有权
标题翻译：半导体发光装置
公开(公告)号：US08154045B2
公开(公告)日：2012-04-10
申请号：US12890964
申请日：2010-09-27
申请人： Masahiko Kobayakawa
发明人： Masahiko Kobayakawa
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L23/49541 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
摘要翻译：半导体发光装置包括引线框架，安装在接合区域的顶表面上的半导体发光元件和引线框架的覆盖部分的壳体。接合区域的底面暴露于外壳外。引线框架包括从接合区域延伸的薄延伸部，并且具有与接合区域的顶表面齐平的顶表面。薄延伸部具有从接合区域的底面向接合区域的上表面偏移的底面。

7. 发明授权

US08148746B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US08148746B2
公开(公告)日：2012-04-03
申请号：US12443295
申请日：2007-09-27
申请人： Masahiko Kobayakawa
发明人： Masahiko Kobayakawa
IPC分类号： H01L33/00 , H01L29/18
CPC分类号： H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/01079 , H01L2924/00014
摘要： A semiconductor light emitting device (A1) includes a case (1) and a plurality of semiconductor light emitting elements (3) arranged in the case. The case (1) is formed with a plurality of reflectors (11) each in the form of a truncated cone surrounding a respective one of the semiconductor light emitting elements (3). Current is applied to each of the semiconductor light emitting elements (3) via two wires (6). Each of the wires (6) includes a first end, and a second end opposite to the first end. The first end is connected to the semiconductor light emitting element (3), whereas the second end is located outside the space surrounded by the reflector (11).
摘要翻译：半导体发光器件（A1）包括壳体（1）和布置在壳体中的多个半导体发光元件（3）。壳体（1）形成有围绕相应的一个半导体发光元件（3）的截头圆锥形状的多个反射器（11）。电流通过两条导线（6）施加到每个半导体发光元件（3）。每个电线（6）包括第一端和与第一端相对的第二端。第一端连接到半导体发光元件（3），而第二端位于由反射器（11）包围的空间的外部。

8. 发明授权

US07868334B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US07868334B2
公开(公告)日：2011-01-11
申请号：US12080966
申请日：2008-04-08
申请人： Yasunori Hata , Masahiko Kobayakawa
发明人： Yasunori Hata , Masahiko Kobayakawa
IPC分类号： H01L27/15
CPC分类号： H05K3/3426 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K2201/09954 , H05K2201/10106 , Y02P70/613 , H01L2924/00014
摘要： A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.
摘要翻译：半导体发光器件包括半导体发光元件，与半导体发光元件电连接的引线以及覆盖半导体发光元件和引线的一部分的树脂封装。树脂封装包括面向半导体发光元件的透镜。引线包括未被树脂封装覆盖的暴露部分。暴露部分包括第一部分和第二部分，其中第一部分具有沿着透镜的光轴向后定向的第一安装表面，并且第二部分具有垂直于透镜的光轴定向的第二安装表面。

9. 发明申请

US20100171730A1 DISPLAY 审中-公开
标题翻译：显示
公开(公告)号：US20100171730A1
公开(公告)日：2010-07-08
申请号：US12602043
申请日：2008-05-28
申请人： Masahiko Kobayakawa , Hiroki Ishinaga
发明人： Masahiko Kobayakawa , Hiroki Ishinaga
IPC分类号： G06F3/038 , G02F1/13357
CPC分类号： G02B5/201 , G02F1/133514 , G02F1/133603 , G02F1/133609 , G02F2001/133624 , H01L2224/97
摘要： A display (A) includes a light source unit (1) for illuminating a planar region and a plurality of filter elements arranged in a matrix. Each of the filter elements transmits light emitted from the light source unit (1) and having a wavelength lying within a predetermined range. The light source unit (1) includes a plurality of semiconductor light emitting devices (2) arranged in a matrix on a common board. Each of the semiconductor light emitting devices (2) is adapted to emit white light including three wavelength peaks lying in a blue range, a green range and a red range, respectively.
摘要翻译：显示器（A）包括用于照亮平面区域的光源单元（1）和以矩阵布置的多个滤光元件。每个滤光元件透射从光源单元（1）发射的光并且具有在预定范围内的波长。光源单元（1）包括在公共板上以矩阵布置的多个半导体发光器件（2）。每个半导体发光器件（2）适于发射包括分别在蓝色范围，绿色范围和红色范围内的三个波长峰值的白光。

10. 外观设计

USD597970S1 Light emitting diode module 有权
公开(公告)号：USD597970S1
公开(公告)日：2009-08-11
申请号：US29310811
申请日：2008-09-11
申请人： Masahiko Kobayakawa , Kazuhiro Mireba
设计人： Masahiko Kobayakawa , Kazuhiro Mireba

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式