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1. 发明授权

US09313710B2 Wireless base station apparatus and communication control method 有权
标题翻译：无线基站装置和通信控制方法
公开(公告)号：US09313710B2
公开(公告)日：2016-04-12
申请号：US14007443
申请日：2012-04-24
申请人： Masahiko Nanri , Harunobu Sato
发明人： Masahiko Nanri , Harunobu Sato
IPC分类号： H04W4/00 , H04W36/20 , H04W52/02 , H04W52/36 , H04W52/24 , H04W52/50 , H04W76/04 , H04W36/16
CPC分类号： H04W36/20 , H04W36/165 , H04W52/0206 , H04W52/244 , H04W52/367 , H04W52/50 , H04W76/27 , Y02D70/1262
摘要： Provided are a wireless base station apparatus and communication control method whereby a peripheral terminal device immediately hands over to a base station apparatus when said base station apparatus is activated. In response to timer values and the number of terminal units within a coverage area, a controller (504) of an MeNB (500) selects a dormant mode, activation mode or stationary mode for the base station itself and notifies an uplink received signal determiner (505) and transmission power determiner (506) of the selected mode information. In activation mode, the uplink received signal determiner (505) sets the timing for initial connection signals more frequently than dormant mode. In activation mode, the transmission power determiner (506) determines the increase in downlink transmission power over time and notifies the downlink transmission signal processor (507) of the transmission power.
摘要翻译：提供一种无线基站装置和通信控制方法，其中当所述基站装置被激活时，外围终端装置立即切换到基站装置。响应于定时器值和覆盖区域内的终端单元的数量，MeNB（500）的控制器（504）选择用于基站本身的休眠模式，激活模式或固定模式，并通知上行链路接收信号确定器（ 505）和所选择的模式信息的发送功率确定器（506）。在激活模式中，上行链路接收信号确定器（505）比起休眠模式更频繁地设置初始连接信号的定时。在激活模式中，发送功率确定器（506）确定随时间的下行链路传输功率的增加，并向下行链路传输信号处理器（507）通知传输功率。

2. 发明申请

US20140016615A1 WIRELESS BASE STATION APPARATUS AND COMMUNICATION CONTROL METHOD 有权
标题翻译：无线基站装置和通信控制方法
公开(公告)号：US20140016615A1
公开(公告)日：2014-01-16
申请号：US14007443
申请日：2012-04-24
申请人： Masahiko Nanri , Harunobu Sato
发明人： Masahiko Nanri , Harunobu Sato
IPC分类号： H04W36/20
CPC分类号： H04W36/20 , H04W36/165 , H04W52/0206 , H04W52/244 , H04W52/367 , H04W52/50 , H04W76/27 , Y02D70/1262
摘要： Provided are a wireless base station apparatus and communication control method whereby a peripheral terminal device immediately hands over to a base station apparatus when said base station apparatus is activated. In response to timer values and the number of terminal units within a coverage area, a controller (504) of an MeNB (500) selects a dormant mode, activation mode or stationary mode for the base station itself and notifies an uplink received signal determiner (505) and transmission power determiner (506) of the selected mode information. In activation mode, the uplink received signal determiner (505) sets the timing for initial connection signals more frequently than dormant mode. In activation mode, the transmission power determiner (506) determines the increase in downlink transmission power over time and notifies the downlink transmission signal processor (507) of the transmission power.
摘要翻译：提供一种无线基站装置和通信控制方法，其中当所述基站装置被激活时，外围终端装置立即切换到基站装置。响应于定时器值和覆盖区域内的终端单元的数量，MeNB（500）的控制器（504）选择用于基站本身的休眠模式，激活模式或固定模式，并通知上行链路接收信号确定器（ 505）和所选择的模式信息的发送功率确定器（506）。在激活模式中，上行链路接收信号确定器（505）比起休眠模式更频繁地设置初始连接信号的定时。在激活模式中，发送功率确定器（506）确定随时间的下行链路传输功率的增加，并向下行链路传输信号处理器（507）通知传输功率。

3. 发明授权

US07329944B2 Leadframe for semiconductor device 有权
标题翻译：半导体器件引线框
公开(公告)号：US07329944B2
公开(公告)日：2008-02-12
申请号：US11386920
申请日：2006-03-22
申请人： Kazumitsu Seki , Harunobu Sato , Muneaki Kure
发明人： Kazumitsu Seki , Harunobu Sato , Muneaki Kure
IPC分类号： H01L23/495
CPC分类号： H01L23/49582 , H01L2924/00014 , H01L2924/0002 , H01L2224/45099 , H01L2924/00
摘要： A leadframe for a semiconductor device of the present invention is a leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to the inner lead section. The leadframe has (1) a nickel (Ni) layer 1, (2) a palladium (Pd) or palladium alloy layer 2, (3) a tin (Sn) or tin alloy layer or a zinc (Zn) or zinc alloy layer 3, 3a, or 3b, and (4) a gold (Au) layer 4, 4a, or 4b, all of which are formed on a base material B forming the leadframe in sequence from the surface of the leadframe.
摘要翻译：本发明的半导体装置的引线框架是具有半导体芯片安装台阶部的半导体装置的引线框架，与台部连接的内引线部以及与内引线连接的外引线部部分。引线框具有（1）镍（Ni）层1，（2）钯（Pd）或钯合金层2，（3）锡（Sn）或锡合金层或锌（Zn）或锌合金层 3，3a或3b，以及（4）金（Au）层4,4a或4b，它们都从形成引线框架的基材B形成，从引线框架的表面开始。

4. 发明授权

US06593643B1 Semiconductor device lead frame 有权
标题翻译：半导体器件引线框架
公开(公告)号：US06593643B1
公开(公告)日：2003-07-15
申请号：US09719329
申请日：2000-12-07
申请人： Kazumitsu Seki , Takashi Yoshie , Harunobu Sato
发明人： Kazumitsu Seki , Takashi Yoshie , Harunobu Sato
IPC分类号： H01L23532
CPC分类号： H01L23/49582 , H01L24/48 , H01L2224/05599 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/181 , Y10T29/49172 , Y10T29/4922 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device lead frame made of copper or a copper alloy used for a resin sealing type semiconductor device, comprising a lead frame body made of copper or a copper alloy, a double-layer under plating film formed on the lead frame body and comprising a lower layer made of zinc or a copper-zinc alloy and an upper layer made of copper having a thickness of 0.02 to 0.4 &mgr;m and a precious metal plating film formed on at least a wire bonding portion of an inner lead of the copper upper layer of the under plating film. This lead frame is excellent in adhesion with a sealing resin, is free from contaminate a precious metal plating solution (particularly a silver plating solution), has a good appearance of the precious metal plating film, is excellent in corrosion resistance and moisture resistance, and has a good appearance and adhesion of an external solder plating film.
摘要翻译：一种用于树脂密封型半导体器件的由铜或铜合金制成的半导体器件引线框架，包括由铜或铜合金制成的引线框体，形成在引线框体上的双层下镀膜，由锌或铜 - 锌合金制成的下层和厚度为0.02至0.4μm的铜制上层和形成在铜上层的内部引线的至少引线接合部分上的贵金属电镀膜下镀膜。该引线框与密封树脂的密合性优异，不会污染贵金属电镀液（特别是银镀液），具有良好的贵金属镀膜外观，耐腐蚀性和耐湿性优异，具有良好的外观和附着力的外部焊料镀膜。

5. 发明授权

US07190057B2 Packaging component and semiconductor package 有权
标题翻译：封装元件和半导体封装
公开(公告)号：US07190057B2
公开(公告)日：2007-03-13
申请号：US10835007
申请日：2004-04-30
申请人： Kazumitsu Seki , Takashi Yoshie , Harunobu Sato , Yoshihito Miyahara
发明人： Kazumitsu Seki , Takashi Yoshie , Harunobu Sato , Yoshihito Miyahara
IPC分类号： H01L23/02
CPC分类号： H01L23/49582 , C25D5/02 , C25D5/12 , C25D7/12 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48639 , H01L2224/48664 , H01L2224/73204 , H01L2224/73253 , H01L2224/85439 , H01L2224/85464 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/16152 , H01L2924/181 , H01L2924/18301 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A packaging component used for constituting a package mounting a semiconductor element, and a semiconductor package using the packaging component. The packaging component has on at least a portion of the surface thereof a covered surface which is sealed with an insulating resin or on which an adhesive layer is applied, and the packaging component comprises a conductor substrate and an electrically conducting layer partly or entirely covering the surface thereof, and the electrically conducting layer comprises a rough-surface plated layer having a roughened surface profile on the covered surface. The packaging component includes, for example, a lead frame and a heat-radiating or heat-dissipating plate.
摘要翻译：用于构成安装半导体元件的封装的封装部件和使用该封装部件的半导体封装。包装部件在其表面的至少一部分上具有用绝缘树脂密封的覆盖表面或其上施加有粘合剂层的包覆部件，并且包装部件包括导体基板和导电层，部分或全部覆盖表面，并且导电层包括在被覆表面上具有粗糙表面轮廓的粗糙表面镀层。包装部件包括例如引线框架和散热或散热板。

6. 发明申请

US20060214272A1 Leadframe for semiconductor device 有权
标题翻译：半导体器件引线框
公开(公告)号：US20060214272A1
公开(公告)日：2006-09-28
申请号：US11386920
申请日：2006-03-22
申请人： Kazumitsu Seki , Harunobu Sato , Muneaki Kure
发明人： Kazumitsu Seki , Harunobu Sato , Muneaki Kure
IPC分类号： H01L23/495
CPC分类号： H01L23/49582 , H01L2924/00014 , H01L2924/0002 , H01L2224/45099 , H01L2924/00
摘要： A leadframe for a semiconductor device of the present invention is a leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to the inner lead section. The leadframe has (1) a nickel (Ni) layer 1, (2) a palladium (Pd) or palladium alloy layer 2, (3) a tin (Sn) or tin alloy layer or a zinc (Zn) or zinc alloy layer 3, 3a, or 3b, and (4) a gold (Au) layer 4, 4a, or 4b, all of which are formed on a base material B forming the leadframe in sequence from the surface of the leadframe.
摘要翻译：本发明的半导体装置的引线框架是具有半导体芯片安装台阶部的半导体装置的引线框架，与台部连接的内引线部以及与内引线连接的外引线部部分。引线框具有（1）镍（Ni）层1，（2）钯（Pd）或钯合金层2，（3）锡（Sn）或锡合金层或锌（Zn）或锌合金层 3，3a或3b，以及（4）金（Au）层4,4a或4b，它们都从形成引线框架的基材B形成，从引线框架的表面开始。

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