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    • 3. 发明申请
    • COPPER ALLOY PLATE AND METHOD FOR PRODUCING SAME
    • 铜合金板及其制造方法
    • US20100132851A1
    • 2010-06-03
    • US12624472
    • 2009-11-24
    • Weilin GaoHisashi SudaHiroto NariedaAkira Sugawara
    • Weilin GaoHisashi SudaHiroto NariedaAkira Sugawara
    • C22F1/08C22C9/02C22C9/04C22C9/06C22C9/00
    • C22C9/00C22F1/08H01L2924/0002H01L2924/00
    • A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.
    • 铜合金的片材具有包含1.2〜5.0重量%的钛,余量为铜和不可避免的杂质的化学组成,该材料的平均结晶粒径为5〜25μm,(最大结晶粒径 - 最小值) 晶粒尺寸)/(平均晶粒尺寸)为0.20以下,假设平均值的最大值,最小值和平均值均为多个区域中的相应一个区域中的晶粒尺寸的平均值, 分别选自具有相同形状和大小的片材的表面,分别为最大,最小和平均晶粒尺寸,并且具有满足I {420} / I0 {420}的晶体取向的材料, > 1.0,假设材料表面的{420}晶面上的X射线衍射强度和纯铜的标准粉末分别为I {420}和I0 {420}。
    • 6. 发明授权
    • Process for producing connector copper alloys
    • 生产连接器铜合金的工艺
    • US06627011B2
    • 2003-09-30
    • US09910730
    • 2001-07-23
    • Akira SugawaraKazuki HatakeyamaLe Ling
    • Akira SugawaraKazuki HatakeyamaLe Ling
    • C22F108
    • C22C9/04
    • Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0≦0.25X+Y≦8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting and cooling over the range from the liquidus line to 600° C. at a rate of at least 50° C./min; the ingot is hot rolled at a temperature not higher than 900° C. and then subjected to repeated cycles of cold rolling and annealing at 300-650° C. to control the size of crystal grains, thereby producing a rolled strip having a 0.2% yield strength of at least 600 N/mm2, a tensile strength of at least 650 N/mm2, an electrical conductivity of at least 20% IACS, a Young's modulus of no more than 120 kN/mm2 and a percent stress relaxation of no more than 20%.
    • 具有基本组成为Cu-Zn-Sn的铜合金含有23-28重量%的Zn和0.3-1.8重量%的Sn,满足关系6.0 <= 0.25X + Y <= 8.5(其中X是以重量%计的Zn, Y为添加重量%的Sn)。 通过在液相线至600℃的范围内以至少50℃/ min的速率熔融和冷却将合金铸造成锭; 将锭在不高于900℃的温度下热轧,然后在300-650℃下进行冷轧和退火的重复循环,以控制晶粒的尺寸,由此制造具有0.2% 屈服强度至少为600N / mm 2,拉伸强度为至少650N / mm 2,电导率为至少20%IACS,杨氏模量不超过120kN / mm 2 >百分比应力松弛不超过20%。